江苏华海诚科新材料股份有限公司（以下简称"公司"）第三届监事会第二 十四次会议于 2025 年 5 月 26 日（星期一）在连云港经济技术开发区东方大道 66 号江苏华海诚科新材料股份有限公司会议室以现场结合通讯的方式召开。会 议通知已于 2025 年 5 月 21 日通过邮件的方式送达各位监事。本次会议应出席监 事 3 人，实际出席监事 3 人。 会议由监事会主席陈青主持，公司高级管理人员列席会议。会议召开符合 有关法律、法规、规章和《公司章程》的规定。出席会议的监事对各项议案进行 了认真审议并做出了如下决议： 二、监事会会议审议情况 （一）审议通过《关于公司取消监事会、修订<公司章程>并办理工商变更 登记的议案》 监事会认为：本次取消监事会并修订《公司章程》事项系根据《中华人民共 和国公司法（2023 年修订）》《关于新<公司法>配套制度规则实施相关过渡期 安排》《上市公司章程指引（2025 年修订）》《上海证券交易所科创板股票上 市规则（2025 年 4 月修订）》等有关规定进行，我们同意取消监事会，由董事 会审计委员会行使监事会职权，并对《公司章程》进行修订，同时，《江苏华海 诚科新材料股份有限公司监 ...

经审阅公司第四届董事会独立董事候选人杨林先生、赵建坤先生的个人履历 等相关资料,上述独立董事候选人未持有公司股份,与公司控股股东、实际控制人、 持有公司 5%以上股份的股东及其他董事、监事、高级管理人员之间不存在关联 关系,不存在《公司法》及《公司章程》规定的不得担任董事的情形;不存在被中 国证监会确定为市场禁入者且尚在禁入期的情形,也不存在被证券交易所公开认 定不适合担任上市公司董事的情形,不属于失信被执行人,符合《公司法》《上海 证券交易所科创板股票上市规则》《上市公司独立董事管理办法》等相关法律法 规、规范性文件及《公司章程》规定的任职资格和独立性要求。 上述独立董事候选人具有丰富的专业知识,熟悉相关法律、行政法规、规章 与规则,其任职资格、教育背景、工作经历、业务能力符合公司独立董事任职要 求。 同时，杨林先生具有丰富的会计专业知识和工作经验。 综上,我们同意提名杨林先生、赵建坤先生为公司第四届董事会独立董事候 选人,并同意将该事项提交公司董事会审议。 江苏华海诚科新材料股份有限公司第三届董事会提名委员会 关于公司第四届董事会独立董事候选人 任职资格的审查意见 根据《中华人民共和国公司法》(以下简称" ...

截至5月19日收盘，中证半导体材料设备主题指数上涨0.68%，成分股富创精密上涨8.08%，三佳科技上 涨4.85%，华海诚科上涨4.33%，金宏气体上涨3.63%，沪硅产业上涨2.86%。半导体材料ETF （562590）上涨0.47%，最新价报1.07元。 半导体材料ETF（562590）及其联接基金（A/C：020356；020357）紧密跟踪中证半导体材料设备指 数，指数中半导体设备（55.8%）、半导体材料（21.3%）占比靠前，合计权重超77%，充分聚焦指数主 题，锚定半导体产业发展，精准锚定芯片制造相关领域，覆盖光刻胶、大硅片、刻蚀机等关键赛道，直 击芯片产业国产化刚需，为投资者捕捉半导体产业升级红利。 （文章来源：每日经济新闻） 消息方面，今日小米集团创始人、董事长兼CEO雷军在个人社交平台发布消息，小米自主研发设计的 3nm制程手机处理器芯片玄戒O1即将亮相。 2024年，中国集成电路出口额首次突破万亿元大关，从设计、制造到封装测试，我国半导体产业链各个 环节都取得了显著进展，小米突破3nm先进制程设计是我国半导体产业又一个令人振奋的好消息。 流动性方面，半导体材料ETF盘中换手2.31%， ...

光大证券股份有限公司关于江苏华海诚科新材料股份有限公司 2024年年度持续督导跟踪报告 | 保荐机构名称：光大证券股份有限公司 | 被保荐公司名称：江苏华海诚科新材料股份有限公司 | | --- | --- | | 保荐代表人姓名：王如意 | 联系方式：021-22169999 | | | 联系地址：上海市静安区新闸路 1508 号 | | 保荐代表人姓名：岑圣锋 | 联系方式：021-22169999 | | | 联系地址：上海市静安区新闸路 1508 号 | 根据《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》 等有关法律、法规的规定，光大证券股份有限公司（以下简称"光大证券"或"保 荐机构"）作为江苏华海诚科新材料股份有限公司（以下简称"华海诚科""公司"） 持续督导工作的保荐机构，负责华海诚科上市后的持续督导工作，并出具 2024 年年 度持续督导跟踪报告。 一、持续督导工作的情况 | 序号 | 工作内容 | 持续督导工作情况 | | --- | --- | --- | | | | 保荐机构已建立健全并有效执 | | | 建立健全并有效执行持续督导工作制度，并针对具 | 行了持续督 ...

Group 1: Market Performance - As of May 9, 2025, the CSI Semiconductor Industry Index (931865) decreased by 2.42% [3] - Major component stocks such as SMIC (688981) and Huahai Chengke (688535) saw declines of 4.26% and 4.16% respectively [3] - The Semiconductor Industry ETF (159582) fell by 2.32%, with the latest price at 1.43 yuan [3] Group 2: Industry Trends - The semiconductor industry has entered a recovery cycle since the second half of 2023, driven by AI demand and domestic substitution trends [4] - Revenue and net profit are expected to maintain growth in Q1 2024 and Q1 2025, with profitability gradually recovering from the second half of 2024 [4] Group 3: ETF Performance - The Semiconductor Industry ETF has seen a net value increase of 42.67% over the past year, ranking 113 out of 2785 index equity funds [5] - The ETF's highest monthly return since inception was 20.82%, with a historical one-year profit probability of 100% [5] - The ETF's management fee is 0.50%, and the custody fee is 0.10%, which are among the lowest in comparable funds [5] Group 4: Top Holdings - As of April 30, 2025, the top ten weighted stocks in the CSI Semiconductor Industry Index accounted for 76.35% of the index [6] - The top stocks include Northern Huachuang (002371) and Zhongwei Company (688012), with respective weights of 15.51% and 12.80% [8]

Investment Rating - The report maintains a "Buy" rating for several key companies in the semiconductor and AI sectors, including 中芯国际 (SMIC), 海光信息 (Haiguang), and others, indicating strong growth potential in the domestic AI and computing landscape [5][6]. Core Insights - The domestic AI landscape is witnessing significant advancements with the emergence of models like 豆包 (Doubao) and DeepSeek, which are leading the charge in multi-modal and lightweight AI model development, respectively [1][2]. - The report highlights a shift towards domestic computing power solutions, with chip manufacturers rapidly adapting to the evolving AI ecosystem, particularly through advancements in semiconductor processes and AI training capabilities [2][3]. - There is a notable increase in capital expenditure among cloud computing firms, driven by the rising demand for AI computing infrastructure, which is expected to lead to a "volume and price rise" scenario in the cloud computing market [3][4]. Summary by Sections Section 1: Breakthroughs in Domestic AI Models - 豆包 has emerged as a leading multi-modal model, enhancing capabilities in speech, image, and code processing, with a significant release of its visual understanding model in December 2024 [1][11]. - DeepSeek focuses on lightweight model upgrades, achieving a remarkable cost-performance ratio with its DeepSeek-V3 model, which has 671 billion total parameters and costs only 557.6 million USD, positioning it among the world's top models [1][12]. - The rapid iteration of domestic models, including updates from 通义千问 and others, reflects a competitive landscape that is accelerating the development of AI applications [1][34]. Section 2: Advancements in Domestic Computing Power - 中芯国际 is advancing its semiconductor processes, with N+1 and N+2 technologies being developed to support the growing demand for AI chips, achieving significant performance improvements [2][56]. - The report notes that the domestic chip industry is evolving, with companies like 昇腾 (Ascend) and others making strides in AI training and inference capabilities, thereby reducing reliance on international competitors [2][59]. - The cloud computing sector is experiencing a capital expenditure boom, with companies like 华勤 and 浪潮 rapidly deploying servers that are compatible with domestic computing power solutions [3][4]. Section 3: Infrastructure and Supply Chain Developments - The report emphasizes the need for enhanced computing infrastructure to meet the surging demand for AI applications, with significant investments being made in server and power supply innovations [3][4]. - Innovations in power supply and cooling systems, particularly the shift from traditional air cooling to liquid cooling, are becoming essential to support the increasing power density in data centers [4]. - The report identifies key players in the supply chain, including companies in power supply, cooling, and server manufacturing, that are poised to benefit from the growth of the AI and computing sectors [5].

Core Viewpoint - The company Huahai Chengke reported a mixed financial performance for Q1 2025, with revenue growth but a significant decline in net profit due to increased costs related to employee stock incentives and depreciation from new facilities [1][2]. Financial Performance Summary - Q1 2025 revenue reached 83.87 million yuan, a year-on-year increase of 15.84% compared to 72.40 million yuan in the same period last year [2]. - Net profit attributable to shareholders decreased by 43.56% to 7.21 million yuan from 12.77 million yuan year-on-year [2]. - The company's net profit after excluding non-recurring items fell by 48.97% to 6.56 million yuan from 12.86 million yuan year-on-year [2]. Annual Performance Overview - For the full year 2024, Huahai Chengke achieved a revenue of 332 million yuan, up 17.23% from 283 million yuan in 2023 [3]. - The net profit attributable to shareholders for 2024 was 40.06 million yuan, reflecting a 26.63% increase from 31.64 million yuan in 2023 [3]. - The net profit after excluding non-recurring items rose by 24.59% to 34.13 million yuan from 27.40 million yuan year-on-year [3]. Product and Market Insights - Huahai Chengke specializes in the research, production, and sales of epoxy molding compounds and electronic adhesives, primarily used in semiconductor packaging and board-level assembly [4]. - The production of epoxy molding compounds reached 12,400 tons in the reporting period, marking a 20.40% increase, with revenue from this segment at 316 million yuan, up 18.81% [4]. - The adhesive segment saw a production decline of 20.92% to 36.23 tons, but revenue increased by 8.44% to 15 million yuan, with a gross margin of 35.05%, down 7.02 percentage points from the previous year [4]. Strategic Initiatives - The company is planning to acquire 100% of Hengsu Huawai through a combination of cash and stock issuance, which is expected to enhance production scale and efficiency [5]. - A project to build a high-density integrated circuit and system-level module packaging epoxy molding compound facility is underway, with an expected annual production capacity of 11,000 tons upon completion [5]. - As of the reporting period, the company has invested 184 million yuan in fundraising projects, achieving 63.83% of the planned progress [5].

证券代码：688535 证券简称：华海诚科 公告编号：2025-030 江苏华海诚科新材料股份有限公司 关于股份回购进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/12/31 | | --- | --- | | 回购方案实施期限 | 待董事会审议通过后 12 个月 | | 预计回购金额 | 2,500万元~5,000万元 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 √用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 39.15万股 | | 累计已回购股数占总股本比例 | 0.49% | | 累计已回购金额 | 2,753.91万元 | | 实际回购价格区间 | 62.17元/股~88.99元/股 | 一、回购股份的基本情况 江苏华海诚科新材料股份有限公司（以下简称"公司"）于 2024 年 12 月 27 日召开第三届董事会第二十一次会议，审议通过了《关于以集中竞价方式回购公 司股份方案的议案》，同意自 ...

Core Viewpoint - The company, Jiangsu Huahai Chengke New Materials Co., Ltd., emphasizes its commitment to transparency and accuracy in financial reporting, as well as its strategic focus on enhancing core competitiveness through innovation and sustainable development [1][7][10]. Financial Data - The first quarter financial report for 2025 has not been audited, and the company has provided key financial data and indicators in RMB [2][5]. - The company reported a total of 94,656 shares repurchased, accounting for 0.12% of the total share capital, with a total expenditure of approximately RMB 7.999 million [4]. Shareholder Information - The company plans to repurchase shares using its own funds and bank loans, with a total repurchase amount between RMB 25 million and RMB 50 million, and a maximum price of RMB 121.99 per share [4][10]. Business Strategy - The company is focused on deepening its core business in semiconductor packaging materials, aiming to enhance its R&D capabilities and product offerings in response to emerging technologies such as AI, 5G, and IoT [11][10]. - The company plans to continue its high investment in R&D, with a reported R&D expenditure of RMB 26.41 million in 2024, reflecting a year-on-year increase of 7.15% [12][10]. Mergers and Acquisitions - The company has acquired a 30% stake in Hengsuo Huawai Electronics and plans to acquire the remaining 70% through a combination of shares, convertible bonds, and cash, which will enhance its capabilities in semiconductor packaging materials [15][10]. Corporate Governance - The company is committed to improving its governance structure and compliance with relevant laws and regulations, ensuring a clear division of responsibilities among its board, supervisory board, and management [16][10]. Investor Relations - The company prioritizes effective communication with investors and aims to enhance the quality of its disclosures and investor engagement through various channels [18][10]. Social Responsibility - The company adheres to its core values of integrity, technological innovation, and quality excellence, while actively fulfilling its social responsibilities and contributing to the stability of the capital market [19][10].

证券代码：688535 证券简称：华海诚科 公告编号：2025-029 表决结果：3 票同意，0 票反对，0 票弃权。 一、监事会会议召开情况 江苏华海诚科新材料股份有限公司（以下简称"公司"）第三届监事会第二 十三次会议于 2025 年 4 月 29 日（星期二）在连云港经济技术开发区东方大道 66 号江苏华海诚科新材料股份有限公司会议室以现场结合通讯的方式召开。会 议通知已于 2025 年 4 月 24 日通过邮件的方式送达各位监事。本次会议应出席监 事 3 人，实际出席监事 3 人。 会议由监事会主席陈青主持，公司高级管理人员列席会议。会议召开符合有 关法律、法规、规章和《公司章程》的规定。出席会议的监事对各项议案进行了 认真审议并做出了如下决议： 二、监事会会议审议情况 （一）、审议通过《关于公司 2025 年第一季度报告的议案》 经审议，监事会认为：公司已严格按照各项法律、法规、规范性文件的要求 规范运作，公司《2025 年第一季度报告》的编制和审议程序符合相关法律、行 政法规和中国证监会的相关规定，报告的内容真实、全面、公允地反映了公司本 报告期的财务状况及经营成果。我们保证公司《2025 年第一 ...