证券代码：688003 证券简称：天准科技 公告编号：2026-014 转债代码：118062 转债简称：天准转债 苏州天准科技股份有限公司 2025年度业绩快报公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 本公告所载2025年度主要财务数据为初步核算数据，未经会计师事务所审计，具体数据以公司2025年年 度定期报告为准，提请投资者注意投资风险。 一、2025年度主要财务数据和指标 单位：人民币元 2.以上财务数据及指标以合并报表数据填列，但未经审计，最终结果以公司2025年年度报告为准。 二、经营业绩和财务状况情况说明 （一）报告期的经营情况、财务状况及影响经营业绩的主要因素 2025年度公司实现营业收入17.90亿元，比去年同期增长11.28%；实现归属于母公司所有者的净利润 7,859.97万元，比去年同期下降36.96%；实现归属于母公司所有者的扣除非经常性损益的净利润 6,034.27万元，比去年同期下降41.37%。 2025年公司新签订单24.45亿元（含税金额），同比增长33.96%，截至2025年 ...

Group 1 - The company has received approval from the China Securities Regulatory Commission to issue convertible bonds totaling RMB 872 million, with a net amount of RMB 862.28 million after deducting issuance costs [2][11] - The bonds have a six-year term and a face value of RMB 100 each, with a total issuance of 872,000 bonds [2][11] - The funds from the bond issuance are intended for temporary liquidity support, with a limit of RMB 20 million to be used within 12 months [3][4] Group 2 - A tripartite supervision agreement for the management of the raised funds has been signed between the company, Ningbo Bank Suzhou Branch, and Huatai United Securities [3][5] - The special account for the raised funds has been established, and as of January 22, 2026, the account balance was zero, indicating no funds have been withdrawn yet [5][6] - The agreement stipulates that the funds can only be used for business-related operations and requires monthly reconciliation statements from the bank [5][6] Group 3 - The convertible bonds will be convertible into company shares starting from June 18, 2026, following a six-month period post-issuance [11][13] - Investors must meet the suitability requirements for trading on the Sci-Tech Innovation Board to convert their bonds into shares, otherwise, they will not be able to do so [11][12] - The company has provided detailed information regarding the bond issuance in its prospectus available on the Shanghai Stock Exchange website [14]

Core Viewpoint - Tianzhun Technology announced the resignation of its actual controller and chairman, Xu Yihua, as general manager, while he will continue to serve as chairman. The board has nominated Cai Xiongfei as the new general manager, effective January 1, 2026. Cai holds 4.242 million shares indirectly and was previously a core technical staff member of the company. Zhongjin Pengyuan believes this change will not have a significant adverse impact, maintaining the company's credit rating at AA- with a stable outlook, valid until the maturity of the "Tianzhun Convertible Bonds" [1]. Group 1 - Xu Yihua resigns as general manager but remains chairman [1] - Cai Xiongfei is nominated as the new general manager, effective January 1, 2026 [1] - Cai Xiongfei holds 4.242 million shares indirectly and has a background as a core technical staff member [1] Group 2 - Zhongjin Pengyuan assesses that the management change will not cause significant adverse effects [1] - The company's credit rating is maintained at AA- with a stable outlook [1] - The rating is valid until the maturity of the "Tianzhun Convertible Bonds" [1]

Group 1 - The report maintains an optimistic outlook for the convertible bond market in January 2026, driven by policy expectations and seasonal capital inflows, which are expected to create a "good start" for the market [6][17] - The central economic work conference has identified "technological innovation" and "expanding domestic demand" as key policy focuses, with related industry policy benefits expected to continue, directly boosting market risk appetite [6][17] - The convertible bond market is experiencing a tight supply-demand balance, with the total size of publicly traded convertible bonds at approximately 527.1 billion yuan as of December 31, 2025, down 183.6 billion yuan from the beginning of 2025 [19] Group 2 - The report suggests focusing on growth styles in investment strategies, particularly in technology sectors such as aerospace, AI computing, semiconductor equipment, and innovative pharmaceuticals, which are expected to benefit from industry policy support [6][20] - The top ten convertible bond portfolio for January 2026 emphasizes aggressive and elastic sectors, with a focus on technology growth, cyclical recovery, and financial sectors [6][20] - Specific recommendations include increasing holdings in convertible bonds from companies like Yinbang, Zhenhua, and Yingliu in the technology sector, and focusing on cyclical sectors such as precious metals and chemicals [20][22]

Core Viewpoint - The China Convertible Bond Index remained flat at 491.85 points on December 31, with notable fluctuations in individual convertible bonds [1]. Group 1: Performance Highlights - Tianzhun Convertible Bond, Tianchuang Convertible Bond, Maolai Convertible Bond, Guanglian Convertible Bond, and Zai22 Convertible Bond had the highest gains, increasing by 30.00%, 20.00%, 8.04%, 7.71%, and 7.50% respectively [1]. - Conversely, Jiamei Convertible Bond, Ruida Convertible Bond, Shenyu Convertible Bond, Fuli Convertible Bond, and Yingtai Convertible Bond experienced the largest declines, with decreases of 10.50%, 4.67%, 3.50%, 3.36%, and 3.16% respectively [1].

Group 1 - The core point of the article is that Dingjie Convertible Bonds and Tianzhun Convertible Bonds were listed on December 31 [1] Group 2 - The listing of these convertible bonds indicates a potential opportunity for investors in the bond market [1] - The event reflects ongoing activities in the financial market, particularly in the area of convertible securities [1]

Group 1 - The company Proya plans to repurchase shares worth between 800 million to 1.5 billion yuan [1] - The major shareholder of Ruihua Tai, Guotou Gaoke, intends to reduce its stake by no more than 1% [1] - The convertible bond "Yingte Convertible Bond" is subject to forced redemption [2] Group 2 - Blue Sail Medical intends to transfer 100% equity of its wholly-owned subsidiary, Wuhan Bikaier [1] - Several convertible bonds have been listed, including Dingjie Convertible Bond and Tianzhun Convertible Bond [1] - New shares of Hengtong Guang have been listed on the Beijing Stock Exchange [1] Group 3 - The current price and redemption price of various convertible bonds are detailed, with specific dates for the last trading and conversion days [4][6]

Supply News - Anshi China has shipped over 11 billion chips since resuming shipments in mid-October, serving over 800 global customers [1][7] - In response to semiconductor-related disputes, Wentai Technology has initiated multiple legal proceedings in the Netherlands and submitted a dispute notice, potentially seeking international arbitration with claims up to $8 billion if unresolved within six months [1][7] Project Progress - The third phase of the Muling North Semiconductor Technology Co., Ltd. project has officially commenced production, with a total investment of 2 billion yuan and an annual capacity of 1 million 6-inch wafers, primarily for applications in new energy vehicles, industrial control, and photovoltaics [2][8] - The core equipment for the New Beauty Materials New Station Optical Functional Film project was moved in on December 25, marking significant progress, with a total investment of approximately 5 billion yuan and plans for five internationally leading intelligent display material production lines, expected to achieve mass production by the third quarter of 2026 [2][8] Corporate Dynamics - Zhongwei Company won a provincial patent award for its invention patent "Chemical Vapor Deposition Reactor or Epitaxial Layer Growth Reactor and Its Supporting Device" and also secured the gold award in the second "Changgao Competition" for high-value patent transformation [3][9] - Noreco announced on December 26 the launch of a new product series, Optical Critical Dimension (OCD) equipment NKShape, successfully delivered to a leading domestic customer, designed for advanced semiconductor processes [3][9] - Tianzhun Technology announced on December 28 the successful completion of its public offering of convertible bonds, totaling 872 million yuan, with the bonds set to be listed on the Shanghai Stock Exchange on December 31, 2025 [4][10] - Chipone announced on December 26 that its shareholder, the National Integrated Circuit Industry Investment Fund, plans to reduce its holdings by up to 8.9396 million shares, accounting for no more than 1.70% of the total share capital [4][10] - SK Hynix is accelerating the construction of its 2.5D packaging production line to enhance its overall packaging capabilities for AI semiconductors, including high bandwidth memory (HBM) [4][10] - Media reports indicate that MediaTek announced a strategic partnership with global automotive component supplier DENSO to jointly develop customized automotive system-on-chip (SoC) solutions for advanced driver assistance systems (ADAS) and smart cockpit applications [4][10]

Core Viewpoint - Tianzhun Technology (688003) has announced the issuance of convertible bonds totaling 872 million yuan, which will be listed on the Shenzhen Stock Exchange on December 31, 2025 [1][2]. Group 1: Bond Issuance Details - The total amount of the convertible bonds issued by Tianzhun Technology is 872 million yuan (872,000 bonds) [1][2]. - Existing shareholders have priority in the subscription, with 755,820 bonds (755.82 million yuan), accounting for approximately 86.68% of the total issuance [2]. - Public investors subscribed to 113,505 bonds (113.505 million yuan), representing about 13.02% of the total issuance, while the lead underwriter subscribed to 2,675 bonds (2.675 million yuan), making up 0.31% of the total [2]. Group 2: Company Overview - Tianzhun Technology is a well-known visual equipment platform enterprise in China, focusing on the application of artificial intelligence technology to promote industrial digitalization [2]. - The company serves various industrial sectors, including electronics, semiconductors, and new energy vehicles, providing leading high-end visual equipment products [2]. - In the electronics sector, Tianzhun Technology is a core supplier of visual equipment, offering high-end visual measurement, inspection, and process equipment [2]. Group 3: Fund Utilization - The funds raised from the bond issuance will be allocated to several projects, including the R&D and industrialization of industrial visual equipment and precision measurement instruments [3]. - The semiconductor measurement equipment project aims to tackle key technologies and promote the localization of core components, enhancing the company's competitiveness in the semiconductor measurement field [3]. - The smart driving and embodied intelligent controller project focuses on developing foundational software and hardware platforms, facilitating the implementation of domestic chip platforms in smart driving applications [3].

Group 1 - The company Tianzhun Technology announced the issuance of Tianzhun Convertible Bonds [1] - The total issuance amount is 872 million yuan, with an issuance volume of 872,000 lots [1] - The bonds will be listed on the Shanghai Stock Exchange, with a listing date set for December 31, 2025 [1]