Financial Performance - The company reported a revenue of RMB 1.2 billion for the first half of 2024, representing a year-over-year increase of 15%[1]. - The company's revenue for the first half of 2024 reached ¥2,879,569,269.66, representing a 14.27% increase compared to ¥2,519,890,395.68 in the same period last year[18]. - The company achieved operating revenue of 2.88 billion yuan, a year-on-year increase of 14.27%, with a main business revenue growth of 11.51%[78]. - The company reported a significant increase in competitiveness due to strategic collaborations with suppliers, contributing to revenue growth[19]. - The company’s EBITDA for the first half of 2024 was 1.123 billion yuan, an increase of 716 million yuan year-on-year, representing a 176% growth[57]. - The net profit attributable to shareholders improved to -¥470,756,855.48, a reduction in loss of 57.53% from -¥1,108,573,595.43 year-on-year[18]. - The net profit attributable to the parent company was -471 million yuan, a reduction in loss of 638 million yuan compared to the same period last year, marking a 58% year-on-year improvement[57]. Market Expansion and Product Development - The company plans to launch two new semiconductor products in Q3 2024, targeting a market share increase of 10% in the next year[1]. - The company is expanding its market presence in Southeast Asia, aiming for a 25% increase in sales in that region by the end of 2024[1]. - The company has expanded its product range to include BCD, SiC MOSFET, and VCSEL, while initiating the development of dedicated MCUs[28]. - The company is focusing on the development of high-value applications in automotive, industrial control, and high-end consumer sectors, continuously optimizing its product structure[49]. - The company has developed a complete series of power module products widely used in new energy vehicles, smart grids, and other fields, with its packaging technology reaching an international leading level[49]. Research and Development - Research and development expenses increased by 30% to RMB 150 million, focusing on advanced semiconductor technologies[1]. - Research and development expenses accounted for 30.19% of revenue, an increase of 4.40 percentage points compared to 25.79% previously[19]. - The company has established a comprehensive R&D system focusing on power, MEMS, BCD, and MCU technologies, aiming for seamless integration of R&D and mass production[31]. - The company has achieved significant breakthroughs in four major technology areas: power, MEMS, BCD, and MCU, with continuous expansion in market applications[34]. - The company has filed for 83 invention patents during the reporting period, with a total of 632 patents filed to date[37]. Financial Investments and Capital Management - The company invested a total of ¥35.22 billion during the reporting period, a 59.38% increase from ¥22.10 billion in the same period last year[85]. - The company has completed a capital increase of ¥28.875 billion for the "Phase III 12-inch integrated circuit analog mixed chip manufacturing project" in February 2024[85]. - The company has repurchased 88.9 million shares, accounting for 1.26% of the total share capital, with a total transaction amount of approximately 355.37 million yuan[63]. - The company plans to invest a total of 22.2 billion yuan in the 12-inch silicon wafer production line project, with 5.183 billion yuan of capital already paid in[63]. - The company has utilized idle raised funds for cash management, investing in related products[185]. Risk Management and Compliance - The company has identified potential risks related to supply chain disruptions and is implementing measures to mitigate these risks[1]. - The company is exposed to credit risk as it expands its scale and engages with numerous third parties[75]. - The company is subject to macroeconomic fluctuations that could affect demand in the semiconductor industry[77]. - The company has established strict risk management measures for derivative investments, including forward foreign exchange contracts, to mitigate exchange rate risks[90]. - The company has committed to ensuring the authenticity and completeness of the information disclosed, taking legal responsibility for any violations[167]. Environmental and Social Responsibility - The company invested ¥5,669.22 million in environmental protection during the reporting period[101]. - The company achieved compliance with all emission standards, with maximum concentrations for sulfur dioxide at 12 mg/m³, nitrogen oxides at 6 mg/m³, and particulate matter at 7 mg/m³[103]. - The company actively participates in poverty alleviation and rural revitalization initiatives, creating numerous job opportunities in the local area[112]. - The company has implemented a self-monitoring plan for emissions, with all indicators meeting standards during the reporting period[108]. - The company has established an emergency response plan for environmental incidents and conducts regular training and drills[107]. Shareholder Commitments and Governance - The company has established long-term commitments regarding the authenticity, accuracy, and completeness of the information provided, involving directors and major shareholders[119]. - The company commits to minimizing related party transactions without adversely affecting the interests of the issuer and other shareholders[124]. - The company will ensure compliance with relevant laws and regulations regarding share transfer and management during the lock-up period[130]. - The company’s major shareholders also commit to taking responsibility for any violations of the commitments made in the prospectus[154]. - The company will publicly disclose reasons for not implementing stabilization measures and apologize to investors if such measures are not taken[138].

芯联集成电路制造股份有限公司 独立意见 芯联集成电路制造股份有限公司 独立董事关于第一届董事会第二十五次会议 (本页以下无正文) 芯联集成电路制造股份有限公司 独立意见 （本页无正文,为《芯联集成电路制造股份有限公司独立董事关于第一届董事会 第二十五次会议相关事项的独立意见》之签署页 ) 相关事项的独立意见 根据《中华人民共和国公司法》《公司章程》等相关法律法规和公司制度的 规定,作为芯联集成电路制造股份有限公司(以下简称"公司")的独立董事,我 们对公司 2024 年 8 月 30 日召开的第一届董事会第二十五次会议审议的相关议 案进行了认真的核查,现就本次会议相关议案发表如下独立意见: 一、关于2024年半年度募集资金存放与实际使用情况的专项报告的独立意 風 独立董事认为:公司 2024 年半年度募集资金的存放与使用符合《上市公司 监管指引第2号一上市公司募集资金管理和使用的监管要求》及《上海证券交易 所科创板上市公司自律监管指引第1号 -- 规范运作》等相关法律法规的要求。 公司编制的《2024 年半年度募集资金存放与实际使用情况的专项报告》体现了 公司募集资金存放和使用的实际情况。公司已及时、真实、准 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-060 芯联集成电路制造股份有限公司 第一届监事会第十七次会议决议公告 （二）审议通过《关于 2024 年半年度募集资金存放与实际使用情况 的专项报告的议案》 1 监事会认为：公司 2024 年半年度募集资金的存放与使用符合《上市 公司监管指引第 2 号—上市公司募集资金管理和使用的监管要求》及 《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运作》 等相关法律法规的要求，不存在违规使用募集资金的行为，不存在改变 或变相改变募集资金投向和损害股东利益的情况。公司已披露的相关信 息及时、真实、准确、完整地反映了募集资金管理情况，如实履行了信 息披露义务。 综上，监事会同意公司编制的 2024 年半年度募集资金存放与实际使 用情况的专项报告。 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 芯联集成电路制造股份有限公司（以下简称"公司"）第一届监事 会第十七次会议于 2024 年 8 月 30 日以现场结合通讯方式召开。会议通 知于 2024 年 8 ...

芯联集成电路制造股份有限公司 关于公司 2024 年度提质增效重回报专项行动方案的 一、聚焦经营主业，提升核心竞争力 上半年，公司上下紧紧围绕"持续提升公司核心竞争力，发挥一站式系统代 工模式的优势，聚焦重点客户的核心需求，抓住国产芯片导入时间窗口同时加强 研发力度，不断推出稀缺工艺技术平台"这一纲领，不断提升公司经营质量。 从公司上半年的经营业绩来看，公司精细化管理卓有成效。一方面，新能源 汽车与消费电子市场的需求持续增长，为公司带来了双引擎增长动力。另一方面， 公司推行的生产管理的持续优化也为公司提供了坚实的运营基础，并带来了显著 的成本效益。在上述因素的协同作用下，公司 2024 年上半年经营业绩实现了全 方位增长。 报告期内，公司实现营业收入 28.80 亿元，较上年同期增长 14.27%，其中 主营业务收入增幅 11.51%，保持了良好的增长势头。归属于上市公司股东的净 利润为-4.70 亿元，实现同比大幅减亏 57.53%。剔除年度折旧及摊销费用 20.46 亿元后，公司上半年实现 EBITDA（息税折旧摊销前利润）11.23 亿元，与上年同 期相比增加 7.16 亿元，同比增长 175.74%。 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-057 芯联集成电路制造股份有限公司 关于发行股份及支付现金购买资产事项的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 二、本次交易的进展情况 2024 年 6 月 21 日，公司第一届董事会第二十四次会议审议通过了《关于公 司发行股份及支付现金购买资产暨关联交易方案的议案》等与本次交易相关的议 案。具体内容详见公司于 2024 年 6 月 22 日在上海证券交易所网站 （www.sse.com.cn）披露的《芯联集成电路制造股份有限公司发行股份及支付现 金购买资产暨关联交易预案》等相关公告。 2024 年 7 月 20 日，公司披露了《芯联集成电路制造股份有限公司关于发行 股份及支付现金购买资产事项的进展公告》（公告编号：2024-055 号）。 自预案披露以来，公司、各中介机构及其他相关方正在积极推进本次交易的 相关工作。截至本公告披露日，本次交易所涉及的审计、评估及尽职调查等工作 尚未完成。在审计、评估及尽职调查等工作完成后，公司将再次召开董事会 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-056 芯联集成电路制造股份有限公司 关于以集中竞价交易方式回购股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/4/15，由董事长丁国兴先生提议 | | --- | --- | | 回购方案实施期限 | 2024/4/13~2025/4/12 | | 预计回购金额 | 万元~40,000 万元 20,000 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 万股 8,890.0084 | | 累计已回购股数占总股本比例 | 1.2603% | | 累计已回购金额 | 万元 35,536.5948 | | 实际回购价格区间 | 元/股~4.13 元/股 3.80 | 特此公告。 芯联集成电路制造股份有限公司董事会 2024 年 8 月 2 日 二、 回购股份的进展情况 根据《上市 ...

Summary of Conference Call Industry Overview - The discussion focuses on the semiconductor industry, particularly the automotive chip market, from the perspective of chip manufacturers [1] Core Insights and Arguments - The speaker, Yuan Feng, emphasizes the importance of understanding the automotive chip market dynamics and trends [1] - There is a growing demand for automotive chips due to the increasing integration of technology in vehicles [1] - The speaker highlights the challenges faced by chip manufacturers, including supply chain disruptions and the need for innovation to meet evolving automotive requirements [1] Additional Important Content - The call aims to provide insights while allowing ample time for investor questions, indicating a focus on transparency and engagement with stakeholders [1]

Summary of Conference Call Industry Overview - The discussion focuses on the semiconductor market, specifically from the perspective of chip manufacturers regarding automotive chips [1] Core Insights and Arguments - The speaker, Yuan Feng, emphasizes the importance of understanding the automotive chip market dynamics [1] - There is a growing demand for automotive chips due to the increasing integration of technology in vehicles [1] Additional Important Content - The call aims to provide insights while allowing ample time for investor questions, indicating a focus on investor engagement and transparency [1]

Overview of China's New Energy Vehicle Industry - China holds approximately 60% of the global market share in the new energy vehicle (NEV) sector, becoming a leading exporter and home to six of the top ten global battery manufacturers [1][2]. - Despite significant growth, Chinese NEV companies still lag behind leading international firms in profitability, indicating that the industry is in its early stages [1][2]. Company Business Introduction - ChipLink Integrated Circuit Manufacturing Co., Ltd. focuses on the research and production of NEV chips, covering 70% of the chip requirements for a smart connected vehicle [2][3]. - In 2023, nearly 50% of the company's revenue came from automotive chip business, while industrial control accounted for about 30% [2][3]. - The company has established over 20 "design win" projects, indicating deep collaboration with automotive manufacturers from the design phase [2][3]. Key Business Segments Sensor Business - ChipLink is the largest sensor manufacturer in China, expanding its product range to include automotive-grade sensors such as LiDAR and pressure sensors [2][3]. Power Devices - The company ships 110,000 equivalent 8-inch IGBTs monthly, with a significant focus on the NEV sector [3]. - The latest generation of products has reached international standards, with a production lead time of three months for major domestic clients [3]. Silicon Carbide (SiC) - SiC revenue grew by over 300% year-on-year, with expectations to exceed 1 billion in sales for the year [3]. - ChipLink is the only company in China capable of integrating SiC devices into vehicle drives [3]. High-Voltage Analog ICs - The domestic market for high-voltage analog ICs is underdeveloped, with a localization rate below 5% [3]. - ChipLink has established 12 platforms for high-voltage analog ICs, anticipating explosive growth in this segment over the next three years [3]. Market Trends and Challenges - The localization rate of NEV chips in China is currently around 10-15%, indicating substantial room for improvement [3][4]. - The automotive industry is shifting towards centralized control architectures, reducing the number of required chips per vehicle [4][5]. - ChipLink aims to standardize components to adapt to this trend, integrating multiple functions into single chips [5]. Strategic Partnerships and Future Outlook - The company has formed strategic partnerships with major automotive manufacturers, enhancing its position in the supply chain [6][7]. - ChipLink invests 20-35% of its annual revenue into R&D, the highest in the industry, to maintain its competitive edge [4][6]. - The goal is to capture 30% of the global SiC market share, leveraging China's technological advantages in the NEV sector [8]. Conclusion - ChipLink Integrated Circuit Manufacturing Co., Ltd. is positioned as a key player in the rapidly evolving NEV market, focusing on innovation and strategic partnerships to enhance its competitive advantage and drive localization efforts in the automotive semiconductor industry [6][8].

Summary of Conference Call on Automotive Semiconductor Industry Company and Industry Overview - The discussion revolves around the automotive semiconductor industry, specifically focusing on the company Xinlian Integrated (新联集成) and its role in the electric vehicle (EV) market [1][2][3]. Key Points and Arguments Industry Growth and Market Position - China's new energy vehicle (NEV) sales have reached a global market share of 60%, making it the largest exporter of automobiles [2]. - Six out of the top ten battery manufacturers globally are Chinese companies, indicating strong domestic capabilities in the supply chain [2]. - Despite the rapid growth of NEVs, profitability remains a challenge, as evidenced by Toyota's profits exceeding the combined profits of 18 listed Chinese companies [3]. Competitive Landscape - The term "卷" (competition) is highlighted as a critical factor in the NEV market, emphasizing that competition should not solely focus on pricing but also on product definition, technology, and brand strength [4][5]. - The company aims to enhance its competitiveness by improving technology in smart and connected vehicles [4]. Technological Advancements - The pursuit of next-generation battery technologies, such as solid-state and fuel cells, is ongoing, with significant advancements in silicon carbide (SiC) technology being noted [6]. - SiC applications in mainstream Chinese automakers can improve energy conversion efficiency by 5% to 8% [6]. Revenue and Product Segmentation - Xinlian Integrated's revenue is heavily reliant on the automotive sector, accounting for nearly 50% of its income, with industrial control contributing about 30% [10][11]. - The company has developed a wide range of automotive chips, with over 1,000 types of chips used in a single smart connected vehicle [10]. Strategic Collaborations - The company has established strategic partnerships with over 20 automotive manufacturers, focusing on collaborative design projects to reduce costs from the design phase [12][13]. - Xinlian Integrated is recognized as the largest MEMS (Micro-Electro-Mechanical Systems) manufacturer in China, with rapid growth in sensor business [13]. Future Growth Projections - The company anticipates a compound annual growth rate (CAGR) of over 260% in high-voltage analog ICs over the next three years, driven by the establishment of 12 automotive-grade platforms [18]. - The SiC revenue is projected to exceed 1 billion yuan this year, with a CAGR of 60% expected in the coming years [26]. Challenges and Opportunities - The current domestic localization rate for automotive semiconductors is estimated at 10% to 15%, indicating significant room for growth [20]. - The company emphasizes the importance of capturing end-user demand to drive semiconductor localization efforts [20]. Integration and System Solutions - Xinlian Integrated is moving towards providing integrated solutions rather than just individual chips, aiming to reduce costs for automotive manufacturers by 40% to 60% through system integration [30][32]. - The company is also focusing on developing complete systems, such as inverter systems, to enhance its competitive edge [33][34]. Market Dynamics - The recent surge in interest in semiconductor localization is attributed to both competitive pressures and the need for supply chain security in extreme scenarios [47][48]. - The company is positioned to leverage its partnerships with leading automotive manufacturers to drive innovation and cost reduction in the semiconductor space [36][37]. Additional Important Insights - The discussion highlights the importance of a robust IP library and manufacturing capabilities to support rapid product development and market entry [21][22]. - The company’s strategy includes continuous investment in R&D, with 20% to 35% of annual sales revenue allocated to this area, ensuring it remains competitive in the fast-evolving semiconductor landscape [25]. This summary encapsulates the key insights from the conference call, focusing on the automotive semiconductor industry, the strategic positioning of Xinlian Integrated, and the broader market dynamics influencing growth and competition.