经审计，安永华明认为公司财务报表在所有重大方面按照企业会 计准则的规定编制，公允反映了公司 2024 年 12 月 31 日的合并财务 状况以及 2024 年度的合并经营成果和现金流量。安永华明出具了标 准无保留意见的审计报告。 董事会审核委员会监督安永华明会计师事务所（特 殊普通合伙）的履职情况报告 华虹半导体有限公司（以下简称"公司"）聘请安永华明会计师 事务所（特殊普通合伙）（以下简称"安永华明"）作为对公司 2024 年度财务报告出具审计报告的会计师事务所。根据财政部、国务院国 有资产监督管理委员会、中国证券监督管理委员会颁布的《国有企业、 上市公司选聘会计师事务所管理办法》，公司审核委员会切实对安永 在 2024 年度的审计工作情况履行了监督职责。具体情况如下： 一、2024 年年审会计师事务所基本情况 安永华明于 1992 年 9 月成立，2012 年 8 月完成本土化转制，从 一家中外合作的有限责任制事务所转制为特殊普通合伙制事务所。安 永华明总部设在北京，注册地址为北京市东城区东长安街 1 号东方广 场安永大楼 17 层 01-12 室。截至 2024 年末拥有合伙人 251 人，首席 合伙人 ...

| A 股代码：688347 A 股简称：华虹公司 公告编号：2025-008 | | --- | | 港股代码：01347 港股简称：华虹半导体 | 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 华虹半导体有限公司（以下简称"公司"）董事会于 2025 年 3 月 27 日审议 通过了 2024 年度计提资产减值准备相关事宜，具体情况如下： 一、 计提资产减值准备情况概述 结合公司的实际经营情况及行业市场变化等因素的影响，根据《企业会计准 则》和公司会计政策的相关规定，为客观、公允地反映公司截至 2024 年 12 月 31 日的财务状况及 2024 年度的经营成果，经公司及下属子公司对截至 2024 年 12 月 31日合并范围内的各项资产和存货等进行全面充分的评估和分析，本着谨慎性原 则，公司对上述资产进行了减值测试并计提了相应的减值准备。同时对减值影响 因素确认消失的资产，在原已计提的减值损失金额内进行转回。 华虹半导体有限公司 关于 2024 年度计提资产减值准备的公告 二、 2024 年度计提资产减值准备事项 ...

2025 年度"提质增效重回报"行动方案 华虹半导体有限公司（以下简称"公司"、"本公司"、"华虹公司" 或"华虹半导体"）为贯彻落实科创板上市公司"提质增效重回报" 专项行动，践行"以投资者为本"的上市公司发展理念，推动上市公 司持续优化经营、规范治理，大力提高上市公司质量，助力信心提振 和资本市场稳定发展的精神，特制定《华虹半导体有限公司 2025 年 度"提质增效重回报"行动方案》。具体内容如下： 一、专注晶圆代工主营业务，优化运营效率，提升核心竞争力 华虹半导体是全球领先，也是中国大陆最大的特色工艺晶圆代工 企业。立足于先进"特色 IC+功率器件"的战略目标，公司聚焦五大 特色工艺平台，持续为客户提供满足丰富市场需求的特色工艺技术和 晶圆代工服务。根据全球纯晶圆代工企业最新公布的 2024 年销售额 情况，华虹公司位居全球第五位，中国大陆企业第二位。二十多年来， 公司依靠卓越的特色工艺技术实力、可靠的产品性能品质与稳定的产 能供给能力，赢得了全球客户的广泛认可。 1、提升工艺水平，丰富产品组合，开拓新的应用领域 华虹半导体有限公司 过去数个季度，全球半导体市场及晶圆代工行业都经历了一定程 度的低迷和震 ...

华虹半导体有限公司 2024 年度会计师事务所履职情况评估报告 华虹半导体有限公司（以下简称"公司"）聘请安永华明会计师事务所 （特殊普通合伙）（以下简称"安永华明"）作为公司 2024 年度境内财务 报告审计机构。根据财政部、国务院国有资产监督管理委员会、中国证券 监督管理委员会颁布的《国有企业、上市公司选聘会计师事务所管理办法》， 公司对安永华明 2024 年度审计过程中的履职情况进行评估。经评估，公 司认为，安永华明在资质等方面合规有效，履职能够保持独立性，勤勉尽 责，公允表达意见。具体情况如下： 一、资质条件 安永华明于 1992 年 9 月成立，2012 年 8 月完成本土化转制，从一家 中外合作的有限责任制事务所转制为特殊普通合伙制事务所。安永华明总 部设在北京，注册地址为北京市东城区东长安街 1 号东方广场安永大楼 17 层 01-12 室。截至 2024 年末拥有合伙人 251 人，首席合伙人为毛鞍宁先 生。安永华明拥有财政部颁发的会计师事务所执业资格，于美国公共公司 会计监督委员会（US PCAOB）注册，是中国首批获得证券期货相关业务资 格和 H 股企业审计资格事务所之一，在证券业务服务方 ...

Financial Performance - Hua Hong Semiconductor achieved sales revenue of US$2,004 million for the year 2024, with near-full average capacity utilization[19]. - Hua Hong Semiconductor's revenue for 2024 was US$2,004 million, a decrease of 12.3% compared to the previous year[152]. - Revenue from semiconductor wafers accounted for 94.9% of total revenue, amounting to US$1,900,929 thousand, down 12.9% year-over-year[153]. - Revenue from systems and fabless companies was US$1,919,000 thousand, representing 95.8% of total revenue, a decline of 9.0% year-over-year[154]. - The company's revenue from China was US$1,636,528 thousand, making up 81.6% of total revenue, a decrease of 7.8% year-over-year[156]. - The loss for the year was US$140.385 million, compared to a profit of US$126.425 million in 2023, reflecting a significant decline in profitability[177]. - Gross profit for 2024 was US$205.128 million, down 57.9% from 2023, mainly due to decreased average selling prices and increased depreciation costs[173]. - The company reported a 30% increase in net profit for the last quarter, totaling $75 million, compared to the previous quarter[1]. Market Outlook and Strategy - The global semiconductor market is expected to continue its moderate recovery in 2025, driven by increased demand in AI applications and other sectors[22]. - Hua Hong Semiconductor plans to enhance production capacity expansion and optimize its advanced "Specialty IC + Power Discrete" product portfolio in 2025[22]. - The company aims to increase the proportion of high-value products and deepen strategic collaboration with customers and ecosystem partners[22]. - The Hua Hong Manufacturing Project is expected to drive steady revenue growth starting in 2025[20]. - The company is focused on seizing opportunities in the new growth cycle of the semiconductor industry to create sustainable value for shareholders[22]. - Future outlook indicates a projected revenue growth of 15% for the next fiscal year, driven by new product launches and market expansion strategies[1]. Production and Capacity - The company successfully commenced production at its second 12-inch production line in Wuxi ahead of schedule, marking a significant milestone in its "8-inch + 12-inch" strategy[20]. - Wafer shipments increased by 10.8% year-on-year, reaching 4,545 thousand wafers in 2024[162]. - Capacity utilization for 8-inch wafer equivalent rose to 99.5%, an increase of 5.2 percentage points from 2023[161]. - The company plans to ramp up production capacity in 2025 with the new 12-inch production line, aiming for sustained revenue growth[170]. Research and Development - The company is investing $200 million in research and development for new technologies aimed at enhancing integrated circuit manufacturing capabilities[1]. - The Analog & Power Management platform achieved significant revenue growth in 2024, driven by strong demand in AI applications and stable wafer input volumes[165]. - The Logic & RF platform experienced rapid revenue growth, with mass production of 55nm BSI image sensor chips for high-end smartphones[166]. - The 55nm and 65nm technology nodes showed robust revenue growth, with a 50.4% increase in revenue for the 55nm & 65nm segment[158]. Corporate Governance - The company appointed Dr. Peng Bai as President and Executive Director on January 1, 2025, succeeding Mr. Suxin Zhang who resigned on December 31, 2024[41][54]. - The Board comprises nine members, including two Executive Directors and three Independent Non-Executive Directors, ensuring compliance with Listing Rules[88]. - The Company has implemented corporate governance procedures that comply with the principles in the Corporate Governance Code[83]. - The Company has maintained compliance with the Code provisions during the year ended December 31, 2024[85]. - The roles of the Chairman and the President are separate, with the Chairman overseeing overall management and the President handling day-to-day operations[95][96]. Shareholder Communication and Value - The board of directors has approved a dividend payout of $0.10 per share, reflecting a commitment to returning value to shareholders[1]. - The Company has established a shareholders' communication policy to ensure equal and timely access to information for shareholders[125]. - The Company emphasizes its core values of integrity, teamwork, and innovation as key drivers for future growth and customer empowerment[1]. Financial Position and Liabilities - Cash and cash equivalents decreased by 20.2% from US$5,585.2 million in 2023 to US$4,459.1 million in 2024, mainly due to decreased receipts from customers and increased capital investments[192][196]. - Total current liabilities rose by 60.7% from US$972.4 million in 2023 to US$1,562.2 million in 2024, with significant increases in trade payables (26.7%) and other current liabilities (85.1%) due to higher capital expenditures[192][188]. - Interest-bearing bank borrowings increased from US$2,099.6 million in 2023 to US$2,197.9 million in 2024, reflecting increased drawdowns of bank borrowings[189]. - Other current assets surged by 175.5% from US$212.6 million in 2023 to US$585.9 million in 2024, primarily due to increased value-added tax credit[183].

以下文章来源于芯思想 ，作者赵元闯 芯思想 . 中国半导体正能量传播平台。为中国半导体产业服务，我们都是中国半导体产业腾飞的见证人。新闻分 析，精彩评论，独家数据，为您定制信息，欢迎拍名片回复，和行业精英交流。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容转自【芯思想】，作者：赵元闯，谢谢。 2024年前十大专属晶圆代工公司中，增幅排名前三的都超过20%，增幅最高的是台积电（TSMC）， 年增幅32%；其次是晶合集成（Nexchip），年增幅达28%；增幅排名第三的是中芯国际（SMIC）， 达27%。2024年营收唯一出现下滑的是格芯（GlobalFoundries），下滑超过8%。 在IDM厂商代工方面，三星代工2024年营收约1462亿元，英特尔1261亿元，都较2023年下滑7%。 台积电 2023年台积电的3纳米正式贡献营收，到2024年第四季营收占比达26%，全年营收占比18%。 台积电在IEDM 2024大会上首次披露了2nm（N2）工艺的关键技术细节和性能指标： 对比3nm，晶 体管密度增加15％，同等功耗下性能提升15％，同等性能下功耗降低24-35％ ，同时通过NanoFlex技 术 ...

Group 1 - The report highlights a significant decline in IPO activity in China, with 2024 witnessing only 217 new IPOs, a 44% decrease year-on-year, and a total fundraising amount of 139.9 billion yuan, down 64% compared to the previous year, marking the lowest point in nearly a decade [4][7][13] - The decline in IPOs is attributed primarily to policy changes, particularly the introduction of stricter regulations following the "National Nine Articles" in April 2024, which increased the scrutiny of IPO applications and included measures against certain practices like pre-listing dividends [5][6] - The average fundraising amount for new IPOs in 2024 was 645 million yuan, slightly higher than in 2017, but overall, it represents the second-lowest average in the past decade [7][10] Group 2 - In 2024, the proportion of companies choosing to list abroad increased, with 54% of IPOs occurring on foreign exchanges, marking a significant shift from previous years [10][16] - The report notes that the Hong Kong Stock Exchange remains the preferred choice for Chinese companies, while the number of companies listing on U.S. exchanges reached a decade-high of 24% in 2024 [10][16] - The report indicates that the average time from company establishment to IPO has increased, with only 4.65% of companies taking less than three years to go public, highlighting the lengthy process involved in achieving an IPO [43][46] Group 3 - The manufacturing sector dominated the IPO landscape in 2024, with 62 companies in advanced manufacturing and 34 in traditional manufacturing successfully listing, accounting for a significant portion of new IPOs [32][33] - The report emphasizes the differences in industry preferences between A-shares and foreign listings, with traditional manufacturing heavily favoring A-shares, while sectors like artificial intelligence showed a preference for Hong Kong listings [32][33] - The report also notes that over half of the new IPO companies in 2024 had received venture capital funding prior to going public, indicating a strong reliance on external capital for growth [29][30] Group 4 - The report identifies a trend of increasing participation from cornerstone investors in IPOs, with an average of 46% of the fundraising amount in 2024 coming from cornerstone investments, particularly in the Hong Kong market [19][22] - The types of cornerstone investors have diversified, including traditional financial institutions, state-owned enterprises, and even individual angel investors, reflecting a broader interest in supporting new listings [21][22] - The report highlights that the largest IPOs in 2024 were predominantly from companies listing in Hong Kong, with Midea Group raising 30.668 billion HKD, marking the largest IPO of the year [52][55]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 董事會會議日期通知 華虹半導體有限公司（「本公司」）特此通知，本公司謹訂於二零二五年三月二十七 日（星期四）下午三時三十分舉行董事會會議，以商討下列事項： 唐均君 （董事會主席） 白鵬 （總裁） 非執行董事 葉峻 孫國棟 陳博 熊承艷 獨立非執行董事 張祖同 王桂壎太平紳士 封松林 承董事會命 華虹半導體有限公司 董事會主席兼執行董事 唐均君先生 1. 考慮及批准刊發本公司及其附屬公司截至二零二四年十二月三十一日止經審 核全年業績； 2. 考慮派付末期股息（如有）； 3. 考慮暫停辦理股份過戶登記手續（如有需要）； 4. 考慮召開本公司下一屆股東周年大會；及 5. 商議任何其他事項。 中國上海，二零二五年三月十三日 於本公告日期，本公司董事分別為： 執行董事 1 2 ...

Investment Rating - The report indicates a positive investment outlook for the domestic computing power industry, driven by the surge in AI applications and infrastructure investments from major cloud service providers [3]. Core Insights - The demand for AI applications is expected to lead to significant growth in the domestic computing power industry, with major investments from cloud service providers like Alibaba, ByteDance, and Tencent [3][12]. - Advances in semiconductor manufacturing processes are reshaping the global semiconductor landscape, with China making notable progress in advanced processes [3][27]. - AI-enabled devices are anticipated to proliferate across various sectors, including smartphones, PCs, wearables, and IoT devices, with a focus on enhancing user experience through AI integration [3][48]. Summary by Sections Infrastructure: Cloud Providers Leading Domestic Computing Power Breakthrough - Major cloud providers are expected to drive a resurgence in capital expenditures, with Alibaba planning to invest over 380 billion yuan in AI computing centers and data centers over the next three years [12]. - The AIDC hardware spending is projected to benefit from increased demand for computing chips and storage solutions, particularly in the context of AI infrastructure [13]. Advanced Manufacturing: Multi-Dimensional Breakthroughs in Advanced Processes - China has achieved an 8% market share in advanced semiconductor processes as of 2023, with local foundries like SMIC and HHGrace making strides in narrowing the technology gap [27]. - The report highlights the importance of advanced packaging technologies such as CoWoS and SoIC, which are being industrialized in China [37]. Intelligent Terminals: A Blooming Era for Edge AI - The report forecasts that by 2025, the global market for GenAI smartphones will reach approximately 420 million units, representing a year-on-year growth of 82.7% [48]. - Apple is expected to lead in smart edge devices, with significant investments in IoT and wearable technology, enhancing AI capabilities across its product lines [50]. Key Investment Targets - The report identifies several key companies across various sectors, including: - Infrastructure: Lanqi Technology, Demingli, and Jiewate [3]. - Advanced Manufacturing: SMIC, Huahong, and Changdian Technology [3]. - Edge AI/SoC: Xiaomi Group, Lenovo Group, and Rockchip [3]. - Autonomous Driving: Horizon Robotics and Weir Shares [3].

HUA HONG SEMICONDUCTOR LIMITED 張祖同 王桂壎太平紳士 封松林 董事會設立三個委員會。下表提供各董事會成員在該等委員會中所擔任的職位： 董事名單與其角色和職能 執行董事： 唐均君 （董事會主席） 白鵬 （總裁） 非執行董事： 葉峻 孫國棟 陳博 熊承艷 獨立非執行董事： 華虹半導體有限公司 華虹半導體有限公司董事會（「董事會」）成員載列如下： | | | 委員會成員 | | | --- | --- | --- | --- | | 董事 | 提名 | 薪酬 | 審核 | | 唐均君 | C | | | | 白鵬 | | | | | 葉峻 | | M | | | 孫國棟 | | | | | 陳博 | | | | | 熊承艷 | | | M | | 張祖同 | | | C | | 王桂壎太平紳士 | M | C | | | 封松林 | M | M | M | 附註： C 有關董事委員會主席 M 有關董事委員會成員 二零二五年三月七日 ...