1.【江淮汽车公布多模态飞行汽车专利，可降低噪音和能耗】天眼查知识产权信息显示，1月2日，安 徽江淮汽车集团股份有限公司申请的"一种多模态飞行汽车"专利公布。摘要显示，本发明所述仿生飞 行翼可折叠及伸缩地设置在车身两侧，在飞行模式时展开，在地面行驶模式时收缩；在车体前舱和车 体后舱均设置多组竖直向下的所述涵道风扇，以进行垂直升降控制，所述涵道风扇嵌设车身内部涵道 内，所述涵道的出风口处设置可开合的格栅，在地面行驶模式时控制所述格栅闭合，在飞行模式时根 据飞行指令控制所述格栅的偏转角度，以控制气流方向。本发明能降低飞行汽车的噪音和能耗，增加 续航能力。（界面新闻） 2.【AMD推出下一代新品，4年内AI芯片性能有望提升1000倍】AMD CEO苏姿丰在CES演讲中表 示，下一代AI芯片MI455 GPU采用两纳米和三纳米工艺制造，并采用先进封装，搭载了HBM4。 MI455 GPU将与EPYC CPU一同集成，下一代AI机架Helios机架将包含72个GPU，通过连接数千个 Helios机架可构建大AI集群。此外，MI500系列芯片也在开发中，将采用两纳米工艺。随着MI500系 列在2027年推出，AMD有望在 ...

Core Viewpoint - AMD is positioning itself for the Yotta Flops era of AI computing, aiming to significantly enhance AI performance and capabilities through new product launches and technological advancements [2][4]. Group 1: New Product Launches - AMD unveiled several new products at CES 2026, including the MI455X GPU, Ryzen AI 400 series processors, and the Ryzen AI Max+ series [2]. - The MI455X is AMD's most advanced processor to date, featuring 320 billion transistors, a 70% increase from the previous MI355, and equipped with 432GB of HBM4 memory [5]. - The Ryzen AI 400 series processors utilize Zen 5 CPU architecture and RDNA 3.5 GPU, integrating up to 60 TOPS of NPU computing power, with the first Ryzen AI 400 PCs set to launch later this month [6]. Group 2: Future Plans and Innovations - AMD plans to release the MI500 series chips in 2027, which will utilize 2nm technology and HBM4e memory, potentially increasing AI performance by 1000 times over the next four years [5]. - The Helios platform, designed for the Yotta-level AI era, features a dual-width design and can accommodate up to 72 GPUs, emphasizing AMD's commitment to high-performance computing [4]. Group 3: AI Integration and Market Strategy - AMD views AI as a fundamental capability of PCs rather than an additional feature, indicating a shift towards integrating AI across various computing platforms [5][6]. - The company is targeting enterprise markets with the MI440X chip, designed for smaller data centers, allowing for local hardware deployment and data privacy [5].

来源：环球网 为推动这一目标的实现，AMD在本次CES上发布了一系列全新AI处理器，将AI驱动的个人电脑视为未 来发展的核心方向。其中，AMD正式推出AMD Ryzen AI 400系列处理器，作为其最新款人工智能驱动 型PC芯片，该系列在性能上表现卓越。 AMD方面介绍，Ryzen AI 400系列的多任务处理速度比竞争对 手快1.3倍，内容创作速度更是快1.7倍。在硬件配置方面，这些新型芯片具备12个CPU核心（即核心处 理器内的独立处理单元）以及24个线程（即独立的指令流），为高效处理各类复杂任务提供了坚实基 础。 除了PC芯片，苏姿丰还在演讲中透露了AMD在AI芯片领域的更多布局。下一代AI芯片MI455 GPU将采 用先进的两纳米和三纳米工艺制造，并引入先进封装技术，同时搭载HBM4。MI455 GPU将与EPYC CPU集成，下一代AI机架Helios机架将集成72个GPU，通过连接数千个Helios机架，可构建大规模AI集 群，为大规模AI计算任务提供强大支持。 此外，AMD还在积极开发MI500系列芯片，该系列同样采用两纳米工艺。随着MI500系列在2027年推 出，据称，AMD有望在4年时间 ...

AMD CEO苏姿丰在CES演讲中表示，下一代AI芯片MI455 GPU采用两纳米和三纳米工艺制造，并采 用先进封装，搭载了HBM4。 记者｜郑栩彤 编辑 ｜瑜见 此外，MI500系列芯片也在开发中，将采用两纳米工艺。 随着MI500系列在2027年推出，AMD有望在4年时间内将AI性能芯片提升1000倍。 MI455 GPU将与EPYC CPU一同集成，下一代AI机架Helios机架将包含72个GPU，通过连接数千个 Helios机架可构建大AI集群。 ...

转自：证券时报 人民财讯1月6日电，AMD CEO苏姿丰在CES演讲中表示，下一代AI芯片MI455 GPU采用两纳米和三纳 米工艺制造，并采用先进封装，搭载了HBM4。MI455 GPU将与EPYC CPU一同集成，下一代AI机架 Helios机架将包含72个GPU，通过连接数千个Helios机架可构建大AI集群。此外，MI500系列芯片也在开 发中，将采用两纳米工艺。随着MI500系列在2027年推出，AMD有望在4年时间内将AI性能芯片提升 1000倍。 ...

Core Viewpoint - AMD's CEO, Lisa Su, presented optimistic projections for the AI market, forecasting that the total addressable market (TAM) for AI data centers will exceed $1 trillion by 2030, with a compound annual growth rate (CAGR) of over 40% from the current approximately $200 billion [1][6]. Group 1: Market Outlook and Financial Projections - AMD aims to capture a "double-digit" market share in the data center AI chip market, with annual revenue from data center chips expected to reach $100 billion within five years [6]. - The company anticipates overall business growth of 35% annually over the next three to five years, with data center business growth projected at 60% [6]. - AMD's earnings per share (EPS) is expected to increase to $20 within the same timeframe [6]. Group 2: Product Development and Competitive Positioning - AMD's data center business, which includes server CPUs and GPUs, generated $4.3 billion in revenue in Q3, marking a 22% year-over-year increase and setting a historical record [8]. - The MI350 series AI chips are reported as the fastest-growing products in AMD's history, with major cloud providers already deploying them [8]. - AMD plans to achieve over 50% market share in server CPU revenue, with the next-generation "Venice" processors enhancing AI and general computing performance [9]. Group 3: Strategic Partnerships and Collaborations - AMD has secured significant AI chip orders, including a strategic partnership with OpenAI to deploy 6GW of AMD GPU chips for next-generation AI infrastructure [12]. - Collaborations with Oracle and the U.S. Department of Energy have also been established, with Oracle set to deploy 50,000 units of AMD's latest AI chips by Q3 2026 [12]. - AMD's partnership with the U.S. Department of Energy involves a $1 billion investment to build two new supercomputers for research in various fields [12]. Group 4: Competitive Landscape - AMD faces significant competition from NVIDIA, which is projected to achieve $500 billion in sales from its AI chips over the next five quarters [11]. - Other tech giants like Google and Amazon are developing their own AI chips, posing additional challenges for AMD [13]. - Qualcomm has also entered the data center AI chip market, launching new products and forming partnerships to provide AI inference services globally [13].

Core Insights - AMD's CEO, Lisa Su, presented optimistic projections for the AI market, forecasting a total addressable market (TAM) for AI data centers to exceed $1 trillion by 2030, with a compound annual growth rate (CAGR) of over 40% from approximately $200 billion this year [1] - AMD aims to capture a "double-digit" market share in the data center AI chip market, with projected annual revenue from data center chips reaching $100 billion within five years and profits expected to more than double by 2030 [1][2] Group 1: Market Outlook and Financial Projections - AMD anticipates a 35% annual growth across its entire business over the next three to five years, with data center business growth projected at 60% [2] - The company expects earnings per share (EPS) to rise to $20 within the same timeframe [2] - The data center business is identified as the core driver for AMD's future market goals, with a historical revenue high of $4.3 billion in Q3, a 22% year-over-year increase [3] Group 2: Product Development and Competitive Landscape - AMD's AI chip product line, while starting later than NVIDIA's, is gaining traction, with the MI350 series being described as the fastest-growing product in the company's history [4] - AMD plans to achieve over 50% market share in server CPU revenue, with the next-generation EPYC processor, codenamed "Venice," aimed at enhancing AI and general computing performance [4] - Despite facing significant competition from NVIDIA, AMD is positioned as a cost-effective alternative as global enterprises invest heavily in AI infrastructure [5] Group 3: Strategic Partnerships and Collaborations - AMD has secured major partnerships, including a strategic collaboration with OpenAI to deploy 6GW of AMD GPU chips for AI infrastructure [5][6] - Additional collaborations include a partnership with Oracle to deploy 50,000 units of the latest AI chip MI450 by Q3 2026 and a $1 billion project with the U.S. Department of Energy for new supercomputers [6] - Competitors like Google and Amazon are also developing their own AI chips, indicating a highly competitive environment in the AI data center chip market [6]