Investment Rating - The report suggests a positive outlook for the silicon carbide (SiC) industry, indicating an "Overweight" rating for the sector, as it is expected to outperform the overall market [58]. Core Insights - Silicon carbide (SiC) exhibits advantages such as high temperature and pressure resistance, with significant potential for increased penetration. The penetration rate of SiC materials is projected to rise from 4% in 2020 to 15% by 2024 [3][8]. - The competitive landscape for SiC is shifting, with major overseas manufacturers reducing operations, which may lead to a more consolidated market [9][12]. - Domestic manufacturers are breaking monopolies across various segments of the SiC supply chain, showing strong growth and development [3][37]. Summary by Sections 1. Advantages of Silicon Carbide - SiC has superior breakdown electric field strength, saturation electron drift rate, thermal conductivity, and thermal stability compared to silicon, making it suitable for high-voltage, high-frequency, and high-power applications [3][8]. - The global penetration rate of SiC materials is expected to reach 15% by 2024, indicating a substantial growth opportunity [3][8]. 2. Competitive Landscape - Major overseas companies like Wolfspeed and Renesas Electronics are scaling back operations, which may lead to a more concentrated competitive environment [9][12]. - Domestic companies are gaining ground in substrate and epitaxy segments, with firms like BYD Semiconductor and others showing robust growth in SiC module production [3][37]. 3. Investment Opportunities - The report highlights several key players to watch, including Tianke Heda in the substrate segment, Tianyu Semiconductor in the epitaxy segment, and Xilinx Integration and Basic Semiconductor in the device segment [3][37]. - The AR glasses market is identified as a new growth avenue for SiC substrates, with potential demand reaching millions of units by 2030 [20][23]. 4. Market Growth Projections - The SiC power device market is projected to grow from $1.09 billion in 2021 to $6.3 billion by 2027, with a compound annual growth rate (CAGR) of 34% [36]. - The number of vehicle models using SiC power devices is expected to increase significantly, from 1 model in 2019 to over 200 models by 2024 [34][36].

Investment Rating - The investment rating for the company is "Outperform the Market" [6] Core Views - The company is expected to maintain steady growth with a projected revenue of 11.22 billion yuan in 2024, representing a year-on-year increase of 20.14%. The net profit attributable to the parent company is forecasted to reach 2.52 billion yuan, a significant increase of 327.34% year-on-year [1] - The company is ranked sixth globally in power semiconductor market share, holding 3.3% of the market, and is the leading player in the domestic market [1] - The integrated circuit segment is anticipated to grow by 29% in 2024, with the IPM module revenue reaching 2.91 billion yuan, a year-on-year increase of 47% [2] - The discrete device segment is projected to generate revenue of 5.44 billion yuan in 2024, reflecting a year-on-year growth of 12.53%, with a focus on high-value products for automotive and photovoltaic applications [3] Summary by Sections Financial Performance - In 2024, the company achieved a revenue of 11.22 billion yuan, up 20.14% year-on-year, and a net profit of 2.52 billion yuan, up 327.34% year-on-year [1] - For Q1 2025, the company reported a revenue of 3 billion yuan, a year-on-year increase of 21.7%, with a net profit of 145 million yuan, reflecting a year-on-year growth of 8.96% [1] Segment Analysis - The integrated circuit segment's revenue in 2024 is expected to be 4.11 billion yuan, with a gross margin of 30.70%, up 1.23 percentage points year-on-year [2] - The discrete device segment's revenue is projected to be 5.44 billion yuan, with a gross margin of 13.53%, down 9.20 percentage points year-on-year [3] Profit Forecast - The net profit forecast for 2025 is 524 million yuan, with expected growth rates of 138.5% and 53.1% for 2026 and 2027, respectively [5] - The company’s gross margin is expected to improve, with projections of 23% for 2025, 2026, and 2027 [5]

Group 1 - The resignation of independent director He Lenen is due to the completion of his six-year term, which began on June 26, 2019 [1][2] - He Lenen will continue to fulfill his duties as an independent director and related committee roles until a new independent director is elected at the shareholders' meeting [2] - The company expresses gratitude for He Lenen's contributions to its governance and stable development during his tenure [2] Group 2 - The resignation will result in the number of independent directors falling below one-third of the total board members, necessitating a prompt election of a new independent director [2] - The resignation report will take effect after the election of a new independent director, in accordance with relevant laws and regulations [2]

杭州士兰微电子股份有限公司 证券代码：600460 证券简称：士兰微 编号：临 2025-031 关于独立董事离任的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 | 一、独立董事离任的基本情况 | | --- | 1 / 2 何乐年先生在公司任职期间勤勉尽责，为公司规范运作和稳健发展做出了重 要贡献，公司董事会对此表示衷心感谢！ 特此公告。 杭州士兰微电子股份有限公司 董事会 | 姓名 | 离任职务 | 离任时间 | 原定任期 到期日 | 离任原因 | 是否继续 在上市公 司及其控 股子公司 任职 | 是否存在 未履行完 毕的公开 承诺 | | --- | --- | --- | --- | --- | --- | --- | | 何乐年 | 独立董事、董事会提 名与薪酬委员会委 员及召集人、董事会 审计委员会委员、董 | 补选产生 新任独立 董事之日 | 年 2025 8 月 25 日 | 连 续 担 任 独 立 董 事 已满六年 | 否 | 否 | | | 事会战略与投资委 | | | | | | | | 员会委员 ...

证券代码：600460 证券简称：士兰微 公告编号：临 2025-030 | 股份类别 | 股权登记日 | | 最后交易日 | | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | --- | --- | --- | --- | | Ａ股 | 2025/6/27 | － | | 2025/6/30 | 2025/6/30 | | ? 差异化分红送转： 否 杭州士兰微电子股份有限公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： ? 每股分配比例 A 股每股现金红利0.04元 ? 相关日期 一、通过分配方案的股东大会届次和日期 本次利润分配方案经公司2025 年 6 月 12 日的2024年年度股东大会审议通过。 二、分配方案 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东。 （1）对于持有公司无限售条件流通股的个人股东和证券投资基金，根据《关 于实施上市公司股息红利差别化个人所得税政策有关 ...

2024年年度权益分派实施公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 每股分配比例 A 股每股现金红利0.04元 相关日期 | 股份类别 | 股权登记日 | 最后交易日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | --- | --- | | Ａ股 | 2025/6/27 | － | 2025/6/30 | 2025/6/30 | 差异化分红送转： 否 证券代码：600460 证券简称：士兰微 公告编号：临 2025-030 杭州士兰微电子股份有限公司 1. 发放年度：2024年年度 2. 分派对象： 四、分配实施办法 一、通过分配方案的股东大会届次和日期 本次利润分配方案经公司2025 年 6 月 12 日的2024年年度股东大会审议通过。 二、分配方案 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东。 3. 分配方案： 本次利润分配以方案实施前的公司总股本1,664,0 ...

Group 1: Overall Industry Overview - The total import and export value of China's chip industry is projected to reach $545.14 billion in 2024, with a year-on-year growth of 12.32%, and a trade deficit of $226.14 billion, increasing by 5.97% [1] - In the first four months of 2025, the trade scale of the chip industry has already reached $179.61 billion, with a trade deficit of $66.73 billion [1] Group 2: Import Situation - In 2024, China's chip import volume is expected to be 549.18 billion units, reflecting a year-on-year increase of 14.52%, while the import value is approximately $385.64 billion, up by 10.38% [2] - For the first four months of 2025, the chip import volume is recorded at 181.33 billion units, with an import value of about $123.17 billion [2] - The import price of chips in China fluctuates between $0.60 and $0.80 per unit, remaining relatively stable due to the rapid development of the domestic IoT chip industry [5] Group 3: Export Situation - In 2024, China's chip export volume is projected to be 298.11 billion units, with a year-on-year growth of 11.31%, and the export value is expected to reach $159.50 billion, increasing by 17.31% [7] - In the first five months of 2025, the semiconductor export volume has reached 106.29 billion units, with an export value of $56.44 billion [7] - The export price of chips from China has shown a rising trend, increasing from $0.40 per unit in 2014 to $0.54 per unit in 2024, indicating improved self-innovation capabilities and increased market competitiveness [8]

证券代码：600460 证券简称：士兰微 公告编号：临 2025-028 杭州士兰微电子股份有限公司 2024年年度股东大会决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 本次会议是否有否决议案：无 一、 会议召开和出席情况 （一） 股东大会召开的时间：2025 年 6 月 12 日 （二） 股东大会召开的地点：浙江省杭州市西湖区黄姑山路 4 号公司三楼 大会议室 （三） 出席会议的普通股股东和恢复表决权的优先股股东及其持有股份情 况： | 1、出席会议的股东和代理人人数 | 3,046 | | --- | --- | | 2、出席会议的股东所持有表决权的股份总数（股） | 666,438,136 | | 3、出席会议的股东所持有表决权股份数占公司有表决权 | 40.0486 | | 股份总数的比例（%） | | （四） 表决方式是否符合《公司法》及《公司章程》的规定，大会主持情 况等。 本次股东大会采用现场投票与网络投票相结合的方式对本次股东大会通知 中列明的事项进行了投票表决。现场出席本次股东大会 ...

证券代码：600460 证券简称：士兰微 编号：临 2025-029 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 杭州士兰微电子股份有限公司（以下简称"公司"）于2025年5月22日召开 了第八届董事会第三十五次会议和第八届监事会第二十五次会议，审议通过了 《关于2021年股票期权激励计划首次授予的股票期权第四个行权期行权条件未 成就及注销相应股票期权的议案》，同意注销2021年股票期权激励计划首次授予 的股票期权第四个行权期对应的股票期权452.2875万份。具体内容详见公司于 2025年5月23日在上海证券交易所网站（www.sse.com.cn）披露的相关公告，公 告编号：临2025-025。 公司向中国证券登记结算有限责任公司上海分公司提交了注销上述股票期 权的申请。经中国证券登记结算有限责任公司上海分公司审核确认，上述 452.2875 万份股票期权注销事宜已于近日办理完毕。本次部分股票期权注销不会 影响公司股本结构。本次股票期权注销完成后，公司 2021 年股票期权激励计划 全部完结。 特此公告。 杭州士兰微电 ...

国浩律师（杭州）事务所 关 于 杭州士兰微电子股份有限公司 2024 年年度股东大会 法律意见书 网址/Website：http://www.grandall.com.cn 二〇二五年六月 国浩律师（杭州）事务所 法律意见书 国浩律师（杭州）事务所 地址：杭州市上城区老复兴路白塔公园 B 区 2 号、15 号国浩律师楼 邮编：310008 Grandall Building, No.2＆No.15, Block B, Baita Park, Old Fuxing Road, Hangzhou, Zhejiang 310008, China 电话/Tel: (+86)(571) 8577 5888 传真/Fax: (+86)(571) 8577 5643 电子邮箱/Mail：grandallhz@grandall.com.cn 关 于 杭州士兰微电子股份有限公司 2024 年年度股东大会 法律意见书 致：杭州士兰微电子股份有限公司 国浩律师（杭州）事务所（以下简称"本所"）接受杭州士兰微电子股份有限 公司（以下简称"公司"）委托，指派律师出席公司 2024 年年度股东大会（以 下简称"本次股东大会"），并依据《 ...