Group 1 - The core viewpoint of the news is that Shanghai Shifeng Asset Management has conducted research on a listed company, Zhongqi New Materials, which is transitioning from traditional building materials to semiconductor materials in collaboration with Xingkong Technology [1] - Zhongqi New Materials is partnering with Xingkong Technology, which specializes in high-end equipment such as lithography machines and chip bonding machines, primarily used in advanced packaging and AI chip manufacturing [1] - Xingkong Technology has developed multiple product series, with some already launched in the market, and plans to continue developing high-performance equipment to meet customer demands [1] Group 2 - Xingkong Technology's team focuses on research and development, with over half of its employees dedicated to R&D in the future [1] - The company maintains a high domestic supply chain ratio while still retaining some international suppliers [1] - The process of securitization is expected to promote better development for the company, emphasizing independent research and sustainable growth [1]

Core Viewpoint - The recent acquisition of controlling stakes in Zhongqi New Materials by Xingkong Technology marks a significant shift in the semiconductor industry, aiming to integrate high-purity quartz sand with semiconductor equipment to enhance the company's market position [1][2]. Group 1: Acquisition Details - Xingkong Technology acquired 24.97% of Zhongqi New Materials for 803 million yuan, with its action partner Chen Yaoming acquiring an additional 5.01% [1]. - Following the acquisition, Xingkong Technology and its partners will hold a total of 36.62 million shares, representing 29.98% of Zhongqi New Materials [2]. - The actual controller of Zhongqi New Materials will change from Zhou Jun to He Rongming, who controls 74.43% of Xingkong Technology [2]. Group 2: Company Background - Zhongqi New Materials specializes in artificial quartz stone and is transitioning towards high-purity quartz sand applications in the semiconductor and photovoltaic sectors [1][4]. - High-purity quartz sand is a critical industrial raw material used in high-tech industries, including photovoltaics and semiconductors, with expected growth in demand due to ongoing industry expansion [4][5]. Group 3: Strategic Intent - He Rongming aims to leverage Zhongqi New Materials' market channels to accelerate the company's transformation into a technology enterprise focused on high-end semiconductor equipment, supported by new materials [2]. - The collaboration is expected to create synergies between semiconductor equipment and quartz materials, enhancing both companies' capabilities in the semiconductor supply chain [2][5]. Group 4: Financing and Growth - Xingkong Technology has completed multiple rounds of financing since its establishment in 2021, with significant investments from well-known institutions, including a record high single financing round in the semiconductor equipment sector [3]. - The recent financing increased Xingkong Technology's registered capital from 197 million yuan to 294 million yuan, marking a 49% increase [3].

Core Viewpoint - The collaboration between Zhongqi New Materials and Xingkong Technology aims to enhance Zhongqi's capabilities in high-end materials and expand its services to the semiconductor industry, marking a significant step in its business transformation and industry upgrade [1][2]. Group 1: Partnership and Strategic Goals - The share transfer agreement has been completed, with Xingkong Technology holding 23.74% of Zhongqi New Materials' shares, which will facilitate the latter's growth in high-end material production [1]. - The partnership is expected to leverage Xingkong Technology's expertise in high-end equipment manufacturing to help Zhongqi New Materials transition from traditional materials to high-tech applications, particularly in the semiconductor sector [2][3]. Group 2: Industry Insights and Product Development - Xingkong Technology, established in 2021, specializes in high-end equipment for integrated circuits, filling gaps in domestic high-end equipment manufacturing [3]. - The company has a strong focus on advanced packaging and aims to achieve sub-micron precision in its products by the second half of the year, which is a significant benchmark in the advanced packaging field [4]. - The collaboration will also involve the development of new materials for the semiconductor industry, enhancing the technological level of traditional materials while integrating high-end equipment with Zhongqi's existing product lines [4].

Group 1: Company Overview and Collaboration - Guangdong Zhongqi New Materials Co., Ltd. is transitioning from traditional construction materials to high-tech applications in the semiconductor industry, aiming for new growth points [4] - The collaboration with Xingkong Technology focuses on integrating high-end equipment manufacturing with Zhongqi's material production, enhancing capabilities in the semiconductor sector [4][5] Group 2: Product Development and Market Position - Xingkong Technology's product line includes specialized lithography machines, chip bonding machines, and optical inspection equipment, targeting advanced packaging and AI chip manufacturing [5][6] - The company aims to achieve micron-level precision in advanced packaging, with expectations to reach sub-micron levels (0.7 to 0.8 microns) by the second half of the year [9] Group 3: Future Strategies and R&D Focus - Future development will emphasize advanced packaging technologies, including 2.5D and 3D packaging, to meet the growing demands of AI applications [5][6] - The company plans to maintain a strong R&D focus, with approximately 60% of its workforce dedicated to research and engineering [11] Group 4: Competitive Landscape and Supply Chain - Xingkong Technology differentiates itself from competitors by focusing on AI chip manufacturing, with a unique technical approach and application focus [12] - The company maintains a strong domestic supply chain but does not completely exclude international suppliers for critical components, ensuring a secure and controllable production environment [12]

广东中旗新材料股份有限公司 | 证券代码：001212 | 证券简称：中旗新材 | 公告编号：2025-052 | | --- | --- | --- | | 转债代码：127081 | 债券简称：中旗转债 | | 关于公司 5%以上股东权益变动超过 1%的提示性公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： 1、本次权益变动系因广东中旗新材料股份有限公司（以下简称"公司"） 股东完成协议转让及可转换公司债券"中旗转债"转股导致公司总股本增加，致 使公司 5%以上股东所持有的公司股份比例变动超过 1%。 2、本次权益变动不涉及要约收购，不会导致公司控制权发生变化，不会影 响公司的治理结构和持续经营。 一、本次权益变动的基本情况 因可转换公司债券转股及股东完成协议转让，公司 5%以上股东持有公司股 份比例变动超过 1%，现将有关情况公告如下： 2025 年 3 月 31 日，广东星空科技装备有限公司（以下简称"星空科技"） 与公司控股股东海南羽明华创业投资有限公司（以下简称"海南羽明华"）、实 际控制人周军、青岛明琴企业管理合伙企业（有限合伙） ...

回购价格上限调整 根据《回购报告书》约定，若公司在回购期内实施派息、送股等除权除息事项，需相应调整回购价格上 限。据此，公司本次回购股份价格上限由不超过71.805元/股（含），调整至不超过51.382元/股 （含），该调整事项已于2025年5月23日在巨潮资讯网披露。 登录新浪财经APP 搜索【信披】查看更多考评等级 中旗新材于2025年5月30日发布关于股份回购的进展公告，披露了公司回购股份的最新情况。 回购方案回顾 2025年4月28日，广东中旗新材料股份有限公司第三届董事会第六次会议审议通过回购相关议案。公司 计划使用自有或自筹资金，以集中竞价交易方式回购部分股份，用于员工持股计划或股权激励。回购资 金总额在10,000.00万元至15,000.00万元之间，回购股份价格不超过71.805元/股，实施期限为董事会审 议通过方案之日起12个月内。 回购进展情况 截至2025年5月30日，公司通过回购专用账户以集中竞价方式累计回购股份1,432,448股，约占公司总股 本（以2025年5月30日收市后总股本180,773,366股计算）的0.79% 。回购最高成交价为71.80元/股，最低 成交价为65. ...

Group 1 - The company issued a total of 5.4 million convertible bonds, with a total amount of 540 million RMB, approved by the China Securities Regulatory Commission [1] - The convertible bonds were listed on the Shenzhen Stock Exchange on April 25, 2023, under the name "Zhongqi Convertible Bonds" and code "127081" [1] - The initial conversion price of the bonds was set at 30.27 RMB per share, which was later adjusted to 30.17 RMB per share on June 16, 2023 [2] Group 2 - As of May 30, 2025, a total of 2,414,394 bonds have been converted into 12,091,724 shares, representing 10.26% of the company's total shares before conversion [5] - There are still 2,985,606 bonds that have not been converted, accounting for 55.29% of the total issued convertible bonds [6] - The conversion price has been adjusted multiple times, with the latest adjustment reducing it to 14.76 RMB per share effective from May 29, 2025 [4]

| 证券代码：001212 | 证券简称：中旗新材 | 公告编号：2025-052 | | --- | --- | --- | | 转债代码：127081 | 债券简称：中旗转债 | | 广东中旗新材料股份有限公司 关于公司 5%以上股东权益变动超过 1%的提示性公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： 1、本次权益变动系因广东中旗新材料股份有限公司（以下简称"公司"） 股东完成协议转让及可转换公司债券"中旗转债"转股导致公司总股本增加，致 使公司 5%以上股东所持有的公司股份比例变动超过 1%。 2、本次权益变动不涉及要约收购，不会导致公司控制权发生变化，不会影 响公司的治理结构和持续经营。 一、本次权益变动的基本情况 因可转换公司债券转股及股东完成协议转让，公司 5%以上股东持有公司股 份比例变动超过 1%，现将有关情况公告如下： 2025 年 3 月 31 日，广东星空科技装备有限公司（以下简称"星空科技"） 与公司控股股东海南羽明华创业投资有限公司（以下简称"海南羽明华"）、实 际控制人周军、青岛明琴企业管理合伙企业（有限合伙） ...

| 证券代码：001212 | 证券简称：中旗新材 | 公告编号：2025-050 | | --- | --- | --- | | 转债代码：127081 | 债券简称：中旗转债 | | 广东中旗新材料股份有限公司 关于股份回购的进展公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 一、股份回购方案概述 广东中旗新材料股份有限公司（以下简称"公司"）于 2025 年 4 月 28 日召 开的第三届董事会第六次会议审议通过了《关于回购公司股份方案暨取得回购专 项贷款承诺书的议案》，公司拟使用自有资金或自筹资金以集中竞价交易方式回 购部分公司股份用于员工持股计划或股权激励，回购资金总额不低于人民币 10,000.00 万元（均含本数，下同），不超过人民币 15,000.00 万元，回购股份的 价格不超过人民币 71.805 元/股。回购股份的实施期限为自公司董事会审议通过 股份回购方案之日起 12 个月内。具体内容详见公司分别于 2025 年 4 月 30 日、 2025 年 5 月 8 日在巨潮资讯网（www.cninfo.com.cn）上披露的《关于回购公 ...

| 证券代码：001212 | 证券简称：中旗新材 | 公告编号：2025-051转 | | --- | --- | --- | | 债代码：127081 | 债券简称：中旗转债 | | 特别提示： 1、截至 2025 年 5 月 30 日，广东中旗新材股份有限公司（以下简称"公司"） 公开发行可转换公司债券"中旗转债"累计共有 2,414,394 张转换成公司股票， 累计转股数量 12,091,724 股，转股数量占可转债开始转股前公司已发行股份总额 的 10.26%。 2、未转股可转债情况：截至 2025 年 5 月 30 日，尚有 2,985,606 张"中旗转 债"未转股，占公司可转债发行总量的 55.29%。 （四）可转换公司债券转股价格的调整情况 中旗转债初始转股价格为 30.27 元/股。 一、可转换公司债券基本情况 （一）可转换公司债券发行情况 经中国证券监督管理委员会（以下简称"中国证监会"）《关于核准广东中 旗新材料股份有限公司公开发行可转换公司债券的批复》（证监许可〔2023〕249 号）核准，公司于 2023 年 3 月 3 日公开发行了可转债 540.00 万张，每张面值人 民币 1 ...