Group 1 - The core viewpoint of the article indicates that due to the shift of DRAM manufacturers towards advanced processes and new capacities for Server and HBM applications to meet AI Server demand, there will be a significant tightening of supply in other markets, leading to a projected increase in contract prices for Conventional DRAM by 55-60% in Q1 2026 and for NAND Flash by 33-38% [2][3] Group 2 - In Q1 2026, the contract price for Conventional DRAM is expected to rise by 55-60%, while HBM blended prices will increase by 50-55% [3] - The global MLC NAND Flash capacity is projected to decrease by 41.7% in 2026 due to major manufacturers exiting or reducing production, exacerbating supply-demand imbalances [3] Group 3 - The mass production schedule for HBM4 is anticipated to be delayed until the end of Q1 2026 due to adjustments in specifications by NVIDIA and increased demand for previous generation products [6] Group 4 - The supply-demand situation for LCD TV panels is expected to tighten in Q1 2026 due to production cuts by major manufacturers in response to the upcoming Chinese New Year [8] Group 5 - The global installation volume of electric vehicle SiC inverters reached a record high of 8.35 million units in Q3 2025, marking a 22% year-on-year increase, with a penetration rate of 18% [9]

Core Insights - The article highlights the growth of the global electric vehicle (EV) market, particularly in the third quarter of 2025, where the installation volume of traction inverters reached 8.35 million units, marking a 22% year-on-year increase. Battery Electric Vehicles (BEVs) and Plug-in Hybrid Electric Vehicles (PHEVs) are the main contributors to this growth, with installation growth rates of 36% and 13.6% respectively [2][6]. Group 1: Electric Vehicle Market Growth - The global installation volume of traction inverters in Q3 2025 reached 8.35 million units, a 22% increase year-on-year [2]. - The growth rates for BEVs and PHEVs were 36% and 13.6% respectively, indicating strong demand in the EV sector [2]. - The integration of electric drive systems in vehicle chassis is increasing, with over 70% of inverter installations featuring a "3 in 1" or higher integration type [2]. Group 2: SiC Power Semiconductors - SiC power semiconductors are becoming key components in electric drive systems due to their compact size and higher voltage tolerance [5]. - In Q3 2025, the global installation volume of SiC inverters surpassed 1.5 million units, achieving a historical high [5]. - The penetration rate of SiC inverters in electric vehicles increased from 14% in 2024 to 18% in 2025, and reached 22% specifically for new energy vehicles [5]. Group 3: Market Dynamics and Challenges - 84% of SiC inverter installations were contributed by BEVs, with the remaining from PHEVs and Range-Extended Electric Vehicles (REEVs) [6]. - The Chinese market remains the largest for SiC inverters, accounting for approximately 75% of the installation volume, while demand in Europe and the US is showing signs of weakness [6]. - Despite the growth in inverter installation volumes, the overall market value in Q3 2025 decreased by 10% compared to the same period in 2024, reflecting pricing pressures from automakers [6].

插播： 天科合达、天岳先进、同光股份、 恒普技术、 京航特碳、合盛新材料、三安半导体、中电化合物、 东尼电子、芯聚能半导体、华卓精 科 等 已确认参编《 2025 碳化硅 (SiC) 衬底与外延产业调研白皮书》和《2025 碳化硅(SiC)器件与模块 产业调研白皮书》，参编咨询请联系 许若冰（hangjiashuo999）。 在全球电动化浪潮下，车规SiC技术正加速产业化落地。近期，多家国际零部件巨头与车企密集披露SiC合作及订单动态： • 德国马勒： 超16亿元 的SiC车载充电器大单； 采埃孚：SiC电驱平台进军 印度商用车 市场，已拿下"数千套"订单； 麦格纳+奔驰：联手打造SiC高性能电驱系统； • • CISSOID+Hyperdrives：通过深度技术整合推出SiC逆变器方案。 从高端乘用车到商用巴士，从三合一充配电到创新电驱平台，SiC正以能效跃升、功率密度突破等优势改写电动车行业技术格局： 斩获豪华车企 据介绍， 该产品符合ASPICE标准，集成了3.5kW DC/DC转换器和电源分配单元， • Mahle推出SiC车载充电器： 已获某豪华电动车2亿欧元订单 在2025年上海车展期间， 德国马 ...

新能源汽车800V高压平台与SiC逆变器的快速普及，正将传统锡基焊料推向性能极限，而铜烧结技 术凭借"低温键合、高温服役"的独特优势崭露头角，其材料成本仅为银烧结的1/50，导热与机械性能却 提升2倍以上，被视为SiC模块封装的最优解。但铜烧结技术产业化之路仍面临氧化与工艺适配难题双重 阻碍。 针对目前 铜烧结技术困境， 香港大学携量产级技术方案强势入场。5月15日， "行家说三代半"将在 上海 锦江汤臣洲际大酒店 召开 插播：英诺赛科、能华半导体、致能半导体、京东方华灿光电、镓奥科技等已确认参编《2024- 2025氮化镓（GaN）产业调研白皮书》，参编咨询请联系许若冰（hangjiashuo999）。 "电动交通&数字能源SiC技术应用及供应链升级大会" 香港大学机械工程系系主任、国家杰青、长江学者黄明欣教授将发表 未来已来，积极拥抱铜烧结时代》 主题演讲，分享铜烧结技术在功率半导体封装领域的突破性进展及其产业化前景。 ， 《 本次会议上， 黄明欣教授将深度解析香港大学在高性能金属材料与半导体封装技术融合中的创新成果， 展示 新一代 铜烧结材料体系 、封装结构设计优化方案及应用测试成果，并就该技术如何赋能 ...