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Singapore's largest industrial district cooling system begins operations to support STMicroelectronics' decarbonization strategy
Globenewswire· 2025-10-21 06:00
Core Insights - STMicroelectronics and SP Group have launched Singapore's largest industrial district cooling system at Ang Mo Kio TechnoPark to support decarbonization efforts [2][3] - The system aims to reduce carbon emissions by up to 120,000 tonnes annually and achieve a 20% reduction in cooling-related electricity consumption [3][8] - This initiative aligns with STMicroelectronics' commitment to becoming carbon neutral by 2027 [3][4] Company Initiatives - The district cooling system has an installed capacity of 36,000 refrigeration tonnes and serves an area of approximately 90,000 square meters [5][8] - The project has achieved over 2 million accident-free man hours during construction and received the Green Mark Platinum Super Low Energy certification [10] - STMicroelectronics is also upgrading the cooling system at its Toa Payoh site under a 20-year agreement with SP Group, aiming to reduce carbon emissions by approximately 2,140 tonnes annually [11] Technological Advancements - The cooling system utilizes advanced technologies, including a centralized closed-loop pipe network, to enhance energy efficiency and reliability [5][6] - The partnership includes the deployment of an energy management information system with 2,400 smart electricity meters to monitor energy consumption [12] - Smart water meters have been implemented to track water inflow, improving water efficiency in wafer fabrication operations [13] Environmental Impact - The new cooling system will repurpose over half a million cubic meters of water annually, contributing to resource conservation [3][8] - The project has reduced embodied carbon by about 44% compared to industrial benchmarks through optimized material choices [10] - STMicroelectronics is on track to achieve 100% renewable electricity sourcing by the end of 2027 [14]
Singapore’s largest industrial district cooling system begins operations to support STMicroelectronics’ decarbonization strategy
Globenewswire· 2025-10-21 06:00
Core Insights - STMicroelectronics and SP Group have launched Singapore's largest industrial district cooling system at Ang Mo Kio TechnoPark, supporting ST's decarbonization strategy and sustainability goals [1][2][3] Environmental Impact - The new cooling system is projected to reduce carbon emissions by up to 120,000 tonnes annually and achieve a 20% reduction in cooling-related electricity consumption [2][15] - It will repurpose over half a million cubic meters of water each year by utilizing reject reverse osmosis water from ST's cooling towers [2][15] System Specifications - The district cooling system has an installed capacity of up to 36,000 refrigeration tonnes (RT) and serves an area of approximately 90,000 square meters through a centralized closed-loop pipe network [4][15] - The system employs chillers in a series counterflow configuration to enhance energy efficiency and ensure reliable 24/7 operation [5] Safety and Certification - The project achieved over 2 million accident-free man hours during construction and received the Green Mark Platinum Super Low Energy certification for its energy efficiency and sustainable design [7] Future Collaborations - STMicroelectronics and SP Group are collaborating on upgrading the cooling system at ST's Toa Payoh site, aiming to reduce carbon emissions by approximately 2,140 tonnes annually under a 20-year chilled-water-as-a-service agreement [8] - The partnership also includes the implementation of an energy management information system (EMIS) and smart water meters to enhance energy and water efficiency across ST's campuses [9][10]
ST introduces new image sensors for industrial automation, security and retail applications
Globenewswire· 2025-10-20 06:00
Core Insights - STMicroelectronics has introduced a new family of 5MP CMOS image sensors aimed at enhancing industrial automation, security, and retail applications [2] - The new sensors feature hybrid global and rolling shutter modes, optimizing image capture for various applications, ensuring high-quality imaging and motion-artifact-free video [3][7] - The image sensor market is projected to reach $3.9 billion by 2030, with over 500 million units expected to be shipped, driven by advancements in sensor performance [4] Product Features - The new sensors, part of the ST BrightSense portfolio, include models VD1943, VB1943, VD5943, and VB5943, ready for evaluation with mass production starting in February 2026 [5] - The sensors utilize advanced 2.25 µm pixel technology and 3D stacking, providing high image quality in a compact design, suitable for space-constrained embedded vision systems [8][9] - On-chip RGB-IR separation in RGB-IR variants simplifies system design and reduces costs while maintaining full 5MP resolution for both color and infrared imaging [10] Performance Enhancements - The sensors incorporate backside illumination (BSI) and capacitive deep trench isolation (CDTI) technologies, enhancing sensitivity and sharpness, especially in low-light conditions [11] - Single-frame on-chip HDR improves detail visibility across varying lighting conditions, supporting advanced machine vision and edge AI applications [11]
STMicroelectronics Q3 Earnings Preview: Signs Of Life, But The Cycle Hasn't Turned
Seeking Alpha· 2025-10-17 13:30
Group 1 - The core viewpoint is that STMicroelectronics is facing structural challenges that overshadow early signs of recovery, as indicated by Q2 2025 results [1] - In Q2 2025, STMicroelectronics reported revenue of $2.77 billion, which slightly exceeded guidance [1] - The gross margin for STMicroelectronics in Q2 2025 was 33.5%, highlighting potential profitability concerns [1] Group 2 - The analyst emphasizes a preference for investing in companies within oligopolistic sectors that have high barriers to entry, while avoiding smaller companies due to underestimated risks [1] - The investment approach focuses on growth at a reasonable price, with a mid- to long-term investment horizon [1]
小摩维持意法半导体(STM.US)“中性”评级:短期业绩无虞 2026年汽车阴霾难散
Zhi Tong Cai Jing· 2025-10-17 08:35
Core Viewpoint - Morgan Stanley maintains a "neutral" rating on STMicroelectronics (STM.US) with a target price of €26.40, citing uncertainty in growth expectations for fiscal year 2026 primarily due to the ongoing weakness in the automotive sector [1][2]. Group 1: Q3 Performance Expectations - STMicroelectronics is expected to report Q3 revenue of $3.17 billion, reflecting a quarter-over-quarter increase of 14.6% but a year-over-year decline of approximately 2.5%, aligning with market consensus and company guidance [1]. - The Analog, Power and Discrete (APMS) segment is projected to decline by about 9.9% year-over-year, while the Microcontrollers, Digital Integrated Circuits, and RF Products (MDRF) segment is expected to grow by approximately 9.4% year-over-year [1]. - Q3 gross margin is anticipated to be 33.5%, consistent with consensus expectations, while EBIT is projected at $202 million with an EBIT margin of 6.4% [1]. Group 2: Q4 Outlook - Market consensus expects Q4 revenue for STMicroelectronics to be $3.35 billion, representing a quarter-over-quarter increase of 5.6% and a year-over-year increase of 1.0% [2]. - Gross profit for Q4 is projected at $1.17 billion, with a quarter-over-quarter increase of 10.3% but a year-over-year decline of 6.4%, leading to an expected gross margin of 35.0% [2]. - The company anticipates growth in automotive and industrial segments in Q4, supported by improved capacity utilization and production efficiency [2]. Group 3: Long-term Concerns - Morgan Stanley expresses caution regarding STMicroelectronics' performance in 2026, highlighting persistent issues in the automotive market and high inventory levels, which may hinder capacity utilization unless a significant economic recovery occurs [3]. - The current market consensus predicts a 12.5% year-over-year sales growth for STMicroelectronics in 2026, along with a gross margin increase of 273 basis points, but Morgan Stanley considers these projections overly optimistic [2][3].
大行评级丨小摩:维持意法半导体“中性”评级,目标价26.40欧元
Ge Long Hui· 2025-10-17 08:32
Group 1 - Morgan Stanley maintains a "neutral" rating on STMicroelectronics with a target price of €26.40 [1] - There is a certain level of optimism in the market regarding the company's Q3 performance and Q4 guidance [1] - However, the growth expectations for the fiscal year 2026 remain highly uncertain, primarily due to the ongoing weakness in the automotive sector [1]
9份料单更新!出售TI、NXP、ORIENT等芯片
芯世相· 2025-10-16 08:22
Core Insights - The article discusses the challenges of managing excess inventory in the semiconductor industry, highlighting the financial burden of storage and capital costs associated with unsold materials [1] - It emphasizes the services provided by Chip Superman, which has served 21,000 users and offers rapid inventory clearance solutions [8] Group 1: Inventory Management - Excess inventory of 100,000 units incurs monthly storage and capital costs of at least 5,000, leading to a potential loss of 30,000 after six months [1] - The article suggests that companies struggling to sell their materials can utilize Chip Superman's services for better pricing and faster transactions [1][9] Group 2: Inventory Offerings - Chip Superman has a substantial inventory, with over 1,000 models and 50 million chips valued at over 100 million [7] - The article lists various semiconductor components available for sale, including specific brands and quantities, indicating a diverse inventory [4][5] Group 3: Purchase Requests - The article includes a section for companies looking to purchase specific semiconductor components, indicating a demand for certain materials [6] Group 4: Service Efficiency - Chip Superman claims to complete transactions in as little as half a day, showcasing its efficiency in clearing inventory [8]
3D IC Market Size to Surpass USD 50.19 Billion by 2033, Rising at 14.64% CAGR | SNS Insider
Globenewswire· 2025-10-15 14:00
Core Insights - The 3D IC market is projected to grow from USD 16.85 billion in 2025 to USD 50.19 billion by 2033, with a CAGR of 14.64% from 2026 to 2033 [1][7] - The market is driven by the increasing demand for high-performance and energy-efficient chips across various applications, including AI, 5G, HPC, and smartphones [1] Market Size and Growth - The U.S. 3D IC market is estimated at USD 4.75 billion in 2025 and is expected to grow at a CAGR of 14.33%, reaching USD 13.86 billion by 2033 [2] Key Segmentation By 3D Technology - Wafer-level packaging is expected to hold the largest market share at 68.23% in 2025, driven by trends in miniaturization and cost savings [8] - System integration is projected to be the fastest-growing technology with a CAGR of 14.79% due to rising demand for heterogeneous integration [8] By Product - Sensors are anticipated to lead the market with a 33.14% share in 2025, crucial for real-time data processing in various applications [9] - The memories segment is expected to grow the fastest, with a CAGR of 15.33%, driven by the needs of cloud computing and AI [9] By Application - The ICT/Telecommunication segment is expected to dominate with a 34.65% share in 2025, fueled by high-speed networking and 5G adoption [10] - Consumer electronics are projected to witness the fastest growth at a CAGR of 15.92%, driven by advanced smartphones and gaming systems [10] By Component - The Through Silicon Vias (TSVs) segment is projected to hold the largest share at 46.32% in 2025, known for better interconnections and lower power consumption [11] - The Through Glass Vias (TGVs) segment is expected to grow at the fastest CAGR of 15.16% due to superior electrical properties [12] Regional Insights - North America is expected to dominate the 3D IC market in 2025, accounting for 39.12% of revenue, driven by R&D in AI and cloud computing [13] - The Asia Pacific region is projected to experience the fastest growth from 2026 to 2033, with a CAGR of 15.45%, supported by a strong semiconductor manufacturing base [13] Leading Market Players - Key players in the 3D IC market include IBM, ASE Technology Holding Co. Ltd., STMicroelectronics, SAMSUNG, Taiwan Semiconductor Co. Ltd., TOSHIBA CORPORATION, Micron Technology Inc., MonolithIC 3D Inc., Intel Corporation, TEZZARON, Amkor Technology, Jiangsu Changdian Technology Co. Ltd., and United Microelectronics Corporation [5]
10份料单更新!出售TI、英飞凌、NXP等芯片
芯世相· 2025-10-13 09:25
Core Insights - The article discusses the challenges of managing excess inventory in the semiconductor industry, highlighting the financial burden of storage and capital costs associated with unsold materials [1] - It promotes a service called "Chip Superman," which has served 21,000 users and offers rapid inventory clearance solutions [8] Group 1: Inventory Management - Excess inventory of 100,000 units incurs monthly storage and capital costs of at least 5,000, leading to a potential loss of 30,000 after six months [1] - The article emphasizes the difficulty in promoting and selling surplus materials, suggesting that companies can seek assistance from Chip Superman for better pricing and faster transactions [1][10] Group 2: Inventory Offerings - A list of available materials for sale is provided, including various brands and models, with quantities ranging from 1,000 to 150,000 units [4][5] - The inventory includes components from well-known manufacturers such as Infineon, NXP, TI, and Micron, indicating a diverse stock that could appeal to different buyers [4][5] Group 3: Demand for Components - The article also includes a request for specific components, indicating ongoing demand in the market for certain semiconductor parts [6] - The requested components include popular models from brands like TI and ST, with quantities ranging from 5,000 to 40,000 units [6] Group 4: Company Capabilities - Chip Superman operates a 1,600 square meter smart warehouse with over 1,000 models and a total inventory of 50 million chips, valued at over 100 million [7] - The company has an independent laboratory in Shenzhen for quality control, ensuring that each component meets industry standards [7]
11份料单更新!出售TI、NXP、安世等芯片
芯世相· 2025-10-11 04:04
Core Insights - The article discusses the challenges of managing excess inventory in the semiconductor industry, highlighting the financial burden of storage and capital costs associated with unsold materials [1] - It promotes a service called "Chip Superman," which has served 21,000 users and offers rapid inventory clearance solutions [8][9] Inventory Management - The company faces significant costs, with monthly storage and capital costs amounting to at least 5,000, leading to a potential loss of 30,000 after six months of holding excess inventory [1] - The article lists various semiconductor components available for sale, including TE, TI, and NXP products, with quantities ranging from 10,000 to 487,500 units [4][5] Sales and Services - "Chip Superman" claims to facilitate quick transactions, with the ability to complete sales in as little as half a day [9] - The company operates a smart warehouse with 1,600 square meters of space, housing over 5,000,000 semiconductor components valued at over 100 million [7] Market Demand - The article also includes a section for purchasing specific semiconductor components, indicating ongoing demand for various models from brands like TI and ST [6]