进入2026年，热管理技术已不再局限于传统的"散热"，它成为了制约算力突破、能源效率与产品可靠性的核心命脉。随着AI大规模算力集群、智能汽车、半 导体、深空/低空飞行器等前沿领域的跨越式发展，行业对热管理方案的精准度与能效比提出了近乎苛刻的要求。基于此， " 洞见热管理2026 " 系列活动 将以" 上海+深圳 " 双展联动模式 ，搭建起贯穿产、学、研、用的全产业链对接平台，旨在汇聚全球智慧，攻克温控难题，定义新一代热力平衡标准。 01 6月10日 上海站：未来产业之基！聚焦液冷板、芯片与功率器件热管理 2026未来产业新材料博览会 （FINE2026） 将于 6月10-12日 在上海新国际博览中心隆重举行。上海站规模宏大展出面积达 50,000平方米（N1-N5） ， 300+场 战略与前沿科技报告， 预计吸引超过10万+名专业观众。 同期 N2馆 特设 "2026热管理液冷板产业展"与"AI芯片及功率器件热管理展区" ，聚焦高热流密度场景下的工程难题。（ 可点击下方图片超链接查看详细介绍 ） | FINE 2026 × Ind iTher M | 中国未来产业崛起引领全球新材料创新发展 | | | | - ...

Core Insights - The article emphasizes that thermal management technology is crucial for breakthroughs in computing power, energy efficiency, and product reliability, especially in advanced fields like AI, smart vehicles, and semiconductors [2] - The "洞见热管理2026" series aims to create a comprehensive platform for industry, academia, research, and application to address thermal control challenges and establish new thermal balance standards [2] Group 1: Event Overview - The 2026 Future Industry New Materials Expo (FINE2026) will take place from June 10-12 at the Shanghai New International Expo Center, featuring an exhibition area of 50,000 square meters and over 300 strategic and cutting-edge technology reports, expecting to attract more than 100,000 professional visitors [3] - The Shanghai event will focus on high heat flux density scenarios, showcasing liquid cooling plates, AI chips, and power device thermal management [6] Group 2: Shanghai Event Highlights - The Shanghai exhibition will emphasize the integration of the Yangtze River Delta industrial cluster, particularly in data centers, new energy vehicles, semiconductors, energy storage systems, and large power facilities [8] - Key topics will include battery thermal management under high-power fast charging, automotive-grade power module cooling, and industrial-grade heat exchange solutions aimed at carbon neutrality [8] Group 3: Shenzhen Event Overview - The seventh Thermal Management Industry Conference and Expo (iTherM2026) will be held in Shenzhen in December 2026, focusing on the flexibility of technology and rapid market response [9] - The Shenzhen event will address the thermal challenges of miniaturized and integrated electronic devices and chips, providing a one-stop value connection platform for the thermal management industry [9] Group 4: Shenzhen Event Highlights - The Shenzhen exhibition will spotlight AI computing servers, smartphones, wearable devices, and low-altitude economy sectors, showcasing immersion cooling technology and new thermal interface materials for compact spaces [11] - The event aims to facilitate the commercialization of innovative technologies and provide a platform for startups and tech giants to showcase their ideas [11] Group 5: Previous Event Recap - The 2025 Shenzhen Thermal Management Expo featured numerous companies presenting new materials, processes, and system-level cooling solutions, attracting significant engagement from engineers and professionals [12] - The event successfully transitioned from "display" to "connection," highlighting the importance of industry collaboration and the rapid generation of cooperation intentions [16]

进入2026年，热管理技术已不再局限于传统的"散热"，它成为了制约算力突破、能源效率与产品可靠性的核心命脉。随着AI大规模算力集群、智能汽车、半 导体、深空/低空飞行器等前沿领域的跨越式发展，行业对热管理方案的精准度与能效比提出了近乎苛刻的要求。基于此， " 洞见热管理2026 " 系列活动 将以" 上海+深圳 " 双展联动模式 ，搭建起贯穿产、学、研、用的全产业链对接平台，旨在汇聚全球智慧，攻克温控难题，定义新一代热力平衡标准。 01 6月10日 上海站：未来产业之基！聚焦液冷板、芯片与功率器件热管理 2026未来产业新材料博览会 （FINE2026） 将于 6月10-12日 在上海新国际博览中心隆重举行。上海站规模宏大展出面积达 50,000平方米（N1-N5） ， 300+场 战略与前沿科技报告， 预计吸引超过10万+名专业观众。 同期 N2馆 特设 "2026热管理液冷板产业展"与"AI芯片及功率器件热管理展区" ，聚焦高热流密度场景下的工程难题。（ 可点击下方图片超链接查看详细介绍 ） | FINE 2026 × Ind iTher M | 中国未来产业崛起引领全球新材料创新发展 | | | | - ...