证券日报网1月30日讯，华海诚科在接受调研者提问时表示，衡所华威的产品体系全面覆盖基础、高性 能、先进封装多个层次，在国内外众多细分应用领域处于领先地位。在国内中高端半导体封装材料被外 资厂商垄断的背景下，衡所华威立足于高性能封装的同时，积极布局先进封装领域，推动高端产品的产 业化。衡所华威产品结构聚焦于高性能产品的同时，在先进封装领域不断拓展，产品终端应用涉及汽车 电子、新能源、第三代半导体、工业领域、消费电子、物联网、光伏等领域，形成了较为显著的产品体 系优势。衡所华威主要以封装技术演进趋势与客户定制化需求为导向，凭借扎实的研发实力与丰富的实 践经验，在产品配方与生产工艺等方面进行持续研发与技术攻关，实现从低端到高端产品全面覆盖的技 术体系，可实现灵活快速的研发需求响应。 ...

证券日报网1月30日讯，华海诚科在接受调研者提问时表示，国内的环氧塑封料市场，高性能类占比最 高；基础类因单价较低，占比相对较小；先进封装类占比也较低。 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulation materials market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and Dow are currently dominant in various segments, but domestic firms are rapidly advancing [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to compete effectively against established international players [8].

1月27日，华海诚科涨5.71%，截至发稿，报133.49元/股，成交5.42亿元，换手率8.13%，总市值128.17 亿元。 资料显示，江苏华海诚科新材料股份有限公司位于江苏省连云港市经济技术开发区东方大道66号，成立 日期2010年12月17日，上市日期2023年4月4日，公司主营业务涉及研发生产销售用于半导体器件、特种 器件、集成电路及稀土永磁无铁芯电机、LED支架等电子封装材料产品。主营业务收入构成为：环氧塑 封材料92.80%，胶黏剂6.23%，其他0.98%。 从华海诚科十大流通股东角度 数据显示，嘉实基金旗下1只基金位居华海诚科十大流通股东。嘉实竞争力优选混合A（010437）三季 度新进十大流通股东，持有股数81.39万股，占流通股的比例为1.55%。根据测算，今日浮盈赚取约 586.86万元。 嘉实竞争力优选混合A（010437）成立日期2021年2月24日，最新规模26.07亿。今年以来收益6.84%， 同类排名3458/8861；近一年收益57.71%，同类排名1339/8126；成立以来亏损22.36%。 嘉实竞争力优选混合A（010437）基金经理为杨欢。 截至发稿，杨欢累计任职时 ...

1月26日，华海诚科跌5.16%，截至发稿，报125.39元/股，成交4.54亿元，换手率6.74%，总市值120.39 亿元。 资料显示，江苏华海诚科新材料股份有限公司位于江苏省连云港市经济技术开发区东方大道66号，成立 日期2010年12月17日，上市日期2023年4月4日，公司主营业务涉及研发生产销售用于半导体器件、特种 器件、集成电路及稀土永磁无铁芯电机、LED支架等电子封装材料产品。主营业务收入构成为：环氧塑 封材料92.80%，胶黏剂6.23%，其他0.98%。 从华海诚科十大流通股东角度 数据显示，嘉实基金旗下1只基金位居华海诚科十大流通股东。嘉实竞争力优选混合A（010437）三季 度新进十大流通股东，持有股数81.39万股，占流通股的比例为1.55%。根据测算，今日浮亏损失约 555.11万元。 嘉实竞争力优选混合A（010437）成立日期2021年2月24日，最新规模26.07亿。今年以来收益7.9%，同 类排名3273/9003；近一年收益62.71%，同类排名1253/8185；成立以来亏损21.59%。 嘉实竞争力优选混合A（010437）基金经理为杨欢。 截至发稿，杨欢累计任职时间 ...

Group 1 - The company is actively positioning itself in advanced packaging technologies, which are essential for the miniaturization and multifunctionality of electronic products, with a focus on technologies like flip chip, wafer-level, system-level, fan-out, 2.5D/3D, and Chiplet [1] - The market share of advanced packaging is continuously increasing, surpassing traditional packaging, creating significant opportunities for advanced packaging materials [1] - The completion of the acquisition of Hengsuo Huawai allows the company to leverage its subsidiary Hysolem's R&D advantages in advanced packaging to accelerate the development and mass production of high thermal conductivity encapsulants and other advanced packaging materials [1] Group 2 - The demand for high-performance packaging materials is driven by the explosive growth in electric vehicle sales and the increasing number of electronic devices in automobiles, leading to unprecedented opportunities in the automotive-grade chip packaging materials industry [2] - According to Omdia, the global automotive-grade chip market is expected to reach $80.4 billion by 2025, indicating substantial market potential and growth [2] - The company has made significant progress in the R&D of epoxy encapsulants for advanced packaging and automotive-grade chips, with some products already in mass production and plans for new intelligent production lines that will add approximately 10,000 tons of capacity upon reaching full production [2] Group 3 - The company projects revenues of 380 million, 1.01 billion, and 1.26 billion yuan for the years 2025, 2026, and 2027, respectively, with net profits of 26 million, 103 million, and 139 million yuan for the same years, maintaining a "buy" rating [3]

Investment Rating - The report maintains a "Buy" rating for the company [5][12] Core Insights - The company is actively expanding its advanced packaging capabilities to drive the industrialization of high-end products, leveraging advanced packaging technologies such as flip chip, wafer-level, system-level, and 2.5D/3D packaging to meet the growing demand for miniaturization and multifunctionality in electronic products [3] - The acquisition of Hysolem, a subsidiary in South Korea, is expected to enhance the company's R&D capabilities in advanced packaging materials, enabling rapid development and mass production of high thermal conductivity encapsulants and other advanced materials [3] - The automotive sector is experiencing explosive growth in demand for automotive-grade chips, with a projected market demand of $80.4 billion by 2025, which is driving the need for high-performance packaging materials [4] - The company anticipates revenues of 3.8 billion, 10.1 billion, and 12.6 billion yuan for the years 2025, 2026, and 2027, respectively, with net profits of 0.26 billion, 1.03 billion, and 1.39 billion yuan for the same years [5] Company Overview - The company specializes in semiconductor packaging materials, including epoxy molding compounds and electronic adhesives, and aims to become a global leader in high-end packaging materials [12] - The company has completed the acquisition of Hengsuo Huawai, which will allow it to focus on optimizing product and customer structures to enhance international competitiveness [12]

Investment Rating - The report maintains a "Buy" rating for the company, indicating an expected relative increase in stock price of over 20% compared to the benchmark index within the next six months [5][15]. Core Insights - The company is actively expanding its advanced packaging capabilities to drive the industrialization of high-end products, leveraging advanced packaging technologies such as flip-chip, wafer-level, and system-level packaging to meet the growing demand for miniaturized and multifunctional electronic products [3]. - The acquisition of Hysolem, a subsidiary in South Korea, is expected to enhance the company's R&D capabilities in advanced packaging materials, enabling the development and mass production of high thermal conductivity encapsulants and other advanced materials [3]. - The automotive sector is experiencing explosive growth in demand for automotive-grade chips, with a projected market demand of $80.4 billion by 2025, which is driving the need for high-performance packaging materials [4]. - The company anticipates significant revenue growth, projecting revenues of 3.8 billion, 10.1 billion, and 12.6 billion yuan for the years 2025, 2026, and 2027, respectively, with net profits of 0.26 billion, 1.03 billion, and 1.39 billion yuan for the same years [5][9]. Company Overview - The company specializes in semiconductor packaging materials, including epoxy molding compounds and electronic adhesives, and aims to become a global leader in high-end packaging materials [12]. - Following the completion of the acquisition of Hysolem, the company is expected to optimize its product and customer structure, enhancing its international competitiveness [12]. - The company holds a market share of approximately 9% in the epoxy molding compound sector, ranking third in the industry, with plans to expand production capacity through new intelligent production lines for automotive-grade chip packaging materials [12].

Market Performance - The Sci-Tech Innovation Board Index fell by 1.58%, closing at 1482.99 points, with a total trading volume of 5.652 billion shares and a turnover of 299.275 billion yuan, resulting in an average turnover rate of 2.88% [1] - Among the tradable stocks on the Sci-Tech Innovation Board, 168 stocks closed higher, with 5 stocks rising over 10% and 14 stocks rising between 5% and 10%. Conversely, 425 stocks closed lower, with 5 stocks declining over 10% [1] Turnover Rate Analysis - The turnover rate distribution shows that 3 stocks had a turnover rate exceeding 20%, 28 stocks had a turnover rate between 10% and 20%, and 105 stocks had a turnover rate between 5% and 10% [1] - The highest turnover rate was recorded by Qizhong Technology, which closed up by 16.32% with a turnover rate of 22.82% and a transaction amount of 1.312 billion yuan [1] - Other notable stocks with high turnover rates include Huahai Chengke (22.52% turnover rate, 4.24% increase) and Youxun Co. (20.31% turnover rate, 2.48% increase) [1] Sector Performance - In terms of sector performance, the electronics sector had the highest number of stocks with a turnover rate exceeding 5%, totaling 48 stocks. The computer and machinery equipment sectors followed with 18 and 17 stocks, respectively [2] - Among the stocks with a turnover rate over 5%, 54 stocks increased, with the highest increases seen in Zhongwei Semiconductor (19.99%), Qizhong Technology (16.32%), and Sains (13.80%). Conversely, the largest declines were in Pinggao Co. (-11.63%), Aerospace Hongtu (-11.22%), and Haohan Depth (-10.55%) [2] Capital Flow - In terms of capital flow, 55 stocks with high turnover rates experienced net inflows from main funds, with the largest inflows seen in Lankai Technology (345 million yuan), Baiwei Storage (276 million yuan), and Zhongwei Semiconductor (258 million yuan) [2] - Conversely, the stocks with the largest net outflows included Zhenlei Technology (-557 million yuan), Huafeng Technology (-319 million yuan), and Moer Thread (-303 million yuan) [2] Leverage Fund Movements - A total of 77 stocks with high turnover rates received net purchases from leveraged funds, with significant increases in financing balances observed in Baiwei Storage (1.152 billion yuan), Lankai Technology (777 million yuan), and Jinpan Technology (278 million yuan) [2] - Stocks with the largest decreases in financing balances included Moer Thread (-180 million yuan), Changguang Huaxin (-163 million yuan), and Muxi Co. (-97.7694 million yuan) [2]

华海诚科股价创出历史新高，截至9:36，该股上涨6.71%，股价报134.19元，成交量183.02万股，成交金 额2.37亿元，换手率3.49%，该股最新A股总市值达128.84亿元，该股A股流通市值70.39亿元。 公司发布的三季报数据显示，前三季度公司共实现营业收入2.79亿元，同比增长16.52%，实现净利润 2005.04万元，同比下降42.58%，基本每股收益为0.2500元，加权平均净资产收益率1.92%。（数据宝） 证券时报·数据宝统计显示，华海诚科所属的电子行业，目前整体跌幅为0.39%，行业内，目前股价上涨 的有154只，涨幅居前的有金安国纪、盛科通信、雷曼光电等，涨幅分别为9.88%、9.48%、8.26%。股 价下跌的有328只，跌幅居前的有蓝箭电子、凯德石英、腾景科技等，跌幅分别为9.43%、7.28%、 5.25%。 两融数据显示，该股最新（1月16日）两融余额为7.51亿元，其中，融资余额为7.50亿元，近10日增加 3904.85万元，环比增长5.49%。 （文章来源：证券时报网） ...