Supply News - Anshi China has shipped over 11 billion chips since resuming shipments in mid-October, serving over 800 global customers [1][7] - In response to semiconductor-related disputes, Wentai Technology has initiated multiple legal proceedings in the Netherlands and submitted a dispute notice, potentially seeking international arbitration with claims up to $8 billion if unresolved within six months [1][7] Project Progress - The third phase of the Muling North Semiconductor Technology Co., Ltd. project has officially commenced production, with a total investment of 2 billion yuan and an annual capacity of 1 million 6-inch wafers, primarily for applications in new energy vehicles, industrial control, and photovoltaics [2][8] - The core equipment for the New Beauty Materials New Station Optical Functional Film project was moved in on December 25, marking significant progress, with a total investment of approximately 5 billion yuan and plans for five internationally leading intelligent display material production lines, expected to achieve mass production by the third quarter of 2026 [2][8] Corporate Dynamics - Zhongwei Company won a provincial patent award for its invention patent "Chemical Vapor Deposition Reactor or Epitaxial Layer Growth Reactor and Its Supporting Device" and also secured the gold award in the second "Changgao Competition" for high-value patent transformation [3][9] - Noreco announced on December 26 the launch of a new product series, Optical Critical Dimension (OCD) equipment NKShape, successfully delivered to a leading domestic customer, designed for advanced semiconductor processes [3][9] - Tianzhun Technology announced on December 28 the successful completion of its public offering of convertible bonds, totaling 872 million yuan, with the bonds set to be listed on the Shanghai Stock Exchange on December 31, 2025 [4][10] - Chipone announced on December 26 that its shareholder, the National Integrated Circuit Industry Investment Fund, plans to reduce its holdings by up to 8.9396 million shares, accounting for no more than 1.70% of the total share capital [4][10] - SK Hynix is accelerating the construction of its 2.5D packaging production line to enhance its overall packaging capabilities for AI semiconductors, including high bandwidth memory (HBM) [4][10] - Media reports indicate that MediaTek announced a strategic partnership with global automotive component supplier DENSO to jointly develop customized automotive system-on-chip (SoC) solutions for advanced driver assistance systems (ADAS) and smart cockpit applications [4][10]

格隆汇12月16日｜联想集团表示，联想与英飞凌技术公司正在加紧合作，加速自动驾驶的下一阶段。联 想旗舰域控制器AD1和AH1集成了英飞凌的AURIX™微控制器技术，提供对先进驾驶辅助系统 （ADAS）的强大支持，实现了卓越的能源效率以及跨车载网络的高速数据通信。 ...

Core Viewpoint - Honda is set to launch an advanced driver assistance system (ADAS) that supports hands-off driving on highways in the Japanese market by the end of May 2025, marking a significant advancement in automotive technology [4]. Group 1: Product Features - The new Honda Accord model will be the first mass-produced vehicle in Japan to support hands-off driving on highways and dedicated roads, utilizing the latest generation ADAS called "Honda SENSING 360+" [4]. - The previous version of the Accord in Japan utilized the standard version of "Honda SENSING 360," which included features such as adaptive cruise control (ACC) and lane-keeping assistance (LKA), along with collision avoidance and lane change assistance [4]. - Key sensors for monitoring the vehicle's surroundings include one single camera and one millimeter-wave radar for front monitoring, along with four millimeter-wave radars for surrounding monitoring [4].

Core Viewpoint - Canon has developed a new type of image sensor called "SPAD" (Single Photon Avalanche Diode), which excels in low-light conditions and reduces power consumption, targeting the automotive sensor market as a new growth area [1][3]. Group 1: Product Development - Canon's SPAD sensor is designed to perform well in dark environments, capable of detecting pedestrians from 120 meters away even in conditions darker than moonlight [5]. - The new sensor improves upon earlier prototypes by reducing power consumption to one-fourth of the 2022 trial product, aiming for practical applications and competitive pricing with CMOS sensors [5]. - Canon plans to start mass production of the SPAD sensor by 2031, marking its entry into the automotive market [3]. Group 2: Market Potential - The automotive sensor market is expected to grow significantly, with projections indicating a market size of 3.6929 trillion yen by 2030, which is 2.3 times larger than in 2024 [5]. - Canon aims for its camera segment to capture 50% of the overall automotive sensor market by 2030 [5]. Group 3: Competitive Landscape - The automotive sensor market is currently dominated by major players such as ON Semiconductor, OmniVision, and Sony Semiconductor Solutions, with Sony planning to increase its market share from 32% in FY2023 to 43% in FY2026 [6]. - Sony is also developing its own SPAD sensors for high-performance LiDAR applications, which will begin mass production in the fall of 2025, enhancing detection capabilities [7]. - The competition in the automotive sensor market is intensifying, with various manufacturers adopting different strategies regarding the use of cameras and LiDAR for Advanced Driver Assistance Systems (ADAS) and autonomous driving [7].

随着先进驾驶辅助系统（ADAS）技术不断成熟，消费者对高速和城市通勤场景下驾驶辅助体验的期待提升， L2级高速NOA与城市NOA加速渗透，带动域控⽅案对前视一体机⽅案的替代，并推高中高算力SoC需求。 Canalys（现并入Omdia）预计，2025年中国市场L2级及以上功能渗透率将达62%，较2024年显著提升，高速 NOA 与城市NOA 分别达到10.8%和9.9%。预计2027–2028年，城市NOA增速将反超高速NOA ，市场结构快 速演变，将重塑SoC竞争格局。基于当前表现与节奏判断，高通凭借Snapdragon Ride平台（包括骁龙8650、 8620和8775等SoC）在产品性能与市场落地的表现，已连续两年位列Canalys中国ADAS SoC领导力矩阵的 "冠 军阵营"。 当前， 驾驶 辅助 普及加速 ： 市场倾向于平台化、性能和成本最优平衡 SoC厂商 越来越多主机厂 在推进 驾驶辅助普及 进程中，选择 。 将中高阶ADAS功能下放⾄10-20万元主力⻋型 为抢占先机 ，以 ⽐亚迪、 吉利 奇瑞 和 红旗 为代表的主流主机厂 、 采取 跨平台 的 驾驶 辅助 ⽅案 排布策略 ，系统性地推出 ...