上市公司独立董事提名人声明与承诺 提名人天水华天科技股份有限公司董事会现就提名何晓宁为天水华天科 技股份有限公司第八届董事会独立董事候选人发表公开声明。被提名人已书面 同意作为天水华天科技股份有限公司第八届董事会独立董事候选人（参见该独 立董事候选人声明）。本次提名是在充分了解被提名人职业、学历、职称、详 细的工作经历、全部兼职、有无重大失信等不良记录等情况后作出的，本提名 人认为被提名人符合相关法律、行政法规、部门规章、规范性文件和深圳证券 交易所业务规则对独立董事候选人任职资格及独立性的要求，具体声明并承诺 如下事项： 一、被提名人已经通过天水华天科技股份有限公司第七届董事会提名委员 会或者独立董事专门会议资格审查，提名人与被提名人不存在利害关系或者其 他可能影响独立履职情形的密切关系。 √ 是 □ 否 如否，请详细说明：______________________________ 二、被提名人不存在《中华人民共和国公司法》第一百四十六条等规定不 得担任公司董事的情形。 √ 是 □ 否 如否，请详细说明：______________________________ 三、被提名人符合中国证监会《上市公司独立 ...

天水华天科技股份有限公司 2024年度内部控制评价报告 天水华天科技股份有限公司全体股东： 根据《企业内部控制基本规范》及其配套指引的规定和其他内部控制监管要 求（以下简称"企业内部控制规范体系"），结合天水华天科技股份有限公司（以 下简称"公司"或"华天科技"）内部控制制度和评价办法，在内部控制日常监 督和专项监督的基础上，我们对公司2024年12月31日（内部控制评价报告基准 日）的内部控制有效性进行了评价。 一、重要声明 按照企业内部控制规范体系的规定，建立健全和有效实施内部控制，评价其 有效性，并如实披露内部控制评价报告是公司董事会的责任。监事会对董事会建 立和实施内部控制进行监督，经理层负责组织领导企业内部控制的日常运行。 公司董事会、监事会及董事、监事、高级管理人员保证本报告内容不存在任 何虚假记载、误导性陈述或重大遗漏，并对报告内容的真实性、准确性和完整性 承担个别及连带法律责任。 公司内部控制的目标是合理保证经营管理合法合规、资产安全、财务报告及 相关信息真实完整，提高经营效率和效果，促进实现发展战略。由于内部控制存 在的固有局限性，故仅能为实现上述目标提供合理保证。此外，由于情况的变化 可能 ...

证券代码：002185 证券简称：华天科技 公告编号：2025-016 一、召开会议的基本情况 1、股东大会届次：2024年年度股东大会 2、会议召集人：公司董事会。公司于2025年3月29日召开第七届董事会第二 十一次会议，审议通过了《关于召开公司2024年年度股东大会的议案》，决定召 开公司2024年年度股东大会。 3、会议召开的合法、合规性：本次股东大会的召集和召开符合《中华人民 共和国公司法》、《上市公司股东大会规则》、《深圳证券交易所股票上市规则》 等有关法律、行政法规、部门规章、规范性文件和公司章程的有关规定。 4、会议的召开时间： 现场会议召开时间：2025年4月22日（星期二）下午14:30 天水华天科技股份有限公司 关于召开 2024 年年度股东大会的通知 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届董事会第二十一次 会议决定于2025年4月22日召开公司2024年年度股东大会，审议公司第七届董事 会第二十一次会议与第七届监事会第十七次会议提交的相关议案，现将本次会议 的有关事项通知如下： ...

天水华天科技股份有限公司 证券代码：002185 证券简称：华天科技 公告编号：2025-017 本公司及监事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届监事会第十七次会 议通知和议案等材料已于 2025 年 3 月 19 日以电子邮件和书面送达方式送达各位 监事，并于 2025 年 3 月 29 日在西安市凤城五路 105 号恒石国际中心 C 座 1111 会议室召开会议。应出席本次监事会会议的监事 3 人，实际到会 3 人，会议由监 事会主席罗华兵主持。会议符合《公司法》及《公司章程》的有关规定。会议审 议通过了如下决议： 二、审议通过了公司《2024 年年度报告及摘要》。 一、审议通过了公司《2024 年度监事会工作报告》。 同意 3 票，反对 0 票，弃权 0 票。 此议案需提交公司 2024 年年度股东大会审议。 《2024 年度监事会工作报告》详见巨潮资讯网（http://www.cninfo.com.cn）。 第七届监事会第十七次会议决议公告 经认真审核，监事会认为董事会编制和审核公司 2024 年年度报 ...

监事会认为，公司符合《上市公司股权激励管理办法》等法律法规规定的实 施股权激励计划的情形。公司的经营业绩、激励对象及其个人考核等实际情况均 符合公司《2023 年股票期权激励计划（草案）》《2023 年股票期权激励计划实 施考核管理办法》中对公司 2023 年股票期权激励计划首次授予部分第一个行权 期行权条件的要求。激励对象符合行权资格条件，可行权股票期权数量与其在考 核年度内个人考核结果相符，其作为本次可行权的激励对象主体资格合法、有效。 公司对 2023 年股票期权激励计划首次授予部分第一个行权期可行权事项的相关 安排符合相关法律、法规和规范性文件的有关规定，同意激励对象在规定的行权 期内采用自主行权的方式进行行权。 监事：罗华兵、张玉明、张利平 天水华天科技股份有限公司 监事会关于相关事项发表的意见 一、关于调整 2023 年股票期权激励计划首次授予部分激励对象名单及授予 数量并注销部分股票期权的意见 监事会认为，本次调整 2023 年股票期权激励计划首次授予部分激励对象名 单、授予数量及注销部分股票期权的事项符合《上市公司股权激励管理办法》等 相关法律、法规和规范性文件的规定以及公司《2023 年股票 ...

证券代码：002185 证券简称：华天科技 公告编号：2025-007 天水华天科技股份有限公司 第七届董事会第二十一次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届董事会第二十一次 会议通知和议案等材料已于 2025 年 3 月 19 日以电子邮件和书面送达方式发送至 各位董事，并于 2025 年 3 月 29 日在西安市凤城五路 105 号恒石国际中心 C 座 1111 会议室召开会议。应出席本次董事会会议的董事 9 人，实际到会 8 人，独 立董事石瑛因其他事务不能亲自出席本次会议，授权独立董事于燮康代为出席并 表决。公司监事和相关人员列席了会议。会议由董事长肖胜利先生主持。会议符 合《公司法》及《公司章程》的有关规定。会议审议通过了如下决议： 一、审议通过了公司《总经理 2024 年度工作总结和 2025 年度工作计划》。 同意 9 票，反对 0 票，弃权 0 票。 二、审议通过了公司《2024 年度董事会工作报告》。 2024 年度董事会工作报告详见巨潮资讯网（http://www.c ...

Financial Performance - The company's operating revenue for 2024 reached ¥14,461,617,106.21, representing a 28.00% increase compared to ¥11,298,245,259.39 in 2023[26]. - Net profit attributable to shareholders increased by 172.29% to ¥616,251,021.39 in 2024 from ¥226,323,275.35 in 2023[26]. - The cash flow from operating activities for 2024 was ¥3,097,973,379.05, up 28.48% from ¥2,411,209,475.02 in 2023[26]. - Basic earnings per share rose to ¥0.1923 in 2024, a 172.38% increase from ¥0.0706 in 2023[26]. - Total assets at the end of 2024 were ¥38,235,948,588.77, reflecting a 13.29% increase from ¥33,751,820,450.19 at the end of 2023[26]. - The company reported a significant increase in non-recurring gains, totaling ¥582,831,614.86 in 2024 compared to ¥534,469,721.47 in 2023[32]. - The company achieved a significant increase in order volume and capacity utilization, leading to a substantial improvement in operational performance[42]. - The company reported a total of ¥125,908,086.56 in contract liabilities, remaining stable at 0.33% of total liabilities[76]. Dividend Distribution - The company plans to distribute a cash dividend of 0.58 RMB per 10 shares based on a total share capital of 3,204,484,648 shares as of December 31, 2024[12]. - The total distributable profit for the company is 3,199,950,883.58 yuan, which is the basis for the cash dividend distribution[159]. - The cash dividend distribution accounts for 100% of the total profit distribution amount[158]. Market and Industry Trends - The global semiconductor market sales reached $627.6 billion in 2024, a 19.1% year-on-year growth, marking the first time it surpassed the $600 billion mark[35]. - In 2024, China's integrated circuit design industry achieved sales of ¥646.04 billion, with 731 design companies reporting over ¥100 million in sales, a 17% increase year-on-year[36]. - The company plans to leverage the growth in AI and consumer markets to drive sales of integrated circuit products in 2025, with expectations of double-digit growth[35]. Research and Development - The company emphasizes the need for continuous technological research and new product development to meet market demands, highlighting the risk of failure in these areas[10]. - The company is committed to enhancing its research and development capabilities to keep pace with rapid market changes and technological advancements[10]. - R&D expenses increased by 35.95% to ¥943,356,957.44 in 2024 from ¥693,914,042.89 in 2023, primarily due to increased investment in R&D projects[66]. - The number of R&D personnel rose by 17.59% to 4,806 in 2024 from 4,087 in 2023, with a notable increase in the proportion of personnel holding bachelor's degrees[68]. - The company is advancing the development of advanced packaging technologies, including Chiplet and automotive electronics[48]. Operational Challenges - The company faces risks related to the semiconductor industry's cyclical nature, which directly impacts its operational performance[7]. - Rising production costs due to fluctuations in raw material prices and increased labor costs pose challenges for cost control[8]. - The company operates in a highly competitive integrated circuit packaging and testing industry, which increases operational difficulties[7]. - Risks include fluctuations in semiconductor industry conditions, rising production costs, and potential failures in technology development and new product launches[108]. Corporate Governance and Management - The company maintains complete independence from its controlling shareholders in terms of business operations, personnel, assets, and financial management[116]. - The company has a dedicated human resources department and has implemented performance assessment regulations for its employees[118]. - The company has an independent financial department and accounting system, ensuring autonomous financial decision-making[122]. - The company has established a market value management system approved on February 20, 2025, to enhance valuation[112]. - The total remuneration paid to directors, supervisors, and senior management for the year 2024 amounted to 12.3755 million yuan[140]. Environmental Compliance - The company has obtained environmental permits for its subsidiaries, with validity extending until December 12, 2029, for the main entity[173]. - The company adheres to multiple environmental protection laws and standards, including the Comprehensive Discharge Standard for Wastewater and the Air Pollutants Comprehensive Discharge Standard[172]. - The total discharge of COD was reported at 387.65 tons, with no exceedances of the regulatory limits[173]. - The company has established a comprehensive wastewater treatment station with four main systems: pure water preparation, heavily polluted wastewater treatment, wastewater reuse, and sludge treatment[178]. - The company aims to reach carbon peak by 2030 and carbon neutrality by 2060, with a focus on developing a circular economy and enhancing energy efficiency[189]. Strategic Initiatives - The company plans to enhance its advanced packaging technology and expand its business scope, focusing on SiP, FC, TSV, and other advanced packaging techniques[104]. - The company is considering strategic acquisitions to bolster its technology portfolio, with a budget of $200 million allocated for potential deals[137]. - The company is expanding its market presence in regions E and F, aiming for a market share increase of G% by the end of the fiscal year[5]. - The company is actively pursuing new product and technology development while ensuring no competitive products are produced by its subsidiaries[199]. Stakeholder Engagement - The company emphasizes employee satisfaction and has implemented various training programs to enhance legal awareness and professional skills[193]. - The company actively engages with stakeholders to ensure responsible supply chain practices and improve product quality[194]. - The company promotes a culture of recognition and skill development through various employee engagement activities[195].

证券代码：002185 证券简称：华天科技 公告编号：2025-009 天水华天科技股份有限公司（以下简称"公司"）2024 年度利润分配及资 本公积转增股本预案情况如下： 一、审议程序 公司于 2025 年 3 月 29 日召开第七届董事会第二十一次会议，会议审议通过 了《2024 年度利润分配及资本公积转增股本预案》。 2024 年度利润分配及资本公积转增股本预案尚需提交公司股东大会审议。 天水华天科技股份有限公司 关于2024年度利润分配及资本公积转增股本 预案的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 特别提示： 1、公司 2024 年度利润分配及资本公积转增股本预案为：每 10 股派发现金 股利 0.58 元人民币（含税），不以公积金转增股本。本预案披露后至实施 2024 年度权益分派股权登记日期间，如享有利润分配权的股份总数发生变动，则以实 施分配方案股权登记日时享有利润分配权的股份总数为基数，按照分配总额不变 的原则对每 10 股分红金额进行相应调整。 2、公司未触及《深圳证券交易所股票上市规则》第 9.8.1 条第（九）项规定 的可 ...

证券代码：002185 证券简称：华天科技 公告编号：2025-006 天水华天科技股份有限公司 关于控股股东增持公司股份计划实施 期限届满及增持完成的公告 天水华天科技股份有限公司（以下简称 "公司"）控股股东天水华天电 子集团股份有限公司（以下简称"华天电子集团"）计划自 2024 年 9 月 10 日起 六个月内增持公司股份，增持金额不低于 3,000 万元人民币。 目前增持计划实施期限届满，本次增持计划的实施期间，华天电子集团 通过深圳证券交易所交易系统集中竞价方式增持公司股份 4,069,900 股，增持金 额合计 30,019,264.00 元。 一、增持主体的基本情况 1、增持主体：公司控股股东天水华天电子集团股份有限公司 2、增持主体已持有本公司股份的情况：截至本次增持计划实施前，华天电 子集团共持有公司股份 723,774,508 股，占公司股份总数的 22.59%。公司实际控 制人肖胜利等 13 名自然人共持有公司股份 1,352,846 股，占公司股份总数的 0.04%。华天电子集团与公司实际控制人合计持有公司股份 725,127,354 股，占公 司股份总数的 22.63%。 3、增持 ...

Core Viewpoint - The semiconductor packaging and testing industry is undergoing significant changes as traditional OSAT (Outsourced Semiconductor Assembly and Test) companies face intense competition from foundries like TSMC, Samsung, and Intel, which are entering the advanced packaging sector. Traditional OSAT firms are actively expanding their capabilities and investing in advanced packaging technologies to maintain their market positions [1][16][38]. Group 1: Traditional OSAT Companies' Expansion - ASE Group (日月光) is expanding its advanced packaging capacity by investing $200 million in a FOPLP production line in Kaohsiung, Taiwan, aiming for mass production by the end of the year [2][3]. - ASE has also inaugurated its fourth and fifth factories in Penang, Malaysia, with a total investment of $300 million to meet the growing demand for automotive semiconductors and AI applications [3][4]. - ASE is acquiring two packaging factories from Infineon in the Philippines and South Korea for approximately NT$2.1 billion to enhance its capabilities in automotive and industrial automation applications [5][6]. Group 2: Amkor Technology's Developments - Amkor plans to triple the annual production capacity of its factory in Vietnam from 1.2 billion to 3.6 billion units, reflecting strong growth in the region [7][8]. - The company is investing $2 billion to build an advanced semiconductor packaging and testing facility in Arizona, USA, primarily serving TSMC and Apple [8][9]. Group 3: Longsys Technology's Innovations - Longsys Technology is focusing on high-density packaging technologies, including 2.5D/3D packaging, and has launched a high-end manufacturing project in Jiangsu with a total investment of 10 billion yuan [9][24]. - The company has developed a high-density heterogeneous integration technology platform, XDFOI, which has entered stable mass production and is being applied in high-performance computing and AI fields [24][25]. Group 4: Tongfu Microelectronics' Advancements - Tongfu Microelectronics has established a 2.5D/3D packaging platform and is expanding its capabilities in high-performance computing, with new processes developed for chiplet packaging [28][29]. - The company is also focusing on glass substrate packaging technology to meet the demands of various high-performance chip applications [29][30]. Group 5: Huada Semiconductor's Strategic Moves - Huada Semiconductor is investing in advanced packaging technologies, including SiP and 3D packaging, and has launched a new 2.5D packaging technology platform to cater to AI demands [31][32]. - The company is also developing a 3D Matrix packaging platform that integrates TSV and eSiFo technologies for high-density heterogeneous integration [35][36]. Group 6: Powertech Technology's Expansion - Powertech Technology is expanding its testing capabilities in Japan with a new investment of 5 billion yen to enhance its semiconductor testing and mass production capabilities [13][14]. - The company is evaluating a proposal to establish a high-end chip packaging factory in Japan, aiming to leverage the country's advanced testing technology and stable automotive chip market [14][36].