MEMS技术

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安徽芯动联科微系统股份有限公司2025年半年度报告摘要
Shang Hai Zheng Quan Bao· 2025-08-18 19:57
Core Viewpoint - The company plans to distribute a cash dividend of RMB 1.56 per 10 shares, amounting to a total of RMB 62,511,642.96, which represents 40.51% of the net profit attributable to shareholders for the first half of 2025 [20][44][47]. Group 1: Profit Distribution Plan - The company intends to distribute a cash dividend of RMB 1.56 per 10 shares (including tax) based on a total share capital of 400,715,660 shares as of June 30, 2025 [20][44]. - The total cash dividend amount is RMB 62,511,642.96, which is 40.51% of the net profit attributable to shareholders [20][47]. - The profit distribution plan requires approval at the upcoming second extraordinary general meeting of shareholders [46][48]. Group 2: Fundraising Project Adjustments - The company plans to extend the implementation deadlines for four fundraising projects due to current market conditions and project execution status [52][61]. - Adjustments will be made to the investment methods, total investment amounts, and internal investment structures of these projects, with a total of RMB 16,823.81 million allocated to a new project focused on inertial measurement units (IMU) [53][61]. - The new IMU project aims to develop high-precision products for applications in autonomous driving, commercial aerospace, and robotics [62]. Group 3: Corporate Governance and Meeting Details - The second extraordinary general meeting of shareholders is scheduled for September 5, 2025, and will utilize both on-site and online voting methods [4][5]. - The meeting will address several key resolutions, including the profit distribution plan and adjustments to fundraising projects [7][8]. - The company ensures that all meeting procedures comply with relevant laws and regulations, and all board members will be present [1][18].
9.5亿美元!ST收购恩智浦MEMS传感器业务
芯世相· 2025-07-25 02:30
Group 1 - The core viewpoint of the article is the acquisition of NXP's MEMS sensor business by STMicroelectronics for up to $950 million, which is expected to enhance ST's capabilities in automotive safety applications and contribute significantly to its gross and operating margins [1][2][3]. Group 2 - The acquisition targets NXP's MEMS sensor business, which focuses on passive (airbag) and active (vehicle dynamics) safety sensors, as well as monitoring sensors like TPMS and engine management, generating approximately $300 million in sales in 2024 [2]. - STMicroelectronics aims to strengthen its intellectual property, technology, product offerings, and R&D team through this acquisition, enhancing its position in the automotive, industrial, and consumer applications sectors [2][3]. - NXP's decision to sell the MEMS sensor business aligns with its long-term strategic direction, as stated by its VP, indicating that the product line fits better within STMicroelectronics' portfolio and strategic roadmap [3]. Group 3 - The article also highlights an upcoming business exploration event in Germany from September 4 to September 14, focusing on two major global exhibitions: IFA and IAA, aimed at understanding the latest trends and demands in the European electronics industry [1][4][11]. - The event will include deep discussions and networking opportunities with industry professionals, enhancing participants' international perspectives and investment insights [8][13].
ST十多年来首次亏损,创下单日最大跌幅,收购恩智浦MEMS业务
半导体行业观察· 2025-07-25 01:44
Core Viewpoint - STMicroelectronics reported a loss in Q2 for the first time in over a decade, primarily due to restructuring and impairment costs amounting to $190 million, leading to a significant stock price drop of 16.6% [2][3] Financial Performance - The company experienced an operating loss of $133 million in Q2, which was below analyst expectations of a profit of $56.2 million [2] - Revenue for Q2 increased to $2.76 billion from $2.52 billion in the previous quarter, surpassing expectations [3] - The company anticipates Q3 revenue to reach $3.17 billion, exceeding analyst forecasts of $3 billion [3] Market Position and Strategy - STMicroelectronics heavily relies on in-house manufacturing, accounting for approximately 80% of sales, which poses challenges during market slowdowns [2] - The company has initiated a cost-cutting plan aimed at saving hundreds of millions by restructuring its manufacturing facilities, including a workforce reduction of 5,000 employees by 2027 [4] Acquisition Plans - STMicroelectronics plans to acquire NXP's MEMS sensor business for up to $950 million, enhancing its position in the sensor market [6][7] - The acquisition is expected to generate approximately $300 million in revenue in 2024 and improve profit margins significantly [7] - The deal will be financed through existing cash and is expected to close in the first half of 2026, pending regulatory approvals [7]
芯动联科:芯动联科首次公开发行股票并在科创板上市招股说明书
2023-06-26 11:12
解科创板的投资风险及本公司所披露的风险因素,审慎作出投资决定。 安徽芯动联科微系统股份有限公司 Anhui XDLK Microsystem Corporation Limited (安徽省蚌埠市财院路 10 号) 首次公开发行股票并在科创板上市 招股说明书 本次发行股票拟在科创板上市,科创板公司具有研发投入大、经营风险高、 业绩不稳定、退市风险高等特点,投资者面临较大的市场风险。投资者应充分了 保荐人(主承销商) 安徽芯动联科微系统股份有限公司 招股说明书 声明 中国证监会、交易所对本次发行所作的任何决定或意见,均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证,也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或者保证。任何与 之相反的声明均属虚假不实陈述。 根据《证券法》的规定,股票依法发行后,发行人经营与收益的变化,由发 行人自行负责;投资者自主判断发行人的投资价值,自主作出投资决策,自行承 担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的投资风险。 (北京市朝阳区安立路 66 号 4 号楼) 目 录 | 声明 | | --- | | 本次发行概况 ...
芯动联科:芯动联科首次公开发行股票并在科创板上市招股意向书
2023-06-08 11:22
本次股票发行后拟在科创板市场上市,该市场具有较高的投资风险。科 创板公司具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点,投资 者面临较大的市场风险。投资者应充分了解科创板市场的投资风险及本公司所披 露的风险因素,审慎作出投资决定。 安徽芯动联科微系统股份有限公司 Anhui XDLK Microsystem Corporation Limited (安徽省蚌埠市财院路 10 号) 首次公开发行股票并在科创板上市 招股意向书 保荐人(主承销商) (北京市朝阳区安立路 66 号 4 号楼) 安徽芯动联科微系统股份有限公司 招股意向书 声明 中国证监会、交易所对本次发行所作的任何决定或意见,均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证,也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或者保证。任何与 之相反的声明均属虚假不实陈述。 根据《证券法》的规定,股票依法发行后,发行人经营与收益的变化,由发 行人自行负责;投资者自主判断发行人的投资价值,自主作出投资决策,自行承 担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的投资风险。 1-1-1 安徽 ...
安徽芯动联科微系统股份有限公司_招股说明书(注册稿)
2023-04-24 23:20
本次股票发行后拟在科创板市场上市,该市场具有较高的投资风险。科创板 公司具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点,投资者面 临较大的市场风险。投资者应充分了解科创板市场的投资风险及本公司所披露的 风险因素,审慎作出投资决定。 安徽芯动联科微系统股份有限公司 Anhui XDLK Microsystem Corporation Limited (安徽省蚌埠市财院路 10 号) 首次公开发行股票并在科创板上市 招股说明书 保荐人(主承销商) 安徽芯动联科微系统股份有限公司 招股说明书(注册稿) 声明 中国证监会、交易所对本次发行所作的任何决定或意见,均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证,也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或者保证。任何与 之相反的声明均属虚假不实陈述。 (注册稿) 本公司的发行上市申请尚需经上海证券交易所和中国证监会履行相应程序。 本招股说明书不具有据以发行股票的法律效力,仅供预先披露之用。投资者应当 以正式公告的招股说明书全文作为作出投资决定的依据。 (北京市朝阳区安立路 66 号 4 号楼) 根据《证券法》 ...
安徽芯动联科微系统股份有限公司_招股说明书(上会稿)
2023-02-02 10:20
险。科创板公司具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点, 投资者面临较大的市场风险。投资者应充分了解科创板市场的投资风险及本公司 所披露的风险因素,审慎作出投资决定。 安徽芯动联科微系统股份有限公司 Anhui XDLK Microsystem Corporation Limited (安徽省蚌埠市财院路 10 号) 招股说明书 (上会稿) 本公司的发行上市申请尚需经上海证券交易所和中国证监会履行相应程序。 本招股说明书不具有据以发行股票的法律效力,仅供预先披露之用。投资者应当 以正式公告的招股说明书全文作为作出投资决定的依据。 保荐人(主承销商) (北京市朝阳区安立路 66 号 4 号楼) 北方本次股票发行后拟在科创板市场上市,该市场具有较高的投资风 首次公开发行股票并在科创板上市 安徽芯动联科微系统股份有限公司 招股说明书(上会稿) 声明 中国证监会、交易所对本次发行所作的任何决定或意见,均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证,也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或者保证。任何与 之相反的声明均属虚假不实陈述。 根据《证券 ...