Investment Rating - The report maintains a "Strong Buy" rating for the company, expecting it to outperform the benchmark index by over 20% in the next six months [2][22]. Core Views - The company has demonstrated robust revenue growth, driven by opportunities in the advanced packaging market fueled by AI technology. The company achieved a revenue of 1.95 billion yuan in the first half of 2025, representing a year-on-year increase of 30.28%, and a net profit of 505 million yuan, up 16.82% year-on-year [3][7]. - The company is actively developing new products and technologies, enhancing its market competitiveness. It focuses on semiconductor key equipment and technology services, continuously updating existing products and expanding into new technologies [7]. - The construction of new production bases is accelerating, optimizing the company's industrial layout. The Beijing plant has commenced operations, and the company is expanding its capacity in the wafer regeneration project in Kunshan [7]. Financial Summary - Total revenue is projected to grow from 3.41 billion yuan in 2024 to 6.89 billion yuan in 2027, with a compound annual growth rate (CAGR) of 35.8% to 16.7% [3][8]. - Net profit attributable to the parent company is expected to increase from 1.02 billion yuan in 2024 to 1.98 billion yuan in 2027, with a CAGR of 41.4% to 17.0% [3][8]. - Earnings per share (EPS) is forecasted to rise from 2.90 yuan in 2024 to 5.60 yuan in 2027, reflecting strong profitability growth [3][8].

Core Viewpoint - The article discusses the acquisition of Yuanlong Electronics by ASE Technology Holding Co., Ltd. (日月光投控) through its subsidiary, Taiwan Fulei Electronics, with a focus on the potential privatization and restructuring of Yuanlong to adapt to the upcoming AI era [1][2]. Group 1: Acquisition Details - ASE Technology plans to acquire Yuanlong Electronics at a price of NT$9 per share, with a maximum purchase of 15,100 shares, totaling NT$136 million, representing a premium of approximately 3.09% based on Yuanlong's closing price of NT$8.73 [1]. - The acquisition period is set from May 15 to June 24, aiming to restructure Yuanlong's operations and promote business transformation [1]. - Post-acquisition, ASE Technology's stake in Yuanlong is expected to reach 68.18%, with the acquisition potentially leading Yuanlong towards privatization [1][2]. Group 2: Financial Performance of Yuanlong - Yuanlong's Q1 financial report shows consolidated revenue of NT$268 million, a quarter-on-quarter increase of 14.2% and a year-on-year increase of 24.6% [1]. - Despite revenue growth, Yuanlong reported a net loss of NT$128 million for Q1, marking the highest quarterly loss in nearly four years, with a loss per share of NT$1.06 [1]. - As of the end of Q1, Yuanlong's net asset value per share was NT$-0.42, down from NT$0.62 at the end of the previous year, putting it at risk of delisting [1]. Group 3: Market Challenges - The 6-inch power semiconductor wafer foundry market is facing pricing pressures, leading to high operational costs for Yuanlong and resulting in nine consecutive quarters of losses [2]. - The competitive landscape has intensified due to price wars from Chinese manufacturers in the MOSFET market, pushing power semiconductor manufacturers towards high-voltage technologies and third-generation semiconductor research [2]. - The integration of Yuanlong into ASE Technology is expected to leverage group resources for operational restructuring, potentially transitioning to third-generation semiconductor processes [2]. Group 4: OSAT Market Overview - According to TrendForce, the top 10 OSAT companies are projected to see a 3% year-on-year revenue growth in 2024, reaching $41.56 billion [3]. - ASE Technology leads the market with revenues of $18.54 billion, capturing nearly 45% of the market share [3]. - Other notable companies include Amkor with $6.32 billion, Changjiang Electronics with $5 billion, and Tongfu Microelectronics with $3.32 billion [3][4]. Group 5: Industry Trends - The OSAT sector is experiencing increasing technical demands, shifting from traditional manufacturing to advanced integration and packaging solutions driven by AI and edge computing [5]. - The industry is adapting to high-frequency and high-density packaging requirements, indicating a significant transformation in operational strategies [5].