点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 7 东吴证券 ■ 半导体封装概览：后摩尔时代渐进，先进封 发快速发展 传统 统 先 进 封 装 设 备 有 一 定 重 合 （ 减 薄 / 测 片 / 固 晶 / 健 合 ） ， 增 量 主 要 在 于 前 道 图 形 化 设 备 2 3 他山之石可以攻玉，海外龙头经验借鉴 4 本土重点公司 5 | 投资建议 6 风险提示 % 公众号·材料汇 目录 1.1. 半导体封装的关键作用是实现芯片和外部系统的电连接 唱图 -芯片 机械连接 板上芯片(COB) 单芯片封装 多芯片封装(MCP) 1级封装 1级封装 机械保护 散热 模块、电路卡 2级封装 电气连接 主板 3级封装 省公众号·材料汇4 数据来源:半导体行业观察, ◆图: 半导体封装工艺等级 ◆ 图:半导体封装的主要作用 7 乐吴址芬 ● 封装的核心是实现芯片和系统的电连接。芯片封装是指将芯片密封在塑料、金属或陶瓷等材料制成的封装体 内，使芯片与外部环境之间建立一道屏障，保护芯片免受外部环境影响，同时封装还提供了一个接口，使芯 片能够与其他电子元件进行连接， ...

Core Viewpoint - The article provides a detailed overview of the traditional packaging process in semiconductor manufacturing, highlighting the various steps involved and the technologies used in each stage. Group 1: Traditional Packaging Process - The traditional packaging process begins with thinning the wafer, reducing its thickness from 600-800μm to tens to a hundred μm for better heat dissipation and electrical performance [8][9]. - Cutting the wafer involves applying a protective blue film and using advanced techniques like laser cutting, which offers higher precision compared to mechanical cutting [10][11]. - The die attach process connects the die to the substrate using various methods, including adhesive bonding, soldering, and eutectic bonding, with epoxy resin being a common adhesive [13][14][16]. Group 2: Electrical Connection and Testing - Wire bonding is used to establish electrical connections between the die and the substrate, utilizing materials like gold, silver, copper, and aluminum [19][17]. - After bonding, the components undergo cleaning and inspection, often using Automatic Optical Inspection (AOI) for high efficiency and defect detection [21][24][25]. - The final steps include molding, de-flashing, post-mold curing, and final testing to ensure the functionality and quality of the packaged chips before shipping [28][36][37]. Group 3: Packaging Materials and Techniques - Packaging can be categorized into plastic, ceramic, and metal types, with plastic packaging being the most common due to its cost-effectiveness and lightweight properties [28]. - The use of epoxy molding compound (EMC) is prevalent in plastic packaging, providing protection against environmental factors [28]. - The process also includes the application of solder balls for BGA packaging and the use of lead-free plating to meet regulatory standards [33][34].

Investment Rating - The report does not explicitly state an investment rating for the semiconductor advanced packaging industry Core Insights - Advanced packaging technology is a critical link between chip design and application, significantly enhancing chip performance and reducing power consumption while alleviating constraints in high-end chip manufacturing processes [2] - The Chinese government places high importance on the development of the semiconductor industry, implementing various policies to support independent innovation and technological breakthroughs [2] - The advanced packaging market is expected to grow rapidly, with China's packaging market projected to reach 355.19 billion yuan by 2025, with advanced packaging accounting for 32% of the market [45][47] Summary by Sections Overview of the Semiconductor Packaging Industry - Packaging is a core process in semiconductor manufacturing, involving the placement, fixation, sealing of chips, and connecting chip contacts to the package shell [14][18] - The development of semiconductor packaging technology can be divided into four stages, with the current stage being advanced packaging [19][21] Advanced Packaging Technology Types - The global advanced packaging market includes IDM, Foundry, and OSAT manufacturers, with leading companies adopting a "large platform + technology branch" architecture [4][51] - Major OSAT manufacturers in China have formed industrial capabilities through independent research and acquisitions, covering a wide range of applications from consumer electronics to AI chips [7] Market Dynamics - The global packaging testing market is expected to grow from $51 billion in 2016 to $72.27 billion by 2025, with advanced packaging projected to capture half of the market share [47] - China's packaging testing market is growing at a compound annual growth rate (CAGR) of 12.54%, significantly higher than the global market's 3.89% [47] Importance of Advanced Packaging - Advanced packaging is essential for integrating multiple functions within a system, enhancing overall system performance beyond the limitations of Moore's Law [35][38] - The report highlights that advanced packaging can improve chip performance without shrinking process nodes, addressing the rising costs associated with advanced process development [39][44]