Core Insights - The development of the AI industry has significantly increased the demand for chip computing power, positioning copper as a core material for advanced chip interconnection and heat dissipation due to its excellent conductivity and thermal properties [1] Company Overview - The company has a solid customer base and technical reserves in the chip computing power sector, being one of the earliest companies globally to provide copper-based materials in bulk to leading enterprises in this field [1] - The company's high-precision shaped oxygen-free copper busbar products, known for their high thermal conductivity and excellent welding and processing performance, have been successfully mass-produced in new AI cooling structures [1] - Strategic partnerships have been established with several top-tier cooling module companies, with applications in multiple high-end GPU cooling solutions [1] - The company has independently developed copper heat pipes and liquid-cooled copper pipes, which have been successfully integrated into the products of several leading enterprises in the computing server market [1]

Core Insights - Jintian Co., Ltd. has successfully mass-produced high-precision, non-oxygen copper busbar products for new AI cooling structures in collaboration with leading global cooling module companies [1] - The company's self-developed copper heat pipes and liquid-cooled copper pipes have been integrated into the products of several major enterprises in the computing server sector [1] Group 1 - The high thermal conductivity, excellent welding performance, and processing capabilities of the copper busbar products are key features that support their application in advanced cooling solutions [1] - Strategic partnerships have been established with multiple top-tier cooling module companies, indicating strong market positioning and collaboration [1] - The products are currently utilized in several high-end GPU cooling solutions, showcasing their relevance in the growing AI and computing markets [1] Group 2 - The successful integration of copper heat pipes and liquid-cooled copper pipes into leading enterprise computing server products highlights the company's innovation and adaptability in the industry [1] - The focus on high-performance materials aligns with the increasing demand for efficient cooling solutions in the tech sector, particularly for AI applications [1]

Core Viewpoint - The development of the AI industry has significantly increased the demand for chip computing power, positioning copper as a core material for advanced chip interconnection and heat dissipation due to its excellent conductivity and thermal properties [1] Company Summary - The company has a solid customer base and technical reserves in the chip computing power sector, being one of the early companies globally to provide copper-based materials in bulk to leading enterprises in this field [1] - The company's high-precision special oxygen-free copper busbar products, known for their high thermal conductivity and excellent welding and processing performance, have been successfully mass-produced in the new AI cooling structure of 3DVC [1] - Strategic partnerships have been established with several top-tier cooling module companies, and the products are applied in multiple high-end GPU cooling solutions [1] - The company’s independently developed copper heat pipes and liquid-cooled copper pipes have been successfully integrated into the products of several leading enterprises in the computing server market [1] - The company will closely monitor and follow market demand in these areas to further enhance its product lineup and competitive advantages [1]