Core Insights - Intel's Jaguar Shores AI product line is in talks with ASIC design firm Wistron NeWeb Corporation to develop customized AI solutions, with completion expected in the first half of 2026 [1][2] - Intel has shifted its AI strategy to focus on annual product updates and has introduced the Xe3P architecture "Crescent Island" AI chip to enhance its competitive stance in the AI market [1] - Wistron NeWeb Corporation, a fabless ASIC design service provider, is collaborating with Amazon on the Trainium series AI chips, indicating its capability in the ASIC market [2] Group 1 - Intel's AI strategy has evolved from focusing solely on "inference" to a broader approach, responding to the growing AI market [1] - The collaboration with Wistron NeWeb is seen as a strategic move for Intel, leveraging Wistron's expertise in ASIC design and manufacturing to alleviate Intel's development burdens [2] - The Jaguar Shores product line is anticipated to launch in 2026, with a reasonable timeline for mass production suggested for the second half of that year [2] Group 2 - Wistron Neweb plays a dual role as a design and manufacturing partner, outsourcing actual wafer fabrication to companies like TSMC while focusing on critical processes such as chip integration and testing [2] - The partnership with Wistron Neweb is expected to provide Intel with a competitive edge in developing more powerful AI products as the industry matures [2] - The collaboration reflects a trend where established companies like Intel seek partnerships with specialized firms to enhance their product offerings in the rapidly evolving AI landscape [2]

Core Viewpoint - Samsung Electronics is set to supply 12-layer HBM3E to Broadcom, with plans for mass production starting as early as the second half of this year to next year, aiming to mitigate the impact of NVIDIA's HBM supply delays [1][3]. Group 1: Supply Agreements - Samsung has completed quality testing for HBM3E 12-layer with Broadcom and is negotiating supply volumes estimated between 12 billion to 14 billion Gb, with mass production expected soon [1]. - Samsung is also in active discussions to supply HBM3E 12-layer memory to Amazon Web Services (AWS), which plans to produce the next generation AI semiconductor "Trainium 3" using this memory [2]. Group 2: Market Dynamics - The surge in development of proprietary ASICs by major tech companies presents an opportunity for Samsung to offset the downturn in its HBM business [3]. - Samsung's initial plan to supply NVIDIA with HBM3E 12-layer was delayed due to performance issues, and the company is now adjusting its production rates for HBM3E lines [3]. Group 3: Production Goals - Samsung aims to double its total HBM supply to between 8 billion to 9 billion GB this year, compared to last year [1]. - The successful supply to NVIDIA and acquisition of more ASIC clients in the second half of this year is crucial for stabilizing Samsung's HBM business [3].