龍鹰二号Ultra

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智能座舱赛道 现10亿级融资
Shang Hai Zheng Quan Bao· 2025-08-19 16:09
智能座舱加速渗透市场之际,8月19日,汽车电子芯片企业芯擎科技宣布于近日完成规模超10亿元人民 币的B轮融资。 产业方面,随着智能座舱从"新概念"走向"新车标配",我国的智能座舱域控市场迎来高速扩容。 本轮融资由中国国有企业结构调整基金二期领投,多地国资产业基金跟投。同时,芯擎科技还获得了湖 北、山东两省首单AIC股权项目,在国资、银资、险资以及产业链协同资本等多维度实现里程碑式进 展。 "新玩家"撬动市场 公开资料显示,芯擎科技的"龍鹰一号"已于2023年正式量产并规模化交付,目前已斩获国内外数十款主 力车型的应用或定点,包括一汽红旗天工系列、吉利领克系列、银河系列、德国大众在欧洲和美洲的海 外车型。 2024年,芯擎科技推出全场景高阶辅助驾驶芯片"星辰一号",直接对标国际先进主流产品,并在CPU性 能、AI算力、ISP处理能力、NPU等关键指标上实现全面提升。在不久前结束的2025香港车博会上,芯 擎科技CEO汪凯表示,公司正在研发新一代座舱芯片"龍鹰二号Ultra"和"龍鹰二号Lite"。 产业+资本双重加速 当下,智能座舱赛道正处于产业与资本的双重加速期。 作为智能汽车座舱芯片领域的"新玩家",芯擎科 ...
芯擎科技完成新一轮超10亿人民币融资,汪凯:持续拓宽护城河,让更多产品用上更好的「中国芯」
IPO早知道· 2025-08-19 10:11
Core Viewpoint - Chip technology company XinQing Technology has successfully completed a B-round financing exceeding 1 billion RMB, indicating strong investor confidence in its technological capabilities and growth prospects [2] Group 1: Financing and Strategic Partnerships - XinQing Technology has secured its first AIC equity project in Hubei and Shandong provinces, along with strategic investment from Taiping Financial Holdings, marking significant progress in multi-dimensional capital collaboration [2] - The company has established a robust investor base from the automotive supply chain and integrated circuit industry, supported by various local governments, creating a collaborative industrial ecosystem [2] Group 2: Market Position and Product Development - In 2024, XinQing Technology is projected to hold the largest market share in domestic smart cockpit chips and is one of the few suppliers capable of covering both smart cockpit and smart driving key SoCs [3] - The company launched the first domestic 7nm automotive-grade smart cockpit chip, "Longying No. 1," which is now used in numerous major vehicle models, including those from FAW Hongqi and Geely [3] - XinQing Technology is set to release the "Xingchen No. 1" high-level assisted driving chip in 2024, which aims to compete with international mainstream products, showcasing improvements in CPU performance, AI computing power, and other key metrics [3] Group 3: Future Growth and Innovation - The company is actively exploring new growth avenues in areas such as embodied intelligence, low-altitude economy, and edge computing, demonstrating strong upward momentum [4] - XinQing Technology plans to increase R&D investment following its recent financing, aiming to expand its competitive edge and enhance the adoption of its products featuring "Chinese chips" [4]