我是芯片超人花姐，入行20年，有50W+芯片行业粉丝。 有很多不方便公开发公众号的， 关于芯片买卖、关于资源链接等， 我会分享在朋友圈 。 扫码加我本人微信 | 分类 | 公司 | 2025年营收 | 同比 | 业务表现 | | --- | --- | --- | --- | --- | | 模拟/混合信号芯片 | TI | 176.8亿美元 | 13% | 各终端市场，均增长 | | 模拟/混合信号芯片 | ST | 118亿美元 | -11% | 下滑11%, 分化明显 | | 模拟/混合信号芯片 | NXP | 122.7亿美元 | -3% | Q4所有终端市场环比改善 | | 模拟/混合信号芯片 | 瑞欧 | 1.3212万亿日元 | 2% | 时隔6年转为亏损 | | 模拟/混合信号芯片 | Microchip | | | 新财季同比、环比均增长 | | 模拟/混合信号芯片 | Qorvo | | | 营收超预期 | | 模拟/混合信号芯片 | 安森美 | | | 三部门下滑均超10% | | 模拟/混合信号芯片 | 英语 | | | 人工智能需求强劲 | | 模拟/混合信号芯片 | 思瑞浦 | | ...

公众号记得加星标⭐️，第一时间看推送不会错过。 2026年来，全球MEMS行业迎来了前所未有的整合浪潮：意法半导体收购恩智浦MEMS传感器业 务，英飞凌计划收购ams OSRAM的非光学传感器业务，SiTime收购瑞萨电子定时业务，Qorvo剥 离自身MEMS传感解决方案... 英飞凌收购ams OSRAM非光学传感器产品组合： 2026年2月，英飞凌宣布计划以5.7亿欧元收购 ams OSRAM的非光学模拟/混合信号传感器产品组合，此次收购将以无晶圆厂资产交易的形式进行， 涵盖产品、研发能力、知识产权以及测试/实验室设备。对于ams OSRAM而言，此次交易符合其优先 发展核心光学领域并实现非光学资产变现的战略目标。而英飞凌此次收购将拓展其传感器产品线，并 增强其在汽车、工业和医疗领域的系统能力，尤其是瞄准新兴的人形机器人赛道，打造与之高度契合 的产品组合，抢占未来增长先机。这表明MEMS相关传感领域的领先企业越来越需要更全面的工具箱 来满足完整的应用需求，包括接口、信号链和高可靠性解决方案等。 SiTime 15亿美元收购瑞萨电子的定时业务： 值得注意的是，这并非传统的MEMS传感器交易，但定 时技术是M ...

汇丰银行将意法半导体目标价从29欧元上调至35欧元。 来源：滚动播报 ...

The global semiconductor industry appears to be going through structural tailwinds. Fueled by the artificial intelligence (AI) infrastructure boom, global semiconductor industry annual sales are projected to touch $975 billion in 2026, a historic peak. Furthermore, with sustained growth, annual sales may touch $2 trillion by 2036. With that in mind, it's unsurprising that semiconductor stocks have surged higher. While some investors might have missed out on the big rally, there also still seem to be pock ...

Group 1 - The Bloomberg Electric Vehicle Price Return Index increased by 1.32%, closing at 3662.78 points [1] - SQM, a Chilean chemical and mining company, saw a stock price increase of 7.1% [1] - US-based Albemarle Corporation's stock rose by 4.3% [1] - Xiaomi Group's H-shares closed up by 4.27% [1] - STMicroelectronics' stock in Europe increased by 2.92% [1] - Hesai Technology's stock declined by 6.2% [1] - Lucid Group's stock fell by 8.3% [1]

Core Insights - The International Solid-State Circuits Conference (ISSCC) will take place from February 15 to 19, 2026, in San Francisco, showcasing significant advancements in semiconductor technology [2] Group 1: AI Chips - AMD's latest AI GPU, Instinct MI350, features a CDNA4 architecture with a theoretical peak performance increase of 1.9 times compared to its predecessor, and improvements in HBM input/output bandwidth and memory capacity by 1.5 times [2] - Rebellions has developed a large-scale AI inference subsystem using UCIe protocol, achieving a performance of 56.8 TPS on the Llama 3.3 model with 700 billion parameters [3] - IBM's AI accelerator, Spyre, is optimized for inference, boasting a throughput 32% higher than the latest GPUs and energy efficiency 2 to 3 times better [3] - MediaTek's MADiC, a generative diffusion accelerator, achieves performance of 7.4 TOPS/mm² and 17.4 TOPS/W, designed for generative image editing on edge devices [4] - NVIDIA's ALPhA-Vision real-time image processor has a face detection latency of 787 microseconds and an accuracy rate of 99.3% [5] Group 2: Memory Technologies - SanDisk and Kioxia have developed a 3D NAND flash memory with a density of 37.6 Gbit/mm², capable of reaching a storage capacity of 2 Tbit and a write speed of 85 MB/s [6] - Samsung is set to release a DRAM module with a capacity of 36GB and a data transfer rate of up to 3.3 TB/s, utilizing 12 chips stacked together [7] - SK Hynix has developed a 16Gbit LPDDR6 SDRAM with a data transfer rate of 14.4 Gbps per I/O pin [7] - Samsung will also introduce a 16Gbit LPDDR6 SDRAM with a data transfer rate of 12.8 Gbps [8] - SK Hynix's 24Gbit GDDR7 DRAM targets mid-range AI inference applications with a data transfer rate of 48 Gbps [8] Group 3: Image Sensors - STMicroelectronics will showcase a lidar receiver with a field of view of 54°×42° and a power consumption of 153 mW [9] - Sony Semiconductor Solutions has developed a Ge-on-Si SPAD sensor array designed for low-power AR/VR applications, with a power consumption of 26 mW at 30 fps [10] - SmartSens Technology's CMOS image sensor features 200 million pixels and supports 8K video recording at 60 fps [11] Group 4: AI Chip Presentations - NVIDIA will present its GB10 processor for desktop AI supercomputers, featuring 20 Armv9.2 cores and a performance of 31 TFLOPS in FP32 mode [12] - STMicroelectronics will discuss the STM32N6 microcontroller series, integrating an Arm Cortex-M55 CPU and a Neural-ART NPU with performance of 600 GOPS and 3 TOPS/W [13] - Microsoft will explain its AI accelerator architecture, MAIA, focusing on packaging technology and power management [13]

| STM 意法半导体 | 03 | | --- | --- | | 32.510 + +2.660 +8.91% | 收盘价 02/09 16:00 美东 | | 32.900 + 0.390 +1.20% | 盘前价 02/10 04:37 美东 | | 二 24 8 8 ~ 8 目 ♥自选 | ● 快捷交易 | | 最高价 33.000 | 开盘价 32.000 成交量 1678.68万 | | 最低价 31.960 | 昨收价 29.850 成交额 5.45亿 | | 平均价 32.464 | 市盈率TTM 180.61 总市值 288.94亿 … | | 振 幅 3.48% | 市盈率(静) 180.61 总股本 8.89亿 | | 换手率 2.65% | 市净率 1.620 流通值 206.18亿 | | 52周最高 33.246 | 委 比 -- 流通股 6.34亿 | | 52周最低 17.084 | 量 比 1.81 色 手 1股 | | 历史最高 54.400 | 股息ITM 0.360 | | 历史最低 2.562 | 股息率ITM 1.110% | 昨日大幅收涨8.91%的意法半导体( ...

Core Insights - STMicroelectronics has introduced the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration for edge intelligence, aimed at future software-defined vehicles [2][3] - The Stellar P3E simplifies multi-function integration for X-in-1 Electronic Control Units (ECUs), reducing system cost, weight, and complexity [2][3] Technical Features - The Stellar P3E features an integrated ST Neural-ART Accelerator™, making it the first MCU with an embedded neural network accelerator for the automotive industry, enabling real-time AI efficiency [3][4] - It delivers inference processing at microsecond speeds, achieving up to 30 times greater efficiency compared to traditional MCU core processors, supporting always-on, low-power AI for real-time functions [4][5] - The MCU's integrated xMemory, based on phase-change memory (PCM), offers twice the density of traditional embedded flash memory, allowing dynamic expansion of software storage without hardware redesign [6] Applications and Benefits - The Stellar P3E enables advanced capabilities such as predictive maintenance and smart sensing with virtual sensor applications, facilitating low latency sensing and actuation control [5][8] - It supports a wide range of applications, enhancing charging speed and efficiency in electric vehicles and enabling rapid deployment of new features [4][5] Ecosystem and Support - The P3E is fully supported within the ST Edge AI Suite, which includes tools like NanoEdge AI Studio for data scientists and embedded engineers, streamlining the deployment of sophisticated edge AI solutions [7] - The Stellar P3E is integrated into Stellar Studio, ST's all-in-one development environment tailored for automotive engineers, reinforcing a robust hardware and software ecosystem [7] Production Timeline - The start of production for the Stellar P3E is planned for the fourth quarter of 2026 [9]

Core Insights - STMicroelectronics has introduced the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration, aimed at enhancing vehicle intelligence and enabling real-time AI applications at the edge [1][2] Group 1: Product Features - The Stellar P3E combines high-performance real-time control and edge AI in a single device, meeting the highest automotive safety levels, and supports applications like virtual sensors [2] - It features an integrated ST Neural-ART Accelerator™ for real-time AI efficiency, achieving up to 30 times greater efficiency compared to traditional MCU core processors, enabling always-on, low-power AI for functions like predictive maintenance [3][4] - The MCU supports dynamic expansion of software storage through its integrated xMemory, which offers twice the density of traditional embedded flash memory, allowing for new features and updates without hardware redesign [5] Group 2: Market Impact - The shift of neural processing from centralized hubs to the vehicle edge allows for sub-millisecond decision-making, essential for next-generation in-vehicle intelligence, enabling advanced capabilities like predictive maintenance and smart sensing [4] - The Stellar P3E is part of the ST Edge AI Suite, which provides a comprehensive ecosystem for edge AI deployment, including tools like NanoEdge AI Studio and Stellar Studio for automotive engineers [6] Group 3: Production Timeline - Production of the Stellar P3E is planned to start in the fourth quarter of 2026 [7]

Chart created using Benzinga ProThe Golden Cross SignalTechnically, STM stock has shifted from repair to breakout mode. The 50-day simple moving average (SMA) at $27.18 has crossed over the 200-day SMA at 26.96, indicating strong bullish momentum taking over the chart. Momentum is turning up, volatility is compressing, and buyers have begun to show up on pullbacks rather than panicking into them. For chart purists, this is the kind of crossover that attracts systematic and momentum funds if price action con ...