行情速递 ④活跃子行业，SW机器人(+4.30%)/SW营销代理(+2.88%)/ 国内新闻 ①半导体行业观察，台积电悄然宣布已开始量产采用其N2（2nm级）工艺的 芯片/N2工艺采用第一代纳米片晶体管技术/在性能和功耗方面实现了全节点 提升/台积电还开发了低电阻重分布层（RDL）和超高性能金属-绝缘体-金 属（MiM）电容器/以进一步提升性能/ ②半导纵横，国产 CMOS 厂商格科官宣推出两款全新规格的单芯片 5000 万 像 素 图 像 传 感 器 GC50F0 与 GC50D1/GC50F0 是 全 球 首 颗 采 用 0.64μm 小像素的单芯片图像传感器/广泛适配各类手机应用/GC50D1 则采 用 0.8μm 像素规格/主要运用于主摄、超广角和长焦应用/ ③艾邦ARAI眼镜资讯，闪极发布loomos AI显示眼镜 S1/搭载光峰蜻蜓G1 MINI光学引擎/配备356x200分辨率/通过优化分辨率比例/更契合AR眼镜的 近眼显示逻辑/对比度更是达到1000:1的高水准/显著提升画面层次感与清晰 度/凭借多维度参数优势/在行业同类产品中形成差异化竞争力/ ④CINNO，京东方提前点亮中国首条第8.6代 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 台积电悄然宣布已开始量产采用其N2（2nm级）工艺的芯片。该公司并未发布正式新闻稿宣布量 产启动，但此前曾多次表示N2工艺有望在第四季度实现量产，因此该计划已达成。 台积电在其2nm 技术网页上发表声明称："台积电的 2nm (N2) 技术已按计划于 2025 年第四季度 开始量产。 " 从性能提升的角度来看，N2 的设计目标是在相同功耗下实现 10%–15% 的性能提升，在相同性能 下降低 25%–30% 的功耗，并且对于包含逻辑、模拟和 SRAM 的混合设计，晶体管密度比 N3E 提高 15%。对于纯逻辑设计，晶体管密度比 N3E 高出 20%。 | | N2 vs N3E | N2P vs N3E | N2P vs N2 | A16 vs N2P | | --- | --- | --- | --- | --- | | Power** | -25% ~ - 30% | -36% | -5% ~ -10% | -15%~-20% | | Performance***10% - 15% | | 18% | 5% - 10% | 8% - 10% | | Density ...

公众号记得加星标⭐️，第一时间看推送不会错过。 台积电悄然宣布已开始量产采用其N2（2nm级）工艺的芯片。该公司并未发布正式新闻稿宣布量产启 动，但此前曾多次表示N2工艺有望在第四季度实现量产，因此该计划已达成。 台积电在其 2nm 技术网页上发表声明称："台积电的 2nm (N2) 技术已按计划于 2025 年第四季度开 始量产。 " N2工艺采用第一代纳米片晶体管技术，在性能和功耗方面实现了全节点提升。台积电还开发了低电 阻重分布层（RDL）和超高性能金属-绝缘体-金属（MiM）电容器，以进一步提升性能。 台积电N2技术在密度和能效方面都将成为半导体行业最先进的技术。凭借领先的纳米片晶体管结 构，N2技术将带来全节点性能和功耗优势，以满足日益增长的节能计算需求。通过我们持续改进的 战略，N2及其衍生技术将进一步巩固台积电的技术领先地位，并使其在未来很长一段时间内保持领 先地位。" 从性能提升的角度来看，N2 的设计目标是在相同功耗下实现 10%–15% 的性能提升，在相同性能下 降低 25%–30% 的功耗，并且对于包含逻辑、模拟和 SRAM 的混合设计，晶体管密度比 N3E 提高 15%。对于纯逻辑设计 ...

Core Viewpoint - The collaboration between NVIDIA and TSMC in the U.S. marks a significant milestone in the production of AI chips, enhancing the domestic supply chain and solidifying the U.S. leadership in the AI era [3][5][6]. Group 1: NVIDIA and TSMC Collaboration - NVIDIA's CEO Jensen Huang celebrated the first NVIDIA Blackwell wafer produced in the U.S. at TSMC's Phoenix facility, highlighting the achievement as a historic moment for American semiconductor manufacturing [3][5]. - The production of the Blackwell architecture chips is crucial for AI, telecommunications, and high-performance computing applications, with TSMC's Arizona factory set to produce advanced technology chips including 2nm, 3nm, and 4nm nodes [5][6]. Group 2: Technological Advancements - TSMC is accelerating the deployment of its advanced N2 process node, expected to achieve mass production by the end of 2025, which will replace the FinFET architecture with nanosheet-based gate-all-around transistors [8][9]. - The N2P process, anticipated to launch in the second half of 2026, aims to further enhance efficiency, with significant improvements in speed and power reduction compared to previous nodes [11]. Group 3: Financial Performance and Investment - TSMC reported a record revenue of $33.1 billion, driven by demand for AI accelerators and high-end smartphone chips, with advanced process technologies contributing nearly three-quarters of sales [13]. - The company plans to maintain strong capital expenditures of up to $42 billion this year, with a significant portion allocated to expanding cutting-edge manufacturing capabilities [13][17]. Group 4: Future Expansion Plans - TSMC's Arizona facility is expected to evolve into a "GigaFab" cluster, capable of producing approximately 100,000 wafers per month, integrating packaging, testing, and local supplier networks [21]. - The expansion in Arizona is part of a broader strategy to ensure domestic chip production capabilities and reduce reliance on Asian foundries, with TSMC exploring additional land acquisitions for further growth [21].

Core Viewpoint - The semiconductor industry is experiencing significant growth, with TSMC leading in advanced process nodes like 3nm and 2nm, showcasing strong financial performance and strategic expansion plans [2][3][4]. Financial Performance - TSMC reported record revenue of $30.1 billion in Q2 2025, a 44% year-over-year increase, with a gross margin of 59%, reflecting strong pricing power and efficiency improvements [3]. - The total revenue for the first half of 2025 reached $60.5 billion, a 40% increase year-over-year, prompting TSMC to raise its full-year revenue growth guidance from 25% to approximately 30% [3]. - The company anticipates AI-related demand to drive significant revenue growth, with AI accelerator revenue expected to double in 2025 [3]. Technological Advancements - TSMC plans to start mass production of its N2 process in Q4 2025, ahead of schedule, indicating better-than-expected yield rates [4]. - The company is also constructing a 1.4nm fab in Taiwan, expected to enhance performance by 15% and reduce power consumption by 30% [4]. - Advanced packaging capacity has been doubled to 75,000 wafers per month, benefiting from collaborations with partners [4]. Strategic Expansion - TSMC's Arizona subsidiary achieved profitability in H1 2025, with a net profit of $150.1 million, reversing previous losses [4]. - New factories in Europe and Japan are under development to enhance supply chain resilience [4]. - Recent regulations in Taiwan mandate that advanced processes remain on the island, limiting overseas factories to N-1 processes, addressing trade tensions and potential tariff risks [5]. Workforce and Recruitment - TSMC plans to recruit over 10,000 new employees in 2024, with a significant portion in Taiwan, reflecting its ongoing expansion needs [7]. - The company has seen a nearly 10% increase in global employee count, reaching 84,512 by the end of 2024 [10]. - The gender ratio among employees is approximately 66.3% male to 33.7% female, with a significant portion of employees holding master's degrees [11][13]. Employee Compensation and Retention - TSMC's median salary for non-supervisory employees is approximately NT$2.645 million, ranking it among the top in Taiwan [16]. - In 2024, TSMC allocated NT$140.6 billion for employee bonuses, with an average payout exceeding NT$2 million per employee [17]. - The company aims to maintain a turnover rate below 10% by 2030, with a current turnover rate of 3.5% [14].