强力新材（300429.SZ）2月25日在投资者互动平台表示，该项目目前仍处于亏损状态。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：简单介绍一下LCD光刻胶用纳米色浆项目开启量产之 后对公司的影响？ ...

在AI算力（核心股）需求爆发、高带宽存储器（HBM）技术迭代加速的背景下，A股HBM（高带宽存 储器）产业链今日迎来集体爆发，从上游材料、设备到封装测试，各环节个股纷纷走强，资金关注度持 续提升。拓荆科技、宏昌电子、精智达、联瑞新材、芯碁微装领涨，板块产业链相关企业整理如下： 拓荆科技（688072.SH） 宏昌电子（603002.SZ） 最新股价：11.54元 日涨幅：+8.97% 核心看点：国内电子级环氧树脂龙头，电子级环氧树脂是HBM建设所需材料环氧塑封料的上游，为 HBM封装提供关键基材支撑。 精智达（688627.SH） 最新股价：313.00元 日涨幅：+7.28% 最新股价：360.00元 日涨幅：+9.98% 核心看点：拟减持；国内ALD设备主要供应商之一，ALD沉积在HBM工艺中不可或缺，设备广泛应用 于HBM制造的关键环节。 核心看点：根据新技术和新应用在半导体（核心股）存储器方面的新要求，配合客户业务稳步推进开发 针对如HBM等新一代半导体存储器测试需求的测试技术和设备，为客户提供可应用于HBM领域的完整 测试方案。 联瑞新材（688300.SH） 最新股价：68.50元 日涨幅：+6. ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market sizes and growth rates anticipated [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: expected to grow from approximately $485 million in 2023 to $684 million by 2029 [8]. - The investment landscape is characterized by a shift towards domestic production, with numerous Chinese companies emerging as competitors to established foreign firms [7][8]. Industry Trends - The article emphasizes the trend of domestic substitution in advanced materials, particularly in sectors heavily reliant on imports from countries like Japan [7][8]. - It highlights the importance of innovation and R&D in maintaining competitive advantages within the industry [7][8]. Strategic Insights - Investment strategies vary across different stages of company development, from seed rounds to pre-IPO phases, with a focus on team capabilities, market potential, and product maturity [10]. - The article suggests that the current market conditions present a favorable environment for investments in advanced materials, particularly for companies that can demonstrate strong growth potential and innovative capabilities [10].

经济观察网 根据雪球的报道，强力新材（300429）（300429）在2026年至2027年期间有以下产线投产 或建设计划值得关注： 公司项目推进 公司项目推进 2027年事件： 半导体掩膜版二期（40-28nm）产线预计2027年建成投产。 先进封装材料PSPI二期（产能136.2吨/年）计划2027年投产，总产能将提升至395.2吨/年。 OLED材料：通过合资公司强力昱镭，HT/ET有机发光材料计划于2027年实现规模化量产，已与LG化学 共建评价实验室。 2026年事件： 半导体光刻胶材料：KrF光刻胶光引发剂及配套材料将于2026年进入规模化量产；28nm逻辑芯片用光刻 胶计划在2026年量产，合作方包括中芯国际和长江存储。 半导体掩膜版：一期产线（130-40nm）将于2026年全面投产；二期产线（40-28nm）计划于2026年启动 建设。 先进封装材料：PSPI一期（产能259吨/年）预计2026年投产或量产，目前已通过盛合晶微验证并导入华 为昇腾供应链。 PCB及光引发剂：南通基地的PCB光刻胶光引发剂和半导体级PAG将于2026年满产；常州基地的环保型 光引发剂和UV-LED树脂新产能计划 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulant market is anticipated to grow to $9.9 billion by 2027, indicating strong demand for these materials in the electronics sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and JSR dominate certain segments, while domestic firms are emerging as strong competitors [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to successfully compete against established international players [8].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are identified as key growth areas, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article outlines various advanced packaging materials and their projected market sizes, indicating significant growth potential in areas like conductive adhesives, chip bonding materials, and epoxy encapsulants [8]. - For instance, the conductive adhesive market is expected to reach 3 billion yuan by 2026, while the epoxy encapsulant market is projected to grow to 99 million USD by 2027 [8]. Competitive Landscape - The article lists both domestic and international players in the advanced packaging materials market, emphasizing the competitive nature of the industry [8]. - Companies such as Fujifilm, Toray, and domestic firms like Dinglong Co. and Guofeng New Materials are highlighted as key competitors [8]. Investment Strategies - Different investment stages in the new materials industry are discussed, with a focus on the importance of team assessment, industry analysis, and market entry strategies [10]. - The article suggests that early-stage investments carry high risks but can yield significant returns if the right resources and teams are in place [10].

| | | 常州强力电子新材料股份有限公司 关于为全资子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、担保情况概述 常州强力电子新材料股份有限公司（以下简称"公司"）于 2025 年 4 月 28 日召开了第五届董事会第十六次会议及第五届监事会第八次会议，会议审议通过 了《关于公司及子公司、孙公司银行综合授信提供相互担保的议案》。为满足公 司及控股子公司、孙公司日常经营活动需要，公司及控股子公司、孙公司向银行 申请综合授信额度提供相互担保，担保总金额不超过 12 亿元人民币，担保期限 12 个月，自公司 2024 年年度股东大会审议通过之日起算。具体内容详见公司于 2025 年 4 月 29 日在巨潮资讯网（www.cninfo.com.cn）上披露的《关于公司及 子公司、孙公司银行综合授信提供担保的公告》（公告编号：2025-014）。2025 年 5 月 23 日，该议案已经公司召开的 2024 年年度股东大会审议通过。 二、担保的进展情况 公司全资子公司常州强力先端电子材料有限公司（以下简称"强力先端"）、 常州强力光电材料 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign suppliers in critical sectors [7][8]. Group 1: Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and conductive adhesives are identified as key growth areas, with PSPI's market size in China expected to increase from 7.12 billion yuan in 2021 to 9.67 billion yuan by 2025 [8]. Group 2: Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, indicating significant investment potential in sectors like semiconductor materials and new display materials [8]. - Companies such as 鼎龙股份, 国风新材, and 三月科 are highlighted as domestic players poised to benefit from the shift towards local sourcing of advanced materials [8]. Group 3: Future Projections - The market for conductive adhesives is expected to reach $3 billion by 2026, while the market for chip bonding materials is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The article emphasizes the importance of innovation and R&D in maintaining competitive advantages in the rapidly evolving materials landscape [8].

Core Viewpoint - The company, Strongly New Materials (300429), is currently in the customer validation phase for its photosensitive polyimide (PSPI), and the work is progressing normally [1] Group 1 - The company's PSPI product is still undergoing validation by downstream customers [1] - The validation process is reported to be progressing normally [1]

Group 1 - The core viewpoint of the article is that Strongly New Materials (300429.SZ) is currently in the process of customer validation for its photosensitive polyimide (PSPI), and the work is progressing normally [1] Group 2 - The company has communicated with investors through an interactive platform regarding the status of its PSPI product [1] - The validation phase indicates that the product is being tested by downstream customers, which is a critical step before full-scale commercialization [1] - The ongoing progress suggests that the company is actively working to meet customer requirements and expectations [1]