如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体行业观察综合 ，谢谢。 苹果自推动Apple silicon长期计画以来持续扩张自行研发芯片的路线，其中备受外界讨论多时耕 耘多年5G Modem芯片C1先前已正式浮上台面，一般预料持续由伙伴台积电（2330）操刀，究竟 苹果自研芯片效益如何，研究机构最新分析也解密。 iPhone 调制解调器的演变 法人则分析，若按照苹果iPhone 16e 出货规模今年可达到2200万支来看，至少可省下2.2亿美元。 若后续更多iPhone导入，按照一年2亿支规模来看，基带芯片初估就可省下成本达20亿美元（相当 于新台币650亿元），相当可观。但苹果和高通还有合约限制，业界预期苹果自研新款芯片将采逐 步推进导入手机。 苹果是台积电大客户，也是台积电先进制程最大出海口。台积电7纳米以下先进制程营收占比已突 破七成，达到73%，今年首季7纳米出货占15%，5纳米36%，3纳米为22%，先进制程持续扮演获 利的引擎。台积电加码美国千亿美元投资，预估专案投资到位后，估三成2纳米以下先进制程产能 将在亚利桑那厂生产，支援客户包含苹果、英伟达、超微、高通与博通等需求。 深挖 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体行业观察综合 ，谢谢。 苹果自推动Apple silicon长期计画以来持续扩张自行研发芯片的路线，其中备受外界讨论多时耕 耘多年5G Modem芯片C1先前已正式浮上台面，一般预料持续由伙伴台积电（2330）操刀，究竟 苹果自研芯片效益如何，研究机构最新分析也解密。 counterpoint Research 最新拆解分析，Apple iPhone 16e 的BoM成本显示，iPhone内部自行开发 总元件成本以iPhone 16 e最高，为40%。 上述关键驱动因素包含基带芯片、收发器和相关PMIC，至于成本节约：预期由苹果的5G解决方案 驱动，每装置可省下10美元。 iPhone 16e 内部芯片关键在处理器、Cellular network、电源管理，后二者相关芯片「内部价值比 重」：分别上升到63%和50%，并预期iPhone 17：可能会采用相同的Cellular解决方案。 法人则分析，若按照苹果iPhone 16e 出货规模今年可达到2200万支来看，至少可省下2.2亿美元。 若后续更多iPhone导入，按照一年2亿支规模来看，基带芯 ...

钛媒体直击｜2025上海车展 第二十一届上海国际汽车工业展览会将于4月23日至5月2日举行。作为今年首个A级车展，上海车展备 受瞩目，多款重磅新车新技术将在此期间首发亮相。与此同时，中国汽车市场已到了电动化智能化决赛 圈，此次车展各大厂商必将拿出看家本领，全球车企也将在上海决战新能源与智能化技术的制高点。 代表选手：乐道L90 乐道L90将在2025上海车展亮相，新车作为乐道品牌第二款产品，空间上采用大三排布局，是一款面向 大家庭的大型SUV。据悉将基于蔚来的 NT 3.0 平台打造，支持 900 V高压架构，提供单电机和双电机 两种配置。电池则和乐道 L60 相同，有60kWh和 85kWh两种电池可选，并支持换电和 Bass 方案。 900V平台最先应用在蔚来旗舰轿车ET9上，而第二款应用该技术的产品就是乐道L90。900V平台的优势 是提升了充电效率和电驱效率：900V平台使得充电峰值功率达到600kW，这意味着车辆可以在5分钟内 补充255公里的续航，显著提升了充电速度，减少了充电等待时间。基于900V平台，蔚来自主研发的大 圆柱电池方案，单颗电芯能量密度高达每千克292瓦时，使得车辆综合续航有增加。 ...

Core Viewpoint - Chery Automobile is initiating a self-research chip program to develop its own vehicle MCU and intelligent driving SoC, aiming to enhance its competitiveness in the smart vehicle sector [2][4]. Group 1: Self-Research Chip Initiative - Chery's self-research chip plan is in its early stages, with recruitment for NPU design architects and senior chip design engineers underway [3][4]. - The company aims to transition from a traditional automaker to a modern intelligent industry cluster, with a focus on AI and smart technologies as a key growth area for the next 20 years [4][5]. - Chery's goal is to enter the top tier of intelligent driving capabilities by 2025, which necessitates the development of high-level intelligent driving chips [8][9]. Group 2: Cost Reduction Strategy - The shift towards self-research chips is driven by the need to reduce costs associated with purchasing high-end intelligent driving chips from suppliers [11][12]. - For instance, the cost of high-end driving hardware based on a 100 Tops computing platform for BYD is reported to be 4,000 RMB per unit, leading to a total cost of 16 billion RMB for 4 million vehicles [11]. - Chery's projected sales of over 2.6 million vehicles in 2024 indicate that its investment in intelligent driving will also reach a significant scale, potentially exceeding 10 billion RMB [11]. Group 3: Current Market Position and Challenges - Despite the self-research initiative, Chery currently relies heavily on external suppliers for its intelligent driving capabilities, which poses a challenge in achieving its 2025 goals [13][18]. - The company has established partnerships with leading suppliers like Huawei, NVIDIA, and Horizon Robotics to enhance its smart driving solutions [13][18]. - Chery's internal R&D team consists of over 5,500 personnel, indicating a strong foundation for developing autonomous driving technologies [18]. Group 4: Future Outlook - The ideal outcome of Chery's self-research efforts is to achieve technological independence and develop advanced features, while the worst-case scenario could result in merely evaluating supplier capabilities without significant technological advancement [19]. - The company is adjusting its strategy by integrating some self-research teams into its main R&D institute to ensure timely delivery of competitive products [17].

Core Viewpoint - Jiangbolong aims to break the "curse" of storage module operations by achieving over $2 billion in revenue and transitioning towards becoming a semiconductor storage brand [1][2]. Group 1: Self-Developed Chip Strategy - Jiangbolong has increased its investment in technology to support its transition to a semiconductor storage brand, focusing on algorithm and IP design [2]. - The company established a main control chip team in 2020 and launched eMMC and SD controllers last year, marking a significant milestone in its self-developed chip strategy [4][5]. - The self-developed main control chips allow for application innovation in storage technology, enabling high customization based on customer needs [4]. Group 2: New Product Launches - Jiangbolong introduced several self-developed main control chips at the flash memory summit, including WM7400 (UFS 4.1), WM7300 (UFS 3.1), and WM3000 (USB 3.2) [5][6]. - The UFS 4.1 main control chip WM7400 features advanced manufacturing processes and supports both TLC and QLC NAND Flash, achieving sequential read speeds of up to 4350MB/s [7][8]. - The eMMC Ultra product, equipped with the WM6000 main control chip, enhances bandwidth by 50% compared to the eMMC 5.1 standard, providing a theoretical speed of 600MB/s [9][10]. Group 3: Automotive Storage Solutions - Jiangbolong has developed a comprehensive automotive storage product matrix, including AEC-Q100 compliant UFS, eMMC, and LPDDR4x products [11]. - The company has established deep partnerships with over 20 OEMs and 50 Tier 1 automotive clients, with a projected market growth of nearly 100% in the automotive sector [12][18]. Group 4: Business Model Transformation - Jiangbolong is shifting its business model to include Technology Contract Manufacturing (TCM) and Product Technology Manufacturing (PTM) services, aiming to reduce costs and optimize inventory management [15][16]. - The PTM model provides comprehensive storage Foundry services, addressing industry homogenization and innovation bottlenecks [16][18]. - The company has successfully implemented the PTM model across various industries, including automotive, servers, and mobile devices, enhancing its market presence [18][19]. Group 5: Global Market Expansion - Jiangbolong is accelerating its global market strategy, particularly in the Americas and Europe, to deepen the implementation of TCM and PTM models [20][21]. - The company aims to leverage its self-developed chips and proprietary packaging to enhance its service capabilities and meet diverse customer needs [23][24].

Core Viewpoint - Apple is transitioning from Qualcomm to its own modem technology, starting with the C1 modem in the iPhone 16e, aiming for complete internal processing of network functions in the future [1][3]. Modem Development - The C1 modem debuted in the iPhone 16e, focusing on efficiency but lacking support for 5G mmWave and all wavelengths of existing Qualcomm modems. It is described as the "most energy-efficient modem on iPhone" [3]. - The C2 modem, codenamed Ganymede, is expected to launch in the iPhone 18 series in 2026, featuring mmWave support and download speeds of 6 Gigabits per second [3]. - The C3 modem, codenamed Prometheus, is planned for release alongside the iPhone 19 series in 2027, aiming to surpass Qualcomm's performance and support next-generation satellite networks [4]. Networking Chips - Apple is also working on replacing Broadcom's networking chips, with a new chip codenamed Proxima expected to debut in updated versions of HomePod mini and Apple TV later this year, supporting Wi-Fi 6E [6]. - This new networking chip is anticipated to enhance connectivity between Apple devices and reduce costs [7]. Integration Plans - After the modem transition, Apple is considering integrating its cellular modem into the main Apple Silicon chip, which could provide cost and efficiency benefits, although this is projected to be realized by 2028 [9].