来源：钛媒体 近期，江苏芯德半导体科技股份有限公司（下称"芯德半导体"）提交了招股说明书，拟港股IPO上市。 笔者注意到，芯德半导体自2020年成立以来5年累计"烧掉"14亿元，近三年半合计亏损超13.14亿元，持续未实现盈利，扭亏为盈成为亟待破解的核心难题。 特别要说明的是，芯德半导体99%以上收入依赖的封装产品及测试服务，而该业务却始终陷入"亏本卖"的困境。 债务方面，报告期内流动资产长期低于流动负债，流动比率从0.8逐年下滑至0.5，短期偿债压力极为显著；现金及现金等价物最高仅1.86亿元，却需覆盖高 达5.66亿元的计息借款，资金缺口持续扩大。 持续亏损 芯德半导体是一家半导体封测技术解决方案提供商，主要从事开发封装设计、提供定制封装产品以及封装产品测试服务。 2022年-2024年和2025年1-6月（下称"报告期"），芯德半导体分别实现营业收入26939.9万元、50907.7万元、82737.4万元、47497.5万元，年内亏损分别为 36026.8万元、35889.2万元、37657.8万元、21858.8万元，公司持续在亏损，近三年半合计亏损了近13.14亿元。 | | | 截至12月31日 ...

Core Viewpoint - The article discusses the recent developments of Jiangsu Xinde Semiconductor Technology Co., Ltd., which focuses on semiconductor packaging and testing, and its application for listing on the Hong Kong Stock Exchange amid supportive policies for the semiconductor industry [1][3]. Company Overview - Jiangsu Xinde Semiconductor was founded in September 2020 by Xinlianxin, Nanjing Yuanjun, and Ningtaixin, primarily engaged in semiconductor packaging design, customized packaging products, and testing services [3]. - The company has attracted significant investors, including MediaTek and Lei Jun's Xiaomi Changjiang, with Ningtaixin being the largest shareholder holding 9.49% of the equity [5][3]. Industry Context - The semiconductor industry is crucial in the era of AI, 5G, IoT, and automotive electronics, with packaging technology becoming a key area for innovation as Moore's Law slows down [6]. - Advanced packaging techniques are essential for maintaining performance and reliability in smaller, high-density semiconductor products, with high entry barriers due to equipment costs and the need for skilled talent [6]. Financial Performance - In the first half of 2025, Xinde Semiconductor's revenue reached 475 million yuan, a 22% increase year-on-year, driven by QFN and BGA packaging products, which accounted for 31% and 31.8% of revenue, respectively [7]. - Despite revenue growth, the company reported a loss of 207 million yuan in the same period due to high sales costs, primarily from material expenses, although adjusted EBITDA showed improvement [8]. Market Outlook - The global semiconductor packaging and testing market is projected to grow from 495.6 billion yuan in 2020 to 649.4 billion yuan in 2024, with a compound annual growth rate of 7%, and expected to reach 933 billion yuan by 2029 [8]. - The company faces seasonal sales fluctuations influenced by the consumer electronics sector, particularly around holidays [8]. Investment Considerations - The semiconductor sector is benefiting from national policies and domestic substitution demand, with companies like SMIC and Hua Hong Semiconductor showing strong performance [9]. - However, Xinde Semiconductor's revenue growth is slowing, with increases of 89%, 62.5%, and 22.1% expected for 2023, 2024, and the first half of 2025, respectively, and the company has yet to achieve profitability [9].

Core Viewpoint - The semiconductor sector in the Hong Kong stock market has experienced significant growth this year, with companies like Huahong Semiconductor and Shanghai Fudan seeing substantial stock price increases [1][2]. Group 1: Market Performance - The semiconductor sector in Hong Kong has seen a surge, with Huahong Semiconductor (01347.HK) rising over 260%, and Shanghai Fudan (01385.HK), InnoCare (02577.HK), and SMIC (00981.HK) also increasing by more than 130% [1]. - More semiconductor companies are entering the Hong Kong market, with Jiangsu Xinde Semiconductor Technology Co., Ltd. recently submitting its prospectus for a mainboard listing [2]. Group 2: Company Overview - Jiangsu Xinde Semiconductor focuses on advanced packaging technology and has accumulated extensive experience since its establishment in September 2020, covering various packaging types such as QFN, BGA, LGA, WLP, and 2.5D/3D [3][4]. - The company has established a comprehensive technology platform for advanced packaging, known as CAPiC, to continuously develop cutting-edge technologies [4]. Group 3: Client Base and Investments - Xinde Semiconductor has built a diverse client base in key chip areas, including major companies like MediaTek, Amlogic, and Broadcom [4]. - The company has received investments from various sources, including local state-owned assets and well-known institutions, with notable shareholders including Xiaomi and OPPO [4]. Group 4: Financial Performance - Xinde Semiconductor has reported continuous losses, with revenues projected to be RMB 269 million in 2022, increasing to RMB 475 million in the first half of 2025, while losses are expected to remain significant [5][6]. - The adjusted net losses for the same period are projected to decrease from RMB 301 million in 2022 to RMB 111 million in the first half of 2025 [5][6]. Group 5: Revenue Structure and Risks - The revenue structure is relatively balanced among different product lines, with QFN, BGA, LGA, and WLP contributing 31.0%, 31.8%, 20.1%, and 16.9% respectively in the first half of 2025 [6]. - The company relies heavily on a few major clients, with the top five clients accounting for approximately 60.5% of total revenue in 2022 [7][8]. Group 6: Financing and Future Plans - Xinde Semiconductor has seen an increase in financing costs, with bank borrowings rising from RMB 384 million in 2022 to RMB 824 million in the first half of 2025 [9]. - The company plans to use the funds raised from its IPO for building production facilities, enhancing R&D capabilities, and expanding its customer collaboration ecosystem [9].