21智讯1月16日电，华海诚科公告，天水华天科技股份有限公司因自身资金需求，通过集中竞价方式累 计减持公司股份960,100股，占公司总股本的1.00%。本次减持期间为2025年12月24日至2026年1月16 日，减持价格区间为116.01元至128.00元/股，减持总金额为1.13亿元。截至2026年1月16日，本次减持计 划已实施完毕。减持后，天水华天科技股份有限公司持有公司股份2,297,476股，占总股本的2.39%。 ...

证券代码：002185 证券简称：华天科技 公告编号：2026-001 天水华天科技股份有限公司 关于发行股份及支付现金购买资产并募集配套资金暨 关联交易事项的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性承 担法律责任。 特别提示： 1、天水华天科技股份有限公司于 2025 年 10 月 17 日披露的《天水华天科技 股份有限公司发行股份及支付现金购买资产并募集配套资金暨关联交易预案》及 其摘要的"重大事项提示"和"重大风险提示"章节中，详细披露了本次交易尚 需履行的审批程序及涉及的风险因素，敬请广大投资者注意投资风险。 2、自本次交易预案披露以来，公司及交易相关方积极推进本次交易的相关 工作。截至本公告披露日，本次交易所涉及的审计、评估等工作尚未完成，具体 交易方案仍在商讨论证中。公司将继续积极推进本次交易，并根据中国证监会和 深圳证券交易所的相关规定及时履行本次交易的后续审批和信息披露程序。 一、本次交易概述 天水华天科技股份有限公司（以下简称"公司"）拟通过发行股份及支付现 金的方式购买天水华天电子集团股份有限公司、西安后 ...

华天科技公告称，公司拟通过发行股份及支付现金方式，购买27名交易对方持有的华羿微电子100%股 份并募集配套资金，构成关联交易，预计不构成重大资产重组与重组上市。公司股票于2025年9月25日 开市起停牌，10月17日开市起复牌。截至公告披露日，交易涉及的审计、评估等工作未完成，具体方案 仍在商讨论证，交易尚需多项审议及监管批准，存在不确定性。 ...

Market Overview - The market opened high but closed lower, with the Shanghai Composite Index down 0.26%, the Shenzhen Component Index down 0.18%, and the ChiNext Index down 0.2% [1] - The total trading volume in the Shanghai and Shenzhen markets reached 3.06 trillion yuan, an increase of 118 billion yuan compared to the previous trading day, with over 2,900 stocks declining [3] Semiconductor Sector - The semiconductor industry chain showed strong performance, with stocks like Changdian Technology hitting the daily limit and reaching a five-year high. Other stocks such as Meige Technology, Kangqiang Electronics, and Shenghui Integration also hit the daily limit [5] - The storage chip concept continued to rise in the afternoon, with Jiangbolong's market value reaching 148.2 billion yuan and increasing over 13%, while Baiwei Storage's market value reached 86 billion yuan with a rise of over 17%, both hitting historical highs [5] - According to a report from Counterpoint Research, the storage market has entered a "super bull market" phase, with expectations of a 40%-50% increase in Q1 2026 and an additional 20% increase in Q2 2026 [5] Investment Outlook - Guojin Securities suggests that the A-share market is likely to perform well in the future, driven by marginal improvements in liquidity, which is common during the spring market [9] - Huashan Securities emphasizes that the market's expectations for price stabilization and investment recovery are rising, with overall liquidity being ample and market activity high, which continues to drive market strength [9] - Huajin Securities believes that the slow bull market in A-shares will continue, focusing on growth stocks that are expected to rebound, with technology and cyclical sectors likely to see continued profit growth [9]

Group 1 - The CPO concept in the A-share market has seen significant gains, with multiple companies experiencing notable stock price increases [1] - Notable performers include LianTe Technology, which rose by 10.30%, and KeChuan Technology, which increased by 10.01% [2] - Other companies such as ChangDian Technology and RoboTech also saw substantial gains, with increases of 10% and 9.66% respectively [2] Group 2 - The total market capitalization of LianTe Technology is 28.2 billion, while KeChuan Technology has a market cap of 9.521 billion [2] - Year-to-date performance shows that KeChuan Technology has increased by 60.60%, indicating strong growth potential [2] - Companies like ChangDian Technology and RoboTech have year-to-date increases of 31.57% and 36.39% respectively, reflecting positive market sentiment [2]

Core Viewpoint - Huatian Technology's stock has shown a positive trend with a year-to-date increase of 8.75% and a recent net inflow of funds, indicating strong investor interest in the company [1][2]. Financial Performance - For the period from January to September 2025, Huatian Technology achieved a revenue of 12.38 billion yuan, representing a year-on-year growth of 17.55% [2]. - The net profit attributable to shareholders for the same period was 543 million yuan, reflecting a significant increase of 51.98% year-on-year [2]. Stock Market Activity - As of January 15, Huatian Technology's stock price was 11.93 yuan per share, with a trading volume of 9.20 billion yuan and a market capitalization of 38.878 billion yuan [1]. - The stock has experienced a 3.65% increase over the last five trading days and a 13.19% increase over the last 20 days, although it has declined by 8.86% over the past 60 days [1]. Shareholder Information - As of September 30, 2025, the number of shareholders for Huatian Technology was 412,300, an increase of 1.77% from the previous period [2]. - The average number of tradable shares per shareholder was 7,901, a slight decrease of 0.83% [2]. Dividend Distribution - Huatian Technology has distributed a total of 935 million yuan in dividends since its A-share listing, with 340 million yuan distributed over the past three years [3]. Institutional Holdings - As of September 30, 2025, Hong Kong Central Clearing Limited was the third-largest shareholder, holding 56.17 million shares, an increase of 11.10 million shares from the previous period [3]. - The Southern CSI 500 ETF was the fourth-largest shareholder, holding 37.01 million shares, a decrease of 1.14 million shares [3].

Summary of Conference Call on Advanced Packaging Industry Industry Overview - The advanced packaging industry is experiencing price increases due to rising costs of upstream precious metals, commodities, and substrate prices, leading to gradual increases in packaging prices [1][2] - Domestic packaging companies are also facing similar cost pressures, with many manufacturers operating at near full capacity, indicating a positive outlook for Q1 2026 [1][3] Key Insights - **Demand Growth**: Strong demand for AI and high-performance computing (HPC) is driving an increase in packaging orders, with prices at ASE rising by 5% to 20%, exceeding previous expectations of 5% to 10% [2] - **Capacity Utilization**: ASE's capacity utilization is over 90%, with a focus on optimizing product mix to prioritize high-margin products [2] - **Market Potential**: Advanced packaging has significant growth potential in AI chip and HBM manufacturing, with the value of advanced packaging in AI chips approaching manufacturing costs [1][5] Market Growth Projections - The global multi-chip integration packaging market is expected to grow from 58.9 billion yuan in 2024 to 185.9 billion yuan by 2029, with a CAGR of 25.8% [8] - The Chinese market is projected to grow from 2.89 billion yuan to 17.68 billion yuan, with a CAGR of 43.7% [8] Company Developments - Major domestic packaging companies such as JCET, Tongfu Microelectronics, and Huatian Technology are actively expanding capacity through advanced manufacturing projects [3][6] - JCET's high-density fan-out packaging project is set to increase capacity by 24,000 pieces per year, with a total investment of nearly 10 billion yuan [6] - Tongfu Microelectronics is progressing with its 2.5D and 3D equipment injection project, while Huatian Technology is investing 2 billion yuan to establish a new advanced packaging company [6] Financial Performance - Shenghe Microelectronics reported a revenue of 3.17 billion yuan for the first half of 2025, with significant contributions from multi-chip integration [10] - The company has a utilization rate of approximately 63%, indicating room for growth [10][11] Future Outlook - The advanced packaging industry is expected to thrive, driven by increasing orders from AI chip design companies and the upcoming IPO of Shenghe Microelectronics, which could enhance market interest [12] - The introduction of advanced technologies such as bonding, TSV, and RDL is expected to increase the value of equipment and materials, with a shift towards higher density I/O interfaces [12][13] - The demand for packaging is anticipated to rise sharply due to the growing number of AI chips, while the complexity of processes and rising costs will elevate the packaging value per chip [13] Investment Opportunities - Companies such as JCET, Tongfu Microelectronics, and Huatian Technology are recommended for investment, along with upstream supply chain opportunities [12] - The need for domestic alternatives in core equipment and materials, currently dominated by foreign suppliers, presents significant investment potential [13]

Core Insights - The article discusses the rising costs associated with advanced semiconductor processes, highlighting that the transition from planar FET to FinFET and Nanosheet technologies has led to exponential increases in design and manufacturing costs, making it difficult for small and medium enterprises to invest in advanced processes [8][9]. - The industry is shifting towards higher concentration among leading foundries, while advanced packaging technologies allow smaller companies to participate in high-end chip design without relying on advanced processes [9][11]. - The article emphasizes the importance of heterogeneous integration and the need for tailored architectures based on application scenarios, indicating a trend towards dynamic adjustments in advanced packaging strategies [25][56]. Cost Trends - Design costs have surged from $28 million for 65nm processes to $725 million for 2nm processes, with manufacturing investments also increasing significantly [9]. - The investment required for a 5nm factory is five times that of a 20nm factory, indicating a substantial financial barrier for smaller players in the industry [8]. Architectural Comparisons - The article compares four architectures, noting that smaller systems (like mobile chips) benefit from a "large chip + 3D stacking" approach, while larger systems (like AI servers) favor a "chiplet + 3D stacking" strategy to balance performance and cost [16][24]. - As system complexity increases, the advantages of chiplet-based designs become more pronounced, particularly in terms of cost efficiency [17][23]. Advanced Packaging Technologies - Advanced packaging is evolving to meet the demands of AI and high-performance computing, with technologies like 2.5D and 3D packaging becoming standard for high-end chips [36][72]. - The integration of HBM (High Bandwidth Memory) with 2.5D packaging has become a standard, driven by the need for high memory bandwidth in AI applications [29][36]. Interconnect Technologies - The article highlights the critical role of interconnect technologies in enhancing I/O density, with projections showing a significant increase in interconnect density from 1960s levels of 2/mm² to future levels of 131072/mm² [38]. - Advanced packaging is shifting from being a secondary process to a core component of performance enhancement, with interconnect-related technologies expected to yield higher profit margins than traditional packaging [39][42]. Market Dynamics - The article notes that the demand for advanced packaging is driven by the need for high bandwidth, miniaturization, and low power consumption, particularly in edge AI applications [49][50]. - The automotive sector's transition from distributed ECUs to centralized computing is pushing for higher integration levels, which in turn drives advancements in packaging technologies [53][56]. Technology Evolution - The evolution of packaging technologies is characterized by a shift from single technology optimization to system-level engineering design, necessitating cross-domain integration capabilities [68][70]. - The article outlines a clear roadmap for the evolution of interconnect technologies, indicating that the industry is entering a phase of rapid technological iteration driven by market demands [154][165]. Cost Structure - The cost structure for 2.5D packaging is primarily driven by the interposer (Si/mold/silicon bridge) and packaging substrate, while for 3D packaging, the key cost factor is the bonding process [168][169]. - The differences in cost structures dictate the profitability models for companies, with 2.5D packaging firms needing to manage interposer and substrate costs, while 3D packaging firms focus on optimizing bonding yields and efficiency [169].

Core Viewpoint - Recently, ChipLink Capital completed a strategic investment in Lingxin Electronics, a company specializing in automotive-grade analog chip design, to enhance its product layout in the automotive power management and driver chip sector [1] Group 1: Investment Details - The financing round was led by ChipLink Capital, with Huada Technology participating as a co-investor [1] - This investment aims to solidify Lingxin Electronics' position in the automotive-grade chip market [1] Group 2: Company Development - Lingxin Electronics will accelerate the automotive certification and mass production of its core products [1] - The investment will also facilitate deeper penetration into key customer segments [1]

Group 1 - The capital market's M&A activities in the Shenzhen market are experiencing significant growth, driven by policy benefits, precise regulatory support, and proactive market participants, leading to a dual increase in both quality and quantity of transactions [1] - Since 2025, there have been 1,104 newly disclosed M&A transactions in the Shenzhen market, totaling 553.7 billion yuan, representing a year-on-year increase of 54% and 55% respectively; major asset restructurings have exceeded 100, with a year-on-year growth rate of 60% [1] - In addition to major asset restructurings, there have been 995 cash acquisitions that did not meet the major asset restructuring standards, accounting for 90% of the total restructuring activities during the same period, indicating a trend towards smaller, embedded acquisitions that enhance company quality [1] Group 2 - Among the 109 major asset restructurings, 80% were industry mergers and acquisitions, and 70% involved new quality productivity targets, with strategic emerging industries such as semiconductors, information technology, and equipment manufacturing being the core focus [2] - Notable transactions include Electric Power Investment Corporation's acquisition of nuclear power assets worth 55.4 billion yuan, establishing a specialized nuclear power operation platform, and Huatian Technology's acquisition of semiconductor company Huayi Microelectronics, optimizing the company's industrial layout [2] Group 3 - The emergence of benchmark cases and diverse restructuring models is evident, with cross-industry mergers facilitating transformation, such as Huylin Ecological's acquisition of Junheng Technology to enter the high-end optical module sector [3] - Innovative transaction models are addressing industry challenges, exemplified by Hailianxun's absorption and merger of Hangqilun B, becoming the first "A absorbs B" case post-implementation of the "six merger rules" [3] - Various payment tools are being utilized, such as Guangku Technology's combination of share issuance, targeted convertible bonds, and cash for restructuring payments, enhancing transaction flexibility and reinforcing incentive constraints [3] Group 4 - Since 2025, the Shenzhen Stock Exchange has received 41 major asset restructuring applications, a year-on-year increase of 273%, with 15 approvals, marking a 114% increase; the average time from application to approval has been reduced by 22% [4] - TCL Technology's acquisition of a minority stake in Huaxing Semiconductor for 11.6 billion yuan serves as a typical example of efficient review services for the real economy, with the transaction taking only 61 days from application to approval [4] - The Shenzhen Stock Exchange plans to continue implementing the "six merger rules," enhancing regulatory service efficiency and supporting the successful execution of more benchmark restructuring projects [4]