Core Viewpoint - The conference will gather key players in the silicon carbide (SiC) industry, providing a platform for exploring development opportunities and technological advancements in the sector [1]. Conference Details - The conference is scheduled for May 15, from 09:00 to 17:30, at the Shanghai Jin Jiang InterContinental Hotel [2]. - Attendees are encouraged to arrive before 09:00 for timely registration [2]. Transportation Information - From Shanghai Pudong International Airport to the hotel is approximately 37 kilometers, taking about 45 minutes by taxi or 50 minutes via public transport [3]. - From Shanghai Hongqiao International Airport to the hotel is about 20 kilometers, with a taxi ride taking around 35 minutes or 50 minutes using public transport [3]. Conference Agenda - The conference will feature two thematic forums and an all-day exhibition, focusing on the SiC industry [5]. - The launch of the "2025 Silicon Carbide Substrate and Epitaxy Industry Research White Paper" and "2025 Silicon Carbide Devices and Modules Industry Research White Paper" will take place during the event [5]. - The afternoon session will include a seminar on SiC technology applications in electric transportation [5]. Exhibition Highlights - A dedicated exhibition area will showcase new products and technologies from various companies, enhancing networking and collaboration opportunities [7]. - Companies such as Mitsubishi Electric, Guojijinan, and others will present their latest innovations [8]. Sponsorship and Participation - Companies like Hesheng New Materials and Jihua Hengyi are sponsoring the event by providing promotional materials and product information [9].

Core Points - The Shanghai G60 Strategic Emerging Industries Index (G60 Index) rose by 1.23% to 935.77 points, with a trading volume of 15.724 billion yuan [1] - Over the past month, the G60 Index has increased by 7.95%, while it has decreased by 4.89% over the last three months and has seen a year-to-date increase of 0.49% [1] - The G60 Index includes up to 50 of the largest strategic emerging industry companies listed in the Shanghai Stock Exchange from the Yangtze River Delta G60 nine cities, reflecting the overall performance of these companies [1] Index Composition - The top ten weighted companies in the G60 Index are: Jianghuai Automobile (9.64%), Huayou Cobalt (7.32%), Hengsheng Electronics (6.32%), Hengtong Optic-Electric (4.84%), Zhongkong Technology (4.77%), Silan Microelectronics (4.53%), China Jushi (4.47%), Jingfang Technology (2.95%), Naxin Micro (2.73%), and Zejing Pharmaceutical (2.61%) [1] - The G60 Index is fully composed of companies listed on the Shanghai Stock Exchange, with a 100% market share [1] Industry Breakdown - The industry composition of the G60 Index includes: Industrial sector (36.53%), Information Technology (30.24%), Materials (14.25%), Communication Services (9.67%), and Healthcare (9.31%) [2] - The index samples are adjusted biannually, with adjustments occurring on the next trading day after the second Friday of June and December [2] Fund Tracking - Public funds tracking the G60 Index include the Shenwan Hongyuan G60 Strategic Emerging Industries ETF [3]

Core Viewpoint - The upcoming "Electric Transportation & Digital Energy SiC Technology Application and Supply Chain Upgrade Conference" in Shanghai aims to address key challenges and opportunities in the SiC industry, focusing on 8-inch SiC technology and automotive-grade SiC chip manufacturing [2][12]. Group 1: Conference Highlights - The conference will feature nearly 20 leading SiC companies, including Mitsubishi Electric, STMicroelectronics, and Wolfspeed, presenting the latest industry insights and innovative solutions [13]. - A focus on collaborative efforts in the 8-inch supply chain to overcome challenges in material mass production will be highlighted by companies like Tianke Heda and Dazhu Semiconductor [15]. - A roundtable forum will include discussions on the current state and challenges of SiC applications in the new energy market, as well as global development trends for the SiC industry by key players [18]. Group 2: Digital Energy SiC Technology Application Seminar - The morning session will feature presentations from STMicroelectronics, Wolfspeed, and Hong Kong University, discussing advancements in SiC technology and its applications in digital energy [23]. - STMicroelectronics will present its strategies for the Chinese market and advancements in 8-inch SiC wafer technology [23]. - Wolfspeed will showcase how its fourth-generation SiC MOSFET technology is transforming industrial automation and aerospace drive systems [23]. Group 3: Electric Transportation SiC Technology Application Seminar - The afternoon session will include in-depth technical analyses from companies like Mitsubishi Electric and Sanan Semiconductor, focusing on cost reduction and efficiency improvements in electric transportation applications [24]. - Mitsubishi Electric will present its solutions for SiC power semiconductors in high-voltage fast charging and electric drive systems [24]. - Sanan Semiconductor will discuss the latest advancements in packaging technology for SiC power devices [24]. Group 4: SiC Industry Chain Exhibition - The conference will feature a dedicated exhibition area showcasing the latest technologies from various industry players, promoting industry exchange and resource integration [26]. - Companies like Hantian Tiancheng and Zhongdian Guojinan will present their latest SiC products and solutions [27]. Group 5: Launch of SiC White Papers - The conference will also mark the launch of two white papers focusing on the progress and trends in the SiC substrate and epitaxy industry, as well as the applications of SiC in electric transportation and digital energy [28]. - The research initiative aims to create a comprehensive industry consensus covering the entire substrate-device-system chain [28].

Core Insights - The global semiconductor industry is expected to recover in 2024 after a downturn in 2023, driven by national policies aimed at boosting domestic demand, consumption, and technological innovation [1][2] - The market for power semiconductors is projected to decrease from $35.7 billion in 2023 to $32.3 billion in 2024, yet domestic companies like Silan Microelectronics and BYD have significantly increased their market shares [2][3] Group 1: Market Performance - Silan Microelectronics' revenue in the power semiconductor sector is estimated to reach $1.066 billion in 2024, up from $928 million in 2023, with market share rising from 2.6% to 3.3%, making it the sixth largest globally [2][3] - BYD has entered the top ten in global power semiconductor market share with 3.1%, benefiting from a significant increase in its automotive sales, which exceeded 4.27 million units in 2024, a 41.1% year-on-year increase [2][3] Group 2: Industry Trends - Only Silan Microelectronics and BYD saw an increase in market share among the top ten power semiconductor companies in 2024, while leading competitors like Infineon and ON Semiconductor experienced declines [3] - The automotive semiconductor market remains dominated by foreign companies, with the top five holding 48.2% of the market share in 2024, indicating a highly concentrated market [5][6] Group 3: Future Projections - The global automotive semiconductor market is expected to grow nearly 29% over the next three years, reaching a size of $68.4 billion in 2024, with China's automotive semiconductor market projected to reach 120 billion yuan in 2024 and exceed 300 billion yuan by 2030 [6][7] - The demand for automotive chips is driven by the increasing penetration of electric vehicles and advanced driver-assistance systems, with a compound annual growth rate exceeding 25% anticipated for China's market [6][7] Group 4: Company Strategies - Silan Microelectronics is focusing on expanding its automotive semiconductor capabilities, with significant investments in new production lines and projects aimed at enhancing its market position [9][10] - The company has achieved substantial growth in its automotive semiconductor revenue, with a 60% increase in sales from IGBT and SiC products, indicating a strong commitment to innovation and market expansion [8][11]

Core Viewpoint - The legal opinion letter confirms that the procedures for convening and holding the 2025 first extraordinary general meeting of shareholders of Hangzhou Silan Microelectronics Co., Ltd. comply with relevant laws and regulations, ensuring the legitimacy and effectiveness of the meeting and its voting results [1][9]. Group 1: Meeting Procedures - The board of directors published the notice for the extraordinary general meeting on April 24, 2025, detailing the meeting's time, location, and voting methods [4]. - The meeting was held on May 9, 2025, at 2 PM, presided over by the chairman, Chen Xiangdong [4]. - Voting was conducted both on-site and online, with specific timeframes for online voting provided in the notice [4][6]. Group 2: Attendance and Qualifications - Eligible attendees included all shareholders registered with the China Securities Depository and Clearing Corporation Limited as of May 6, 2025, along with company directors, supervisors, and senior management [5]. - A total of 9 shareholders and their proxies attended the meeting in person, representing 550,107,357 shares, or 33.06% of the total voting shares [5]. - Online voting involved 4,174 shareholders, representing 118,044,543 shares, or 7.09% of the total voting shares, leading to a combined attendance of 4,183 shareholders representing 668,151,900 shares, or 40.15% of the total voting shares [6]. Group 3: Voting Procedures and Results - The meeting utilized a combination of on-site and online voting for the proposed resolutions, with results being counted and announced immediately after voting concluded [7]. - The voting results showed that 662,855,393 shares (99.2073%) voted in favor of the resolutions, while 4,087,113 shares (0.6117%) opposed, and 1,209,394 shares (0.1810%) abstained [8]. - For small and medium investors, 112,748,136 shares (95.5131%) voted in favor, with 4,087,113 shares (3.4623%) against, and 1,209,394 shares (1.0246%) abstaining [8]. Group 4: Conclusion - The legal opinion concludes that the convening and holding procedures of the shareholders' meeting, as well as the qualifications of attendees and the voting process, are in compliance with the Company Law, Shareholders' Meeting Rules, and the company's articles of association [9].

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 本次会议是否有否决议案：无 一、会议召开和出席情况 (一) 股东大会召开的时间：2025 年 5 月 9 日 证券代码：600460 证券简称：士兰微 公告编号：临 2025-022 杭州士兰微电子股份有限公司 2025年第一次临时股东大会决议公告 (二) 股东大会召开的地点：浙江省杭州市西湖区黄姑山路 4 号公司三楼大 会议室 (三) 出席会议的普通股股东和恢复表决权的优先股股东及其持有股份情况： | 1、出席会议的股东和代理人人数 | 4,183 | | --- | --- | | 2、出席会议的股东所持有表决权的股份总数（股） | 668,151,900 | | 3、出席会议的股东所持有表决权股份数占公司有表决权 | 40.1516 | | 股份总数的比例（%） | | (四)表决方式是否符合《公司法》及《公司章程》的规定，大会主持情况等 本次股东大会采用现场投票与网络投票相结合的方式对本次股东大会通知 中列明的事项进行了投票表决。现场出席本次股东大会现场会 ...

国浩律师（杭州）事务所 关 于 杭州士兰微电子股份有限公司 2025 年第一次临时股东大会 法律意见书 地址：杭州市上城区老复兴路白塔公园 B 区 2 号、15 号国浩律师楼 邮编：310008 Grandall Building, No.2＆No.15, Block B, Baita Park, Old Fuxing Road, Hangzhou, Zhejiang 310008, China 电话/Tel: (+86)(571) 8577 5888 传真/Fax: (+86)(571) 8577 5643 电子邮箱/Mail：grandallhz@grandall.com.cn 网址/Website：http://www.grandall.com.cn 二〇二五年五月 国浩律师（杭州）事务所 法律意见书 国浩律师（杭州）事务所 关 于 杭州士兰微电子股份有限公司 2025 年第一次临时股东大会 法律意见书 致：杭州士兰微电子股份有限公司 国浩律师（杭州）事务所（以下简称"本所"）接受杭州士兰微电子股份有 限公司（以下简称"公司"）委托，指派律师出席公司 2025 年第一次临时股东 大会（以下简称"本次股东 ...

证券代码：600460 证券简称：士兰微 编号：临 2025-021 杭州士兰微电子股份有限公司 关于召开 2024 年度暨 2025 年第一季度业绩说明会的公告 会议召开时间：2025 年 5 月 14 日（星期三）15:00-16:00 会 议 召 开 地 点 ： 上 海 证 券 交 易 所 上 证 路 演 中 心 （ 网 址 ： http://roadshow.sseinfo.com/） 会议召开方式：上证路演中心视频直播和网络互动 投资者可于 2025 年 5 月 7 日（星期三）至 5 月 13 日（星期二）16:00 前 登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 600460@silan.com.cn 进行提问。公司将在说明会上对投资者普遍关注的问题进 行回答。 杭州士兰微电子股份有限公司（以下简称"公司"）已于 2025 年 4 月 19 日 发布公司《2024 年年度报告》，并已于 2025 年 4 月 30 日发布公司《2025 年第一 季度报告》。为便于广大投资者更全面深入地了解公司 2024 年度及 2025 年第一 季度的经营成果、财务状况，公司计划于 2025 年 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大 遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 证券代码：600460 证券简称：士兰微 编号：临 2025-020 杭州士兰微电子股份有限公司 关于为控股子公司提供日常担保的进展公告 重要内容提示： ● 被担保人名称：杭州士兰集成电路有限公司、杭州士兰集昕微电子有限 公司、杭州美卡乐光电有限公司（以下分别简称"士兰集成"、"士兰集昕"、 "美卡乐"）。士兰集成、士兰集昕和美卡乐均为本公司之控股子公司。 ● 本次担保金额及已实际为其提供的担保余额：2025 年 4 月 1 日至 2025 年4月30日，公司在年度预计日常担保额度内为士兰集成签署了担保金额为0.70 亿元的最高额担保合同，为士兰集昕签署了担保金额为 3.00 亿元的最高额担保 合同，为美卡乐签署了担保金额为 0.25 亿元的最高额担保合同。 截至 2025 年 4 月 30 日，公司为士兰集成实际提供的担保余额为 4.39 亿元， 公司为士兰集昕实际提供的担保余额为 8.39 亿元，公司为美卡乐实际提供的担 保余额为 0.99 亿元；担保余额均在公司相关股东大会 ...

中信证券股份有限公司关于 杭州士兰微电子股份有限公司 2023 年度向特定对象发行股票持续督导 保荐总结报告书 保荐人编号：Z20374000 申报时间：2025 年 4 月 | 一、发行人基本情况 | | | --- | --- | | 发行人名称 | 杭州士兰微电子股份有限公司 | | 发行人英文名称 | Hangzhou Silan Microelectronics Co.,Ltd | | 成立日期 | 1997 年 9 月 25 日 | | 法定代表人 | 陈向东 | | 注册资本 | 元 1,664,071,845.00 | | 注册地址 | 浙江省杭州市黄姑山路 号 4 | | 邮政编码 | 310012 | | 电话 | 0571-88212980 | | 公司网址 | www.silan.com.cn | | 电子信箱 | silan@silan.com.cn | 二、本次发行情况概述 根据中国证券监督管理委员会《关于同意杭州士兰微电子股份有限公司向特 定对象发行股票注册的批复》（证监许可〔2023〕1202 号），并经上海证券交易 所同意，公司获准向特定对象发行人民币普通股（A 股）股 24 ...