Core Viewpoint - TSMC has placed an order for 10 units of 5nm plasma etching machines from Zhongwei Semiconductor Equipment, marking a significant achievement for Zhongwei in the semiconductor equipment sector [1][2]. Group 1: TSMC's Operations - TSMC's Nanjing factory, established in 2016 with an investment of approximately $3 billion, is a key part of TSMC's strategy in mainland China [3]. - The Nanjing facility achieved remarkable construction efficiency, completing the factory in 14 months and producing its first wafer within 6 months [3]. - The factory primarily focuses on 12nm and 16nm process technologies and has significantly enhanced local wafer foundry capabilities [3]. Group 2: Zhongwei Semiconductor Equipment - Zhongwei Semiconductor has successfully developed a 5nm etching machine that meets TSMC's stringent requirements, showcasing its technological maturity and reliability [1][2]. - The company has a strong track record in etching equipment, having progressed from 65nm to 5nm technology through continuous innovation and R&D investment [2]. - Zhongwei's etching equipment features advanced technology, including adjustable process stability, dual low-frequency RF sources, and a proprietary anti-corrosion reaction chamber [2]. Group 3: Market Position and Financials - Zhongwei Semiconductor is a leading player in the domestic semiconductor equipment market, with over 95% coverage of domestic etching needs and a projected revenue of approximately 7.277 billion yuan in 2024 [5]. - The company has experienced an average annual growth rate of over 50% in etching equipment revenue over the past four years [5]. - Zhongwei is also expanding into new areas, including GaN-based LED lighting and SiC power devices, while actively investing in over 30 upstream and downstream enterprises [6].

作为国产薄膜沉积设备龙头，拓荆科技(688072)受益于国内下游晶圆制造厂对国内半导体设备的需求增 加，营业收入维持高增长趋势。在5月27日2025年第一季度业绩说明会上，公司高管表示，目前公司在 手订单充足，今年整体经营性趋势非常健康，并将拓展海外市场。 据介绍，拓荆科技通过在薄膜沉积设备及三维集成领域的先进键合设备及配套的量检测设备的技术积累 和快速发展，拓荆科技较国内竞争对手形成显著先发优势，已经成为国内半导体设备行业的领军企业。 其中，在应用于三维集成领域的先进键合设备及配套量检测设备方面，去年公司实现产品销售收入 9566.85万元，同比增长48.78%，应用于晶圆对晶圆混合键合设备、芯片对晶圆键合前表面预处理设备 获得重复订单并扩大产业化应用，新推出的键合套准精度量测设备及键合强度检测设备通过客户验证。 去年拓荆科技研发投入就达到7.56亿元；今年一季度，拓荆科技研发投入合计1.57亿元，在营业收入占 比达到22.38%，占比在国内半导体设备上市公司中居前。 2024年，公司自主研发并推出了10余款新产品/新工艺设备，包括Flowable CVD(流动性化学气相沉 积)、PECVD Bianca、 ...