Group 1 - The core material for advanced AI industry chip interconnection and cooling facilities is copper, due to its excellent conductivity and thermal properties [2] - The transition of copper-based materials towards high added value is accelerating [2] - The company has a solid customer base and technical reserves in the chip computing power sector, with its high-precision non-oxygen copper busbar products applied in top-tier GPU cooling solutions globally [2] Group 2 - The company's self-developed copper heat pipes and liquid-cooled copper pipes are being supplied in bulk to several leading companies' computing server products [2] - The company will closely monitor and follow the market demand in the chip computing power field to further enhance its product lineup and competitive advantages [2]

Morning session notice 早盘提示 更多精彩内容请关注格林大华期货官方微信 研究员：张毅驰 从业资格：F03108196 交易咨询资格：Z0021480 联系方式：15018531496 | 板块 | 品种 | 多（空） | 推荐理由 【行情复盘】 | | --- | --- | --- | --- | | | | | 沪铜主力合约 CU2601 夜盘收盘价 87050 元/吨，较上一交易日夜盘收盘价下跌 0.0 5%。沪铜次主力合约 CU2602 夜盘收于 87080 元/吨，跌幅 0.05%。截止北京时间 2 | | | | | 06:00，COMEX 铜主力合约 收盘价为 美元/磅（按汇率 025-11-28 HGZ25E 5.1155 | | | | | 7.0806 换算为 79852 元/吨），感恩节休市中。LME 铜主力合约 CA03ME 收于 1093 | | | | | 0 美元/吨（按汇率 7.0806 换算为 77391 元/吨），跌幅 0.21%。 | | | | | 【重要资讯】 | | | | | 1、11 月 27 日，国家统计局数据，1-10 月有色金属冶炼 ...

Core Insights - JinTian Co., Ltd. emphasizes the importance of copper as a core material in advanced AI industry chip interconnection and heat dissipation facilities due to its excellent conductivity and thermal properties [2] - The company has a solid customer base and technical reserves in the chip computing power sector, with its high-precision non-oxygen copper busbar products already applied in several top-tier GPU cooling solutions globally [2] - JinTian Co., Ltd. plans to closely monitor market demand in the chip computing power field and further enhance its product lineup to improve competitive advantages [2]

Core Insights - The development of the AI industry has significantly increased the demand for chip computing power, positioning copper as a core material for advanced chip interconnection and heat dissipation due to its excellent conductivity and thermal properties [1] Company Overview - The company has a solid customer base and technical reserves in the chip computing power sector, being one of the earliest companies globally to provide copper-based materials in bulk to leading enterprises in this field [1] - The company's high-precision shaped oxygen-free copper busbar products, known for their high thermal conductivity and excellent welding and processing performance, have been successfully mass-produced in new AI cooling structures [1] - Strategic partnerships have been established with several top-tier cooling module companies, with applications in multiple high-end GPU cooling solutions [1] - The company has independently developed copper heat pipes and liquid-cooled copper pipes, which have been successfully integrated into the products of several leading enterprises in the computing server market [1]

Core Insights - Jintian Co., Ltd. has successfully mass-produced high-precision, non-oxygen copper busbar products for new AI cooling structures in collaboration with leading global cooling module companies [1] - The company's self-developed copper heat pipes and liquid-cooled copper pipes have been integrated into the products of several major enterprises in the computing server sector [1] Group 1 - The high thermal conductivity, excellent welding performance, and processing capabilities of the copper busbar products are key features that support their application in advanced cooling solutions [1] - Strategic partnerships have been established with multiple top-tier cooling module companies, indicating strong market positioning and collaboration [1] - The products are currently utilized in several high-end GPU cooling solutions, showcasing their relevance in the growing AI and computing markets [1] Group 2 - The successful integration of copper heat pipes and liquid-cooled copper pipes into leading enterprise computing server products highlights the company's innovation and adaptability in the industry [1] - The focus on high-performance materials aligns with the increasing demand for efficient cooling solutions in the tech sector, particularly for AI applications [1]

Core Viewpoint - The development of the AI industry has significantly increased the demand for chip computing power, positioning copper as a core material for advanced chip interconnection and heat dissipation due to its excellent conductivity and thermal properties [1] Company Summary - The company has a solid customer base and technical reserves in the chip computing power sector, being one of the early companies globally to provide copper-based materials in bulk to leading enterprises in this field [1] - The company's high-precision special oxygen-free copper busbar products, known for their high thermal conductivity and excellent welding and processing performance, have been successfully mass-produced in the new AI cooling structure of 3DVC [1] - Strategic partnerships have been established with several top-tier cooling module companies, and the products are applied in multiple high-end GPU cooling solutions [1] - The company’s independently developed copper heat pipes and liquid-cooled copper pipes have been successfully integrated into the products of several leading enterprises in the computing server market [1] - The company will closely monitor and follow market demand in these areas to further enhance its product lineup and competitive advantages [1]