点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 7 东吴证券 ■ 半导体封装概览：后摩尔时代渐进，先进封 发快速发展 传统 统 先 进 封 装 设 备 有 一 定 重 合 （ 减 薄 / 测 片 / 固 晶 / 健 合 ） ， 增 量 主 要 在 于 前 道 图 形 化 设 备 2 3 他山之石可以攻玉，海外龙头经验借鉴 4 本土重点公司 5 | 投资建议 6 风险提示 % 公众号·材料汇 目录 1.1. 半导体封装的关键作用是实现芯片和外部系统的电连接 唱图 -芯片 机械连接 板上芯片(COB) 单芯片封装 多芯片封装(MCP) 1级封装 1级封装 机械保护 散热 模块、电路卡 2级封装 电气连接 主板 3级封装 省公众号·材料汇4 数据来源:半导体行业观察, ◆图: 半导体封装工艺等级 ◆ 图:半导体封装的主要作用 7 乐吴址芬 ● 封装的核心是实现芯片和系统的电连接。芯片封装是指将芯片密封在塑料、金属或陶瓷等材料制成的封装体 内，使芯片与外部环境之间建立一道屏障，保护芯片免受外部环境影响，同时封装还提供了一个接口，使芯 片能够与其他电子元件进行连接， ...

Group 1 - The latest stock price of Guangli Technology is 16.36 yuan, an increase of 2.76% compared to the previous trading day, with a peak of 16.41 yuan and a low of 15.83 yuan during the day, and a total transaction volume of 1.80 billion yuan [1] - The company operates in the specialized equipment manufacturing industry, focusing on the research, production, and sales of semiconductor packaging equipment, with over 20 models of cutting equipment developed [1] - Guangli Technology's semiconductor packaging equipment has been recognized by leading domestic customers, providing high-end cutting equipment and consumables [1] Group 2 - The company has mastered the technology and processing techniques for integrated reverse planetary roller screws and linear actuators, actively seeking new application areas [1] - Guangli Technology is scheduled to disclose its 2025 semi-annual report on August 27 [1] - Data shows that the net outflow of main funds on the day was 19.67 million yuan, with a net outflow of 86.41 million yuan over the past five days [1]

Core Viewpoint - The company, Guangli Technology, has confirmed that its semiconductor packaging equipment is widely applicable across various semiconductor products, particularly highlighting its cutting equipment represented by model 8230, which has over 20 different models and has received high recognition from leading domestic clients [1] Group 1 - The company provides high-end cutting equipment and consumables for semiconductor packaging processes [1] - The customer base of the company is extensive, covering a wide range of clients in the semiconductor industry [1]

Core Viewpoint - The article discusses the approval of a significant asset swap and share issuance by Zhizheng Co., which will acquire 87.47% of AAMI, a leading semiconductor lead frame supplier, marking a notable cross-border share swap case under new regulations [2][11]. Group 1: Transaction Structure - The transaction involves a combination of asset swaps, share issuance, and cash payments to acquire AAMI's equity, with the company aiming to hold approximately 99.97% of AAMI post-transaction [5][6]. - The asset swap includes the exchange of Zhizheng's 100% stake in Zhizheng New Materials and cash payments to various stakeholders, including Advanced Semiconductor and others [5][10]. - The total consideration for the transaction is approximately 306,870.99 million yuan, with a significant portion allocated to cash payments and share issuance [12][10]. Group 2: Financial Performance - Zhizheng Co. has been transitioning towards the semiconductor industry, with its semiconductor equipment business expected to account for over 30% of revenue in 2024 [16]. - The company has reported continuous losses over the past three years, with a net loss of 1,785.03 million yuan in 2024, although revenue has increased significantly [17][18]. - Post-transaction, the total assets of Zhizheng Co. are projected to increase by 649.41%, with a substantial rise in equity and a shift from negative to positive net profit [18][19]. Group 3: AAMI Overview - AAMI, previously a division of ASMPT, is among the top five suppliers of lead frames globally, with operations in China and Malaysia [19]. - AAMI's revenue for 2023 and 2024 is reported at 220,530.39 million yuan and 248,621.11 million yuan, respectively, with net profits showing significant growth [19][20]. - The company has experienced a slight decline in gross margin, attributed to various market factors affecting the semiconductor industry [19]. Group 4: Control and Governance - The actual controller of Zhizheng Co. remains Wang Qiang, with his shareholding decreasing to 23.23% post-transaction, while ASMPT Holding becomes a significant shareholder [11][22]. - The transaction does not alter the control of the company, as ASMPT has committed not to seek control over Zhizheng Co. [11][22]. - The governance structure post-transaction will include key personnel from both Zhizheng and AAMI to ensure effective management and integration [25].

Group 1 - The semiconductor packaging equipment industry is experiencing robust growth in China, driven by strong demand in emerging applications such as smartphones, AI, IoT, and automotive electronics. The sales revenue for semiconductor packaging equipment in China is projected to reach 28.27 billion yuan in 2024, representing a year-on-year increase of 18.93% [1][18] - The industry is expected to continue evolving towards high-density, high-performance, and high-reliability equipment due to rapid advancements in technologies like 5G, IoT, and AI [1][18] - The global semiconductor equipment market is also witnessing significant growth, with sales expected to reach 117.1 billion USD in 2024, a 10.16% increase from 2023 [15][17] Group 2 - Key players in the semiconductor packaging equipment market include both international leaders such as ASM Pacific Technology, Kulicke & Soffa, and local Chinese companies like North Huachuang, Shengmei Semiconductor, and Xinyi Chang [21][23] - North Huachuang's revenue from electronic process equipment is projected to be 27.707 billion yuan in 2024, marking a 41.28% increase [23] - Shengmei Semiconductor's revenue is expected to reach 5.44 billion yuan in 2024, reflecting a 46.43% growth [25] Group 3 - The semiconductor packaging equipment industry is supported by various policies aimed at promoting domestic production and technological breakthroughs, including the implementation of national standards and talent cultivation initiatives [8][10] - The industry is characterized by a complex supply chain, with upstream components including sensors and subsystems, midstream manufacturing, and downstream applications serving OSATs, IDMs, and foundries [11][13] Group 4 - The industry is witnessing a shift towards high precision and intelligent equipment, with advancements in packaging technologies such as Chiplet and 3D IC driving innovation [27] - New application scenarios, particularly in electric vehicles and AI chips, are creating additional market opportunities for specialized packaging equipment [28] - The construction of digital factories is transforming traditional equipment operation and maintenance, enhancing efficiency through real-time data collection and predictive maintenance [29]

Core Viewpoint - New Yi Chang (688383) is actively transforming its strategy to focus on high-end semiconductor and new display packaging equipment, achieving significant revenue growth and optimizing its business structure [1][2][3]. Financial Performance - In the 2024 annual report, the company reported a revenue of 934 million yuan and a net profit attributable to shareholders of 40.46 million yuan [1]. - The operating cash flow net amount reached 139 million yuan, with a significant improvement in cash flow revenue ratio and accounts receivable turnover efficiency [1]. Business Strategy - The company is focusing on two main high-end sectors: semiconductor and new display packaging equipment, with the high-end equipment segment's revenue share surpassing 50% for the first time [1][2]. - New Yi Chang has entered the supply chains of major clients such as BOE, Samsung, and Konka, leveraging its technological advantages in Mini LED and semiconductor equipment [2]. Market Trends - The global semiconductor equipment market is projected to reach 121 billion USD by 2025, with China's market share exceeding 42% [2][6]. - The domestic semiconductor equipment market has seen a compound annual growth rate of 38.6% in revenue and 56.7% in net profit [6]. Technological Innovation - In 2024, the company invested 97.62 million yuan in R&D, accounting for 10.45% of its revenue, and added 62 new patents and 28 software copyrights [4]. - The company is advancing in key technologies such as high-speed precision motion control and intelligent sorting for Mini/Micro LED, which supports future product development [4]. Capacity Expansion - A high-end intelligent equipment manufacturing base project with a total investment of 600 million yuan is expected to generate over 680 million yuan in annual output after full production [4]. - Plans are in place to establish an intelligent manufacturing experimental factory to enhance the company's market positioning as a customized equipment supplier [4].