1999年，王照云初次接触会展业。2019年，他所创办的广东鸿威国际会展集团有限公司（下称"鸿威会 展"）已经成为全国展览举办数量排名第一、年度展览面积全国第三的会展业龙头企业。 20年时间里，王照云的会展事业与广交会的发展同频，从广州越秀转移至海珠。海珠琶洲成就了他的会 展事业，他也为琶洲的会展业作出了突出贡献。会展是琶洲的核心产业、突出标志，王照云的身上有一 份琶洲会展业的发展故事。 王照云，广东鸿威国际会展集团有限公司董事长，兼任中国国际投资促进会常务理事、广东省游艇行业 协会会长。 广州琶洲，一个新的产业高地崛起于珠江南岸。不同领域的人在此倾注精力，历时数十年共同打造了一 座融合会展、电商和数字经济的新功能区。南都·琶洲π特别策划"琶洲之星"系列人物专访，聚焦琶洲典 型领域的典型人物，与你一同看见"人才的力量"。 加入世贸促跨越式发展 广交会进入"琶洲时代" 王照云第一次接触会展是在1999年3月。当时，他参与了广州国际计算机展览会的举办。"那时，我国的 会展业刚起步，民营会展企业少，展览面积小。"王照云回忆道，当时200个展位的展览已算大型了，不 像现在一个大型展览拥有2万个展位。 王照云在会展企业 ...

新华财经北京8月6日电墨西哥总统克劳迪娅·辛鲍姆5日与到访的加拿大高级官员会面，讨论如何共同应 对美国关税政策，以及在多个领域深化双边合作。这两国是美国一南一北的邻居，都是美国主要贸易伙 伴，也是特朗普政府关税大棒首当其冲的目标。 据路透社报道，加拿大外交部长阿妮塔·阿南德和财政部长商鹏飞当天与辛鲍姆及多位墨西哥部长会 谈。墨经济部长马塞洛·埃布拉德在会晤前向媒体记者透露，他将与商鹏飞讨论应对美国关税政策方面 的经验。 阿南德在社交媒体X平台上说，她与商鹏飞同辛鲍姆、墨西哥外长胡安·拉蒙·德拉富恩特等墨方官员进 行了会谈，"这些讨论推进了两国在经济增长、安全和贸易多元化等共同优先事项上的合作"。 按法新社说法，此次会谈同时旨在为加拿大总理马克·卡尼访墨做准备，虽然具体访问日期尚未公布。 美国白宫7月31日晚发布公告说，总统特朗普当天签署行政令，调整对多个贸易伙伴征收的所谓"对等关 税"税率。根据该行政令，美方从8月1日起将加拿大输美商品关税税率从25%上调至35%；符合"美国－ 墨西哥－加拿大协定"（美墨加协定）优惠关税待遇条件的商品将不受最新关税措施影响。 白宫公告称，由于加拿大未能就控制芬太尼及其他违禁药 ...

Core Viewpoint - The issuance of technology innovation bonds (科创债) has seen explosive growth since the launch of the "Technology Board" in the bond market, with a total issuance exceeding 530 billion yuan, indicating strong support from the capital market for technological innovation [1][2]. Issuance Scale - From May 7 to June 19, a total of 334 technology innovation bonds were issued, amounting to 534.89 billion yuan, with nearly 5 billion yuan more expected to be issued soon [2][4]. - Financial institutions are the main contributors, having issued approximately 218 billion yuan, accounting for 40.76% of the total [4]. Industry Distribution - The banking sector leads in bond issuance, followed by construction, non-bank financial services, public utilities, and the oil and petrochemical industries, with respective issuance amounts of 60.87 billion yuan, 45.74 billion yuan, 38.39 billion yuan, and 20 billion yuan [4]. - Other industries such as non-ferrous metals, automotive parts, transportation, machinery, and chemicals have also issued over 10 billion yuan each [4]. Issuance Terms and Rates - The majority of issued bonds are medium to long-term, with 52.10% having a term of 1 to 5 years, while 6.9% are in the 10 to 20-year range [4]. - The issuance rates for 10-year bonds range from 1.85% to 2.69%, reflecting the overall low market interest rates [4]. Participation of Private Enterprises - While state-owned enterprises dominate the market, private enterprises are increasingly participating, with their issuance totaling 37.85 billion yuan, representing 7.08% of the total [6][7]. - Recent successful issuances by private venture capital institutions indicate a growing trend in private sector involvement [7]. Risk Mitigation Tools - New risk-sharing tools for technology innovation bonds are being developed to support private technology enterprises, enhancing financing accessibility for companies with weaker credit profiles [8]. - The introduction of these tools aims to expand the issuance base and improve the overall quality of the bond market [8]. Future Outlook - The policies introduced by the People's Bank of China and the China Securities Regulatory Commission are expected to further enhance the scale and structure of the technology innovation bond market, aligning it more closely with mature overseas markets [9][10]. - The development of the technology innovation bond market is anticipated to attract more investors and improve the bond market's overall quality and stability, thereby better serving the real economy [10].

Core Viewpoint - The issuance of technology innovation bonds (科创债) has seen explosive growth since the launch of the "Technology Board" in the bond market, indicating strong support from the capital market for technological innovation and providing robust momentum for the transformation and upgrading of the real economy [1][3]. Summary by Sections Issuance Scale - From May 7 to June 19, a total of 334 technology innovation bonds were issued, with a total issuance scale exceeding 530 billion yuan [2][6]. - Financial institutions are the main force in the issuance of technology innovation bonds, with 20 banks issuing bonds totaling nearly 220 billion yuan, accounting for 40.76% of the total [2][8]. Industry Distribution - The issuance scale distribution among various industries includes: banking (608.68 billion yuan, 11.38%), non-bank financial (457.43 billion yuan, 8.55%), public utilities (383.9 billion yuan, 7.18%), and oil and petrochemicals (200 billion yuan, 3.74%) [8]. - Other industries such as non-ferrous metals, automotive and parts, transportation, machinery, and chemicals have also issued over 10 billion yuan each [8]. Issuance Terms and Rates - The majority of the issued technology innovation bonds are medium to long-term, with 52.10% having a term of 1 to 5 years, 21.26% from 5 to 10 years, and 6.9% from 10 to 20 years [8]. - The issuance rates for 10-year technology innovation bonds range from 1.85% to 2.69%, reflecting the overall low market interest rates [9]. Participation of Private Enterprises - Central and local state-owned enterprises have issued a total of 469.47 billion yuan in technology innovation bonds, accounting for 87.77% of the total issuance [11]. - The participation of private enterprises has increased, with a total issuance of 37.85 billion yuan, representing 7.08% of the total [13]. New Support Mechanisms - New risk-sharing tools for technology innovation bonds are aimed at equity investment institutions, enhancing the financing accessibility for private technology enterprises and institutions with weaker credit ratings [17][19]. - The introduction of these tools is expected to improve the overall quality and stability of the bond market, better serving the broader economy [22][23]. Future Outlook - The policies introduced by the People's Bank of China and the China Securities Regulatory Commission aim to enrich the bond product system and broaden fundraising uses, which may lead to further growth in the technology innovation bond market [21]. - The market structure is expected to evolve towards that of mature overseas markets, with longer issuance periods and a more diverse range of issuers, particularly in high-tech industries [21].

Core Insights - The Guangzhou International Financial City has transitioned from the construction phase to the operational phase, with the launch of collective leasing for 15 high-quality buildings in the Financial City Fangcheng area [2][3] - The Financial City Fangcheng is positioned as a key area for financial enterprises, with over 5,000 companies already established in the initial phase [3][6] - The development strategy focuses on integrating finance with digital economy, attracting numerous corporate headquarters to settle in the area [4][6] Group 1: Development and Infrastructure - The Financial City Fangcheng covers an area of 0.2 square kilometers and features a design that reflects Lingnan architectural style, with 15 buildings arranged in a "four horizontal and four vertical" layout [3] - The area has seen significant infrastructure improvements, including the completion of essential utilities and transportation links, facilitating business operations [7] - The Financial City Plaza is expected to open in the second half of this year, adding over 80,000 square meters of commercial space [7] Group 2: Economic Impact and Business Attraction - The Financial City aims to create a "one core, one chip, three wings" industrial system, focusing on finance, digital economy, and high-end services [5][6] - The area has attracted 16 financial institutions' headquarters and various tech companies, contributing to a robust economic environment [6] - In the first five months of this year, Tianhe District introduced 126 new high-quality industrial projects, showcasing the area's commitment to economic growth [9][10] Group 3: Future Prospects - Future developments in the Financial City will include a large underground commercial space and various lifestyle amenities, aiming to create a vibrant 24-hour business district [8] - The Tianhe District plans to construct or upgrade over 800,000 square meters of innovation and technology facilities in the next three years, further enhancing the investment landscape [10]

Core Viewpoint - The launch of the "Technology Board" in the bond market has facilitated the issuance of the first private venture capital "Technology Innovation Bond" by Shenzhen Oriental Fortune Capital, marking a significant step in supporting technology innovation financing [1][2]. Group 1: Bond Issuance Details - Shenzhen Oriental Fortune plans to issue a total of 1.5 billion yuan (approximately 0.21 billion USD) in technology innovation bonds with a maturity of 15 years [1]. - The funds raised will be specifically allocated to venture capital investments and replacements in technology innovation sectors, focusing on strategic emerging industries such as artificial intelligence, digital economy, new energy, new materials, semiconductors, and biomedicine [1]. Group 2: Market Context and Challenges - The venture capital industry faces a common challenge of "difficulty in fundraising," particularly for private venture capital institutions due to their smaller scale, weaker risk resistance, and limited brand influence [1]. - Historically, private venture capital institutions have shown limited enthusiasm for issuing bonds to supplement capital due to high issuance rates stemming from low ratings, mismatched bond and fund durations, and low guarantee limits with high costs [1]. Group 3: Supportive Measures and Collaboration - The successful launch of the project involved collaboration among various stakeholders, including the Shenzhen Municipal Financial Office, the People's Bank of China Shenzhen Branch, and other market participants [2]. - The introduction of risk-sharing tools for technology innovation bonds aims to provide low-cost, long-term financing support for technology innovation enterprises and equity investment institutions [2]. - The Central Bank's policy to provide low-cost re-lending funds for purchasing technology innovation bonds is expected to channel more long-term, efficient, and low-cost bond funds into the technology innovation sector [2].