Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulation materials market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and Dow are currently dominant in various segments, but domestic firms are rapidly advancing [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to compete effectively against established international players [8].

Group 1 - Company Weili expects a full-year loss of 350 million to 250 million in 2025 [1] - Company Shanshi Network Technology anticipates a full-year loss of 220 million to 180 million in 2025 [1] - Company Qiangli New Materials projects a full-year loss of 142 million to 100 million in 2025 [1] - Company Nongda Technology has newly listed shares on the Beijing Stock Exchange [1] Group 2 - Convertible bond code 118057 (Jiaoxi Convertible Bond) is not subject to forced redemption [2] - Convertible bond code 127062 (Lezhi Convertible Bond) will not undergo adjustment [2] - Convertible bond code 110089 (Xingfa Convertible Bond) is subject to forced redemption [2] Group 3 - Convertible bond code 113045 (Huanxu Convertible Bond) has a current price of 163.745, with a redemption price of 101.632 and a remaining scale of 0.182 billion [4] - Convertible bond code 113672 (Furong Convertible Bond) has a current price of 136.554, with a redemption price of 100.534 and a remaining scale of 0.024 billion [4] - Convertible bond code 118009 (Huarui Convertible Bond) has a current price of 159.074, with a redemption price of 101.105 and a remaining scale of 0.534 billion [4] - Convertible bond code 123159 (Songsheng Convertible Bond) has a current price of 168.297, with a redemption price of 100.540 and a remaining scale of 0.863 billion [4] - Convertible bond code 118029 (Fumiao Convertible Bond) has a current price of 138.132, with a redemption price of 100.218 and a remaining scale of 1.024 billion [4] - Convertible bond code 127042 (Jiawei Convertible Bond) has a current price of 508.000, with a redemption price of 100.893 and a remaining scale of 1.011 billion [4] - Convertible bond code 118043 (Fuli Convertible Bond) has a current price of 160.044, with a redemption price of 100.397 and a remaining scale of 2.364 billion [4] - Convertible bond code 127039 (Beigang Convertible Bond) has a current price of 135.000, with a redemption price of 101.130 and a remaining scale of 6.203 billion [4] - Convertible bond code 123242 (Sailong Convertible Bond) has a current price of 133.250, with a redemption price of 100.330 and a remaining scale of 1.536 billion [4] - Convertible bond code 127071 (Tianjian Convertible Bond) has a current price of 134.900, with a redemption price of 100.810 and a remaining scale of 4.917 billion [4] - Convertible bond code 123182 (Guanglian Convertible Bond) has a current price of 156.595, with a redemption price of 100.960 and a remaining scale of 6.552 billion [4] - Convertible bond code 111016 (Shentong Convertible Bond) has a current price of 132.137, with a remaining scale of 4.154 billion [4] - Convertible bond code 113639 (Huazheng Convertible Bond) has a current price of 183.222, with a remaining scale of 4.878 billion [4] Group 4 - Convertible bond code 128097 (Aojia Convertible Bond) has a current price of 109.912, with a redemption price of 110.000 and a remaining scale of 4.580 billion [6] - Convertible bond code 128101 (Lianchuang Convertible Bond) has a current price of 122.888, with a redemption price of 110.000 and a remaining scale of 2.978 billion [6] Group 5 - Xingfa Convertible Bond is subject to forced redemption [7] - Yongxi Convertible Bond is not subject to forced redemption [7] - Lezhi Convertible Bond will not undergo adjustment [7] - Convertible bond code 127042 (Naipu Convertible Bond) is set to be listed on January 30 [7]

Core Viewpoint - Strongly New Materials (300429.SZ) expects a loss of 100 million to 142 million yuan in 2025, a decrease from the previous year's loss of 181.693 million yuan, indicating an improvement in financial performance despite ongoing challenges [1] Financial Performance - The company reported a loss for the current reporting period, but the loss has decreased compared to the previous year [1] - The expected non-recurring gains and losses will impact net profit by approximately 5.5 million to 8 million yuan [1] Factors Influencing Performance - Market demand and competitive environment have led to a recovery in gross profit during the reporting period [1] - Research and development expenses have increased during the current reporting period [1] - The company plans to recognize inventory impairment losses of 27.3 million yuan and non-current asset impairment losses of 51.2 million yuan [1]

Group 1 - The company, Strongly New Materials, announced an expected net profit loss attributable to shareholders of 100 million to 142 million yuan for the fiscal year 2025, compared to a loss of 182 million yuan in the same period last year [2]

Core Viewpoint - The company Strongly New Materials expects a net profit loss of 100 million to 142 million yuan for the fiscal year 2025, indicating a decrease in losses compared to the previous year [1] Group 1: Financial Performance - The company experienced a loss during the reporting period, but the loss has decreased compared to the previous year [1] - The gross profit has shown some recovery due to market demand and competitive environment [1] - The company plans to recognize an inventory impairment loss of 27.3 million yuan and a non-current asset impairment loss of 51.2 million yuan [1] Group 2: R&D and Non-Recurring Items - Research and development expenses have increased during the reporting period [1] - The expected impact of non-recurring gains and losses on net profit is estimated to be between 5.5 million and 8 million yuan [1]

| 证券代码：300429 | 证券简称：强力新材 | 公告编号：2026-002 | | --- | --- | --- | | 债券代码：123076 | 债券简称：强力转债 | | 2025 年 1 月 1 日-2025 年 12 月 31 日 （二）业绩预告情况 预计净利润为负值 | 项 | 目 | | 本报告期 | | 上年同期 | | --- | --- | --- | --- | --- | --- | | 归属于上市公司 | | 亏损：10,000 | 万元–14,200 | 万元 | 亏损：18,169.30 万元 | | 股东的净利润 | | | | | | | 扣除非经常性损 | | 亏损：10,550 | 万元–15,000 | 万元 | 亏损：19,860.27 万元 | | 益后的净利润 | | | | | | 常州强力电子新材料股份有限公司 2025年度业绩预告 二、与会计师事务所沟通情况 公司本次业绩预告的相关财务数据未经注册会计师审计。公司已就业绩预 告有关事项与会计师事务所进行了预沟通，公司与会计师事务所在本次业绩预 告方面不存在分歧。 本公司及董事会全体成员保证信息披露的 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign competitors [7][8]. - The investment landscape is categorized into different stages, from seed rounds to pre-IPO, with varying levels of risk and focus areas for investors [10]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulants market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the electronics sector [8]. Competitive Landscape - Domestic companies such as Dinglong Co., Guofeng New Materials, and SanYueKe are positioned to compete with international firms like Fujifilm and Toray in the advanced packaging materials market [8]. - The article emphasizes the importance of innovation and R&D investment for domestic firms to successfully penetrate and thrive in this competitive landscape [7][10].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign suppliers in critical sectors [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific segments such as conductive adhesives are forecasted to reach $3 billion by 2026, while chip bonding materials are estimated to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. Key Players - Domestic companies like Dinglong Co., Guofeng New Materials, and SanYue Technology are positioned to compete with international firms such as Fujifilm and Toray in the advanced packaging materials sector [8]. - The article lists various domestic and foreign companies involved in different segments of the advanced packaging materials market, indicating a competitive landscape [8]. Investment Strategies - The article outlines investment strategies across different stages of the new materials industry, emphasizing the importance of team assessment, industry analysis, and market entry barriers [10]. - It suggests that investments in mature products with established sales channels present lower risks and higher returns, while seed and early-stage investments carry higher risks [10]. Future Trends - The article anticipates significant growth in various new materials sectors, including epoxy resin and thermal interface materials, with projections indicating substantial increases in market size by 2027 and beyond [8]. - The focus on domestic substitution for critical materials is highlighted as a key trend, with potential for significant market disruption and opportunities for local companies [7][8].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are identified as key growth areas, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article outlines various advanced packaging materials and their projected market sizes, indicating significant growth potential in sectors like conductive adhesives, chip bonding materials, and epoxy encapsulants [8]. - For instance, the conductive adhesive market is expected to reach 3 billion yuan by 2026, while the epoxy encapsulant market is projected to grow to 99 million USD by 2027 [8]. Competitive Landscape - The article lists both domestic and international players in the advanced packaging materials market, emphasizing the competitive dynamics and the potential for domestic companies to capture market share from established foreign firms [8]. - Companies such as 鼎龙股份, 国风新材, and 三月科 are highlighted as key domestic players in the PSPI segment, while international competitors include Fujifilm and Toray [8]. Investment Strategies - Different investment stages in the new materials industry are discussed, with a focus on the varying risk levels and investment strategies appropriate for each stage, from seed funding to pre-IPO [10]. - The article emphasizes the importance of thorough industry and team assessments at each investment stage to mitigate risks and maximize returns [10].

Market Overview - As of January 19, the Shanghai Composite Index closed at 4114.00 points, up 12.09 points, with a gain of 0.29% [1] - The Shenzhen Component Index closed at 14294.05 points, up 12.97 points, with a gain of 0.09% [1] - The ChiNext Index closed at 3337.61 points, down 23.41 points, with a decline of 0.70% [1] Stock Performance - A total of 86 A-shares had a turnover rate exceeding 20%, indicating significant trading activity [1] - Key stocks with high turnover rates included: - Kema Materials (科马材料) with a turnover rate of 62.05% and a closing price of 40.25 yuan, down 26.75% [1] - Kuntai Co. (坤泰股份) with a turnover rate of 54.99% and a closing price of 24.74 yuan, up 4.70% [1] - Sanbian Technology (三变科技) with a turnover rate of 48.63% and a closing price of 21.97 yuan, up 10.02% [1] - Nabichuan (纳百川) with a turnover rate of 44.29% and a closing price of 80.88 yuan, up 8.83% [1] - Hongxiang Co. (红相股份) with a turnover rate of 40.96% and a closing price of 17.99 yuan, up 15.17% [1] Notable Stocks - Other notable stocks with high turnover rates included: - Kangqiang Electronics (康强电子) at 40.96% turnover, closing at 23.48 yuan, up 7.46% [1] - Fangzheng Electric (方正电机) at 39.47% turnover, closing at 16.53 yuan, up 5.09% [1] - Shuangjie Electric (双杰电气) at 39.16% turnover, closing at 14.82 yuan, up 20.00% [1] - Deen Precision (德恩精工) at 39.15% turnover, closing at 24.19 yuan, up 2.76% [1] - C Zhi Xin (C至信) at 37.80% turnover, closing at 52.04 yuan, down 6.54% [1]