光刻工艺

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中国芯片制造技术与西方存20年差距,光刻设备成关键瓶颈
Xin Lang Cai Jing· 2025-09-03 22:15
Core Insights - A recent report from a well-known international investment institution indicates that China has a technological gap of approximately 20 years in advanced chip manufacturing compared to Western developed countries [1] - The report highlights a significant disparity in photolithography equipment manufacturing between China and the United States, identifying it as a major obstacle to producing high-end chips in China [1] Industry Summary - The most advanced photolithography equipment is developed and manufactured by European companies, which rely on core components from the United States, thus being affected by export controls [1] - Due to external restrictions, Chinese companies face difficulties in obtaining high-end photolithography equipment, directly impacting their research and mass production capabilities in advanced processes [1] - For instance, domestic major chip manufacturers are forced to use relatively outdated technologies to produce 7-nanometer chips, which not only affects production efficiency but also significantly increases manufacturing costs [1] Technology and Supply Chain - The manufacturing of high-end photolithography equipment involves a global supply chain, with key components primarily located in the US and Europe, indicating a substantial gap in China's self-sufficiency in this area [1] - Photolithography is a core technology that transfers chip design patterns onto silicon wafers, and high-end equipment enables finer line delineation, thereby enhancing overall chip performance [1] - After the pattern transfer, multiple processes such as etching, deposition, and cleaning are required to complete chip manufacturing, underscoring the irreplaceable role of photolithography equipment in the chip manufacturing process and its influence on the industry's advancement towards high-end development [1]
2025年深度行业分析研究报告
未知机构· 2025-04-27 06:00
Investment Rating - The report does not explicitly state an investment rating for the industry Core Insights - The lithography process is the most technically challenging, costliest, and time-consuming step in chip manufacturing, accounting for approximately 30% of costs and 40-50% of time in the manufacturing process [7][10][12] - The lithography process involves multiple steps, including surface treatment, coating, exposure, development, and inspection, with advanced technology nodes requiring 60-90 lithography steps [7][10] - The lithography market is dominated by three major players: ASML, Nikon, and Canon, with a market size in the hundreds of billions [3.2][4.1] Summary by Sections 1. Lithography Process - Lithography is crucial for defining the minimum line width of chips and directly impacts the performance and process level of semiconductor devices [7][10] - Key parameters in lithography include resolution and overlay accuracy, which are essential for ensuring the precise transfer of patterns onto silicon wafers [14][32] 2. Components of Lithography Machines - Lithography machines consist of several key components, including the light source, illumination system, and projection optics, which are critical for the exposure process [43][45] - The light source provides the energy needed for lithography, with different types such as mercury lamps, excimer lasers, and extreme ultraviolet (EUV) light being used depending on the process requirements [45][48] 3. Lithography Machine Market - The lithography machine market is characterized by a high level of competition among leading manufacturers, with ASML being a dominant player in the EUV segment [3.2][4.1] - The report highlights the evolution of lithography technology, including advancements in light source wavelengths and numerical aperture (NA), which are essential for improving resolution [19][22] 4. Domestic Supply Chain Manufacturers - The report outlines several domestic manufacturers involved in the lithography supply chain, including Shanghai Micro Electronics, Guoke Precision, and Huazhuo Jingke, each specializing in different aspects of lithography technology [4.1][4.2][4.3]