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三星美国厂,即将量产
半导体芯闻· 2025-06-23 10:23
Core Viewpoint - Samsung Electronics is accelerating the preparation for mass production at its advanced wafer foundry in the U.S., with plans to introduce 2nm process production facilities as early as January or February next year [1][2]. Group 1: Production Plans - Samsung is discussing the introduction of 2nm process production facilities at the Taylor Foundry Fab, which was initially aimed at 4nm production but has shifted focus due to market conditions [1]. - The cleanroom construction at the Taylor factory has resumed, with completion expected by the end of this year, which is essential for introducing various auxiliary facilities and manufacturing equipment [1][2]. Group 2: Investment and Partnerships - The company is finalizing equipment selection for the Taylor foundry and will soon confirm detailed investment and procurement plans with partners [2]. - Some partners have already begun preparations to bring equipment to the U.S. early next year, although the initial investment scale is expected to be small [2]. Group 3: Competitive Landscape - Samsung's 2nm process (SF2) is projected to improve performance by 12%, power efficiency by 25%, and reduce area by 5% compared to the advanced 3nm process (SF3) [2]. - While Samsung has secured AI semiconductor customers from domestic and Japanese firms, it has yet to attract major global tech companies, unlike its main competitor TSMC [2]. Group 4: Market Sentiment - The Taylor foundry is seen as an attractive option for clients looking to produce advanced semiconductors in the U.S., with discussions about the production line becoming more concrete [2].
日本半导体为何难以超越台湾?
半导体行业观察· 2025-06-22 03:23
Core Viewpoint - The article discusses the evolving semiconductor landscape in Japan and Taiwan, highlighting the distinct paths taken by both countries in the semiconductor industry and the implications for future collaboration and competition [5][6]. Group 1: Japan's Semiconductor Strategy - Japan has been actively enhancing its semiconductor capabilities, with initiatives like the JASM wafer fab in Kumamoto and advanced process development by Rapidus in Hokkaido [2]. - The Japanese semiconductor industry has historically prioritized technology, achieving global leadership in semiconductor materials and equipment [6]. - The decline of Japan's semiconductor sector is attributed to its focus on serving internal products rather than developing independent, profit-driven semiconductor businesses [9]. Group 2: Taiwan's Semiconductor Model - Taiwan, led by TSMC, has successfully transformed technology into economic value, establishing a robust foundry model that has become a cornerstone of the global semiconductor supply chain [6]. - The collaboration between Taiwan and Japan in the semiconductor sector is seen as a potential avenue for revitalizing Japan's manufacturing capabilities, with TSMC's involvement in JASM being a key factor [6][8]. Group 3: Comparative Analysis - The article emphasizes the contrasting approaches of Japan and Taiwan, with Japan's semiconductor sector being integrated into larger corporations, limiting innovation and external customer engagement [7][9]. - Taiwan's independent foundry model has allowed for greater innovation and responsiveness to market demands, positioning it favorably against Japan's traditional model [6][8].
利润暴涨仍被砸盘,市场对中芯国际担忧什么?
Core Viewpoint - The decline in stock price of SMIC is primarily attributed to the less-than-ideal guidance for Q2 performance, with expected revenue decrease of 4%-6% and gross margin dropping to 18%-20% [1][2][14]. Group 1: Q1 Performance - In Q1 2025, SMIC's total shipment volume reached 2.292 million pieces, equivalent to 8-inch standard logic wafers, reflecting a quarter-on-quarter increase of 15.08% [3]. - Revenue for Q1 was $2.247 billion, showing a modest quarter-on-quarter growth of 1.81%, indicating a significant decline in average selling price (ASP) [5]. - The capacity utilization rate for Q1 was 89.6%, up by 4.1 percentage points from the previous quarter, with 12-inch utilization remaining stable and 8-inch utilization rising [6]. Group 2: Revenue Breakdown - The quarterly EBITDA increased slightly by 0.93% to $1.292 billion, while net profit attributable to shareholders surged by 74.77% to $188 million [8]. - Revenue by region showed that China accounted for 84.3%, the Americas for 12.6%, and Eurasia for 3.1%, with stable income from China and growth in overseas customer revenue [8]. Group 3: Product Segmentation - Revenue from various applications remained stable, with smartphones, computers and tablets, consumer electronics, and wearables contributing 24.2%, 17.3%, 40.6%, and 8.3% respectively [10]. - Revenue from industrial and automotive sectors grew over 20% quarter-on-quarter, increasing its share from 8.2% to 9.6%, attributed to advancements with major automotive clients [10]. Group 4: Q2 Guidance and Challenges - For Q2, SMIC projects a revenue decline of 4%-6%, with ASP expected to decrease and gross margin guidance lowered to 18%-20% [14]. - The decline in guidance is influenced by unexpected maintenance issues and equipment validation processes affecting product yield and ASP [14][15]. - Despite challenges, management noted that the fundamentals remain stable compared to Q1, with continued strong capacity utilization [15]. Group 5: Shareholder Activity - The National Integrated Circuit Fund (commonly known as the "Big Fund") reduced its holdings in SMIC, decreasing from 617 million shares at the end of 2024 to 551 million shares in Q1 2025, lowering its stake from 7.74% to 6.91% [16].
英特尔或代工英伟达!
国芯网· 2025-05-09 14:06
Core Insights - Intel is negotiating collaboration on wafer foundry services with major tech companies Nvidia and Google, indicating a strategic shift towards partnerships in the semiconductor industry [2] - Microsoft CEO Satya Nadella mentioned plans for chip designs to be produced on Intel's 18A process, which has led to significant formal orders between the companies [2] - Intel has confirmed a collaboration with Amazon AWS to produce AI Fabric chips using the Intel 18A process, aimed at enhancing computational node interconnectivity [2] - The Intel 18A process is currently in risk production phase and is expected to achieve formal mass production within the year, with an evolved version, Intel 18A-P, already in early trial wafer production [2] - Intel's upcoming Intel 14A process will utilize PowerDirect direct contact power technology, with early versions of the process design kit (PDK) already sent to major clients [2]
绩后大跌,中芯国际发生了什么?
Jin Rong Jie· 2025-05-09 07:11
在公布了2025年第1季业绩后,中芯国际(00981.HK)的股价大跌,H股低开5.87%后走低,曾低见 40.40港元,跌10.52%,截至发稿前跌幅有所收窄,为5.20%;中芯国际(688981.SH)A股也低开 3.31%,并震荡向下,午后曾低见85.85元人民币,跌幅达4.59%。 其股价下挫的主要原因或是第2季业绩指引不太理想。 价格下降 2025年第1季,中芯国际的整体出货量达到229.2万片折合8英寸标准逻辑晶圆,环比增长15.08%,其中8 英寸、12英寸收入环比增长了18%和2%,主要受益于国际形势变化引起的客户提拉出货,国内以旧换 新、消费补贴等政策推动的大宗类产品需求上升,以及工业与汽车产业的触底补货。 但是,尽管出货量很高,中芯国际的第1季销售额仅按季增长1.81%,至22.47亿美元,反映出ASP(产 品平均售价)出现显著下降。 中芯国际表示,由于工厂生产性波动,第1季后半部平均单价下降,导致收入未能达到指引预期,影响 了收入表现。 2025年第1季,中芯国际的产能利用率为89.6%,环比增长了4.1个百分点,管理层透露, 12英寸利用率 保持稳健,8英寸利用率也上升至12英寸产能的 ...
中芯国际股价走弱,一季度受突发事件影响收入未达预期
Di Yi Cai Jing· 2025-05-09 02:45
Core Viewpoint - Company faces challenges in visibility for the second half of the year, particularly in the latter half of Q3 and towards year-end due to production fluctuations and unexpected events impacting revenue guidance [1][5] Financial Performance - In Q1 2025, the company reported revenue of 16.301 billion yuan, a year-on-year increase of 29.4% [2] - Net profit attributable to shareholders was 1.356 billion yuan, up 166.5% year-on-year, with a non-GAAP net profit of 1.17 billion yuan, an 88% increase [2] - Basic earnings per share were 0.17 yuan, compared to 0.06 yuan in the same period last year [2] Revenue Composition - Wafer business accounted for 95.2% of total revenue, an increase of 2.2 percentage points year-on-year [2] - Revenue from consumer electronics made up 40.6% of wafer income, followed by smartphones at 24.2% and computers/tablets at 17.3% [2][3] Production and Capacity - In Q1, the company sold 2.2922 million wafers, up from 1.7949 million in the same period last year [3] - Monthly capacity at the end of Q1 was equivalent to 973,300 8-inch wafers, with a utilization rate of 89.6%, an increase of 8.8 percentage points year-on-year [3] Regional Revenue Distribution - Revenue from China accounted for 84.3% of total revenue, a year-on-year increase of 2.7 percentage points [4] - Revenue from the U.S. decreased to 12.6%, down 2.3 percentage points year-on-year, while revenue from the Eurasian region fell to 3.1%, down 0.4 percentage points [4] Future Guidance - The company provided guidance for Q2, expecting a revenue decline of 4% to 6% quarter-on-quarter, with gross margin projected between 18% and 20% [4] - Management noted positive signals of recovery in industrial and automotive sectors, with a focus on localizing supply chains and increasing domestic wafer demand [4]
英特尔:左手卖资产、右手裁员,换帅自救能成吗?
海豚投研· 2025-04-27 10:53
英特尔于北京时间 2025 年 4 月 25 日上午的美股盘后发布了 2025 年第一季度财报(截止 2025 年 3 月),要点如下: 1、核心数据:收入持平,毛利率再次下滑。英特尔在 2025 年第一季度实现营收 126.7 亿美元,同比基本持平, 接近指引上限(117-127 亿美元)。本季度客户端 业务有所下滑,但数据中心及 AI 业务和其他业务的增长与其基本抵消。$英特尔.US 在 2025 年第一季度净利润为-8.2 亿美元,亏损扩大, 主要是受毛利率下滑和 非经常性损失增加的影响。 2、各项业务情况:客户端再丢份额,AI 和代工才是潜力。 公司本季度再次进行业务口径调整, 将英特尔自有产品业务重新分为客户端业务和数据中心及 AI 业 务两项 。 1)客户端业务 :本季度客户端营收 76.3 亿美元,同比下滑 7.8%。而 同期 PC 行业出货量同比 +5.9%,英特尔的相关业务同比-7.8% ,表明英特尔的份额继续在 丢失; 2)数据中心及 AI 业务 :本季度数据中心及 AI 业务的营收 41.3 亿元,同比增长 7.8%,这主要是受 Xeon 服务器的销售表现和部分客户为潜在关税的提前备货; ...
英特尔晶圆代工,重要进展
半导体行业观察· 2025-03-04 00:53
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容 编译自calcalistech ,谢谢。 据路透社报道,芯片设计公司 Nvidia 和 Broadcom 正在与英特尔进行制造测试,这表明它们对这家 陷入困境的公司先进的生产技术充满信心。 这些测试此前从未被报道过,表明 Nvidia 和 Broadcom 正在评估是否要向英特尔承诺数亿美元的制 造合同。这一决定可能会大幅增加收入,并为英特尔的合同制造业务提供重要支持。英特尔的合同 制造业务一直面临延误,而且尚未宣布哪家大型芯片设计公司是客户。 AMD 也在评估英特尔的 18A 制造工艺是否符合其需求,但目前尚不清楚 AMD 是否已提交测试芯 片进行评估。AMD 拒绝置评。 英特尔发言人表示:"我们不对具体客户发表评论,但看到整个生态系统对英特尔 18A 表现出浓厚 的兴趣和参与度。" Nvidia 和 Broadcom 正在测试英特尔的 18A 工艺,这是一项经过数年开发的尖端制造技术,专为 先进的 AI 处理器和其他复杂芯片而设计。18A 工艺与主导全球半导体市场的台湾台积电展开竞 争。 Nvidia 拒绝发表评论,而 Broadcom 也没有回应置评 ...
中芯集成:中芯集成首次公开发行股票科创板上市公告书
2023-05-08 11:40
股票简称:中芯集成 股票代码:688469 绍兴中芯集成电路制造股份有限公司 二〇二三年五月九日 Semiconductor Manufacturing Electronics(Shaoxing)Corporation (浙江省绍兴市越城区皋埠街道临江路 518 号) 首次公开发行股票 科创板上市公告书 保荐人(主承销商) 上海市黄浦区广东路 689 号 联席主承销商 深圳市前海深港合作区南山街道桂湾五 路 128 号前海深港基金小镇 B7 栋 401 福州市湖东路 268 号 特别提示 绍兴中芯集成电路制造股份有限公司(以下简称"中芯集成"、"发行人"、 "公司"、"本公司")股票将于 2023 年 5 月 10 日在上海证券交易所科创板上市。 本公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素,在新 股上市初期切忌盲目跟风"炒新",应当审慎决策、理性投资。 1 第一节 重要声明与提示 一、重要声明 本公司及全体董事、监事、高级管理人员保证上市公告书所披露信息的真实、 准确、完整,承诺上市公告书不存在虚假记载、误导性陈述或重大遗漏,并依法 承担法律责任。 上海证券交易所、有关政府机关对本公司股票上 ...
中芯集成:中芯集成首次公开发行股票并在科创板上市招股说明书
2023-05-04 11:38
特别提示:本次股票发行拟在科创板市场上市,科创板公司具有研发投入大、经营风险高、业绩 不稳定、退市风险高等特点,投资者面临较大的市场风险。投资者应充分了解科创板市场的投资 风险及本公司所披露的风险因素,审慎作出投资决定。 绍兴中芯集成电路制造股份有限公司 Semiconductor Manufacturing Electronics(Shaoxing)Corporation (浙江省绍兴市越城区皋埠街道临江路 518 号) 首次公开发行股票并在科创板上市 招股说明书 保荐人(主承销商) 上海市黄浦区广东路 689 号 联席主承销商 深圳市前海深港合作区南山街道桂湾五 路 128 号前海深港基金小镇 B7 栋 401 福州市湖东路 268 号 绍兴中芯集成电路制造股份有限公司 招股说明书 声明 中国证监会、交易所对本次发行所作的任何决定或意见,均不表明其对发 行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证,也不表 明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保 证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》的规定,股票依法发行后,发行人经营与收益的变化,由 发行人自 ...