Market and Landscape: The Rise of the East, AI Demand Determines the Cycle - The global semiconductor sales are expected to reach $728 billion by 2025, with a year-on-year growth of 15.4%, primarily driven by strong growth in logic devices (+29%) and memory (+17%) due to the demand from data center infrastructure and the rise of AI edge applications [3][10][7] - In the first half of 2025, semiconductor sales in mainland China are projected to be $96 billion, accounting for 28% of the regional market, continuing to lead the market [3] Concentration - The top five foundries (TSMC, Samsung, SMIC, UMC, GlobalFoundries) hold an 83% market share, with TSMC alone accounting for 48.7%, showing significant premium in advanced processes [13] - The top five equipment manufacturers (ASML, AMAT, LAM, TEL, KLA) hold an 86% market share, with high-end technology still dominated by companies from Europe, the US, and Japan [13] Manufacturing and Equipment: The Era of EUV High-NA Begins, Domestic Acceleration Verification - ASML's 0.33NA EUV has been used for 3nm, with 0.55NA (High-NA) expected to enter small-scale production in 2025 and become mainstream by 2030 [39] - Domestic 28nm DUV has passed production line verification, with a target of mass production for 14nm by 2026 [39] - The global wafer fab capital expenditure (Capex) is estimated to be around $188 billion in 2025, with mainland China contributing $35 billion (+40%) [67] Process Route: FinFET → GAA → CFET, Computational Lithography + AI Precision Leverage - Samsung has begun mass production of 3nm GAA, while TSMC is at risk of trial production for 2nm in Q4 2025 [69] - The k₁ factor has dropped below 0.25, necessitating multiple exposures (LELE/LFLE/SADP/SAQP) and ILT inverse mask technology [72] - The introduction of AI and GPU acceleration has significantly reduced the computation time for full-chip ILT calculations from weeks to days [87]

公众号记得加星标⭐️，第一时间看推送不会错过。 在如今的半导体产业中，光刻作为芯片制造的核心工艺，愈发受到重视，在这场围绕纳米级精 度的技术竞逐中，ASML的表现尤为瞩目。 但ASML的能力，远不止于制造众所周知的光刻机。在光刻这门微观艺术里，ASML早已构建 出一整套覆盖前后工序、软硬结合的全景光刻解决方案。这是一个由多项硬件模块、软件平台 与优化算法协同运作的技术系统——涵盖光刻机台、光罩优化、光学对准、计算光刻、缺陷检 测，甚至延伸到晶圆厂工艺协同。 可以说，如今的ASML代表的远不止一台设备，而是光刻背后的一整套技术生态。 为推动光刻技术走近大众视野，激发更多人对芯片制造核心工艺的兴趣，ASML中国在2025年6月20 日隆重举办「ASML杯」光刻「芯」势力知识挑战赛。这不仅是一场面向科技爱好者和专业人才的知 识盛宴，更是一扇通往"全景光刻世界"的探索之门。 目前「ASML杯」光刻「芯」势力知识挑战赛的报名已经正式开始， 欢迎点击文末"阅读原文"或扫 描下方二维码 ，参与这场光刻技术盛宴。 半导体行业观察作为行业知名媒体，自然不会错过这场别开生面的光刻技术挑战赛，在深入了解挑战 赛后，我们发现这些光刻 ...