Group 1: Artificial Intelligence - The State Council of China has approved the "Artificial Intelligence+" action plan, aiming to promote large-scale commercial applications of AI across various sectors, fostering a virtuous cycle of innovation and application [1][7] - The AI industry in China is projected to maintain a compound annual growth rate of 32.1% from 2025 to 2029, with a market size expected to exceed 1 trillion yuan by 2029 [1] - Baidu is testing an AI application entry on its homepage, integrating various AI applications, which is expected to be fully launched soon [3] Group 2: Innovative Pharmaceuticals - CSPC Pharmaceutical Group has entered a significant licensing agreement with Madrigal Pharmaceuticals for the global development and commercialization of its oral GLP-1 receptor agonist, with a total transaction value of up to $2.075 billion [2] - The Chinese government is implementing measures to support the high-quality development of innovative drugs, which is expected to enhance the sector's growth [2] - The innovative drug sector is anticipated to benefit from domestic policy support and internationalization, leading to a more stable upward trend in the market [2] Group 3: Brain-Computer Interface - The National Healthcare Security Administration has established a pricing mechanism for new medical technologies, including brain-computer interface (BCI) services, facilitating faster clinical application and reimbursement [5] - The global market for BCI medical applications is projected to reach $40 billion by 2030 and $145 billion by 2040, indicating significant growth potential [5] Group 4: Diamond Technology - A research team has successfully converted high-quality graphite precursors into hexagonal diamonds, which have mechanical properties comparable to cubic diamonds, marking a significant advancement in material science [6] - Hexagonal diamonds are expected to have broad applications in industries such as cutting tools, medical devices, and aerospace materials, with major tech companies actively exploring diamond semiconductor technologies [6]

Market Overview - The main board saw significant gains with notable stocks such as Zhongjia Bochuang (+10.10%), Tongding Hulin (+10.06%), and Zhongdian Xinlong (+10.05%) leading the charge [1] - The ChiNext board also performed well, highlighted by Hengshi Technology (+20.05%) and Huijin Co., Ltd. (+20.05%) [1] - The Sci-Tech Innovation Board was led by Shengyi Electronics (+20.01%) and Qingyun Technology-U (+20.00%) [1] - Active sub-industries included SW Printed Circuit Boards (+6.62%) and SW Communication Network Equipment and Devices (+3.85%) [1] Domestic News - Noctiluca is enhancing its business layout in Asia, recently signing a Material Transfer Agreement (MTA) with Huawei to test its self-developed OLED materials [1] - Kairun Co. announced the shipment of China's first 8.6-generation OLED De-mura equipment to a leading domestic panel manufacturer, marking a significant milestone in OLED panel manufacturing [1] - A fourth-generation diamond semiconductor project with a total investment of 265 million yuan is set to commence construction in Urumqi by September 2025, aiming for an annual sales revenue of 300 million yuan upon reaching full production [1] - Yongxi Electronics reported that its 2.5D packaging is expected to complete wiring by Q4 2024, with improving wafer-level packaging yield rates and gross margins anticipated to turn positive in the second half of the year [1] Company Announcements - Electric Science and Technology Chip announced a shareholder equity change, with Electric Investment increasing its stake by 1.41% to a total of 41.00% [3] - Jiuyuan Yinhai declared a cash dividend of 1.50 yuan per 10 shares, totaling 61.23 million yuan distributed to shareholders [3] - Wantong Technology announced a cash dividend of 0.30 yuan per 10 shares based on its current total share capital [3] - Debang Technology reported a reduction in shareholding by the National Integrated Circuit Fund, decreasing its stake from 17.98% to 16.83% [3] International News - GlobalFoundries announced plans to invest $16 billion in the U.S., with over $13 billion allocated for facility expansion and modernization in New York and Vermont [2] - The U.S. Trade Representative's office announced a three-month suspension of the 25% tariffs on certain Chinese imports, including components containing chips and semiconductors [2] - Broadcom launched a high-performance switching chip, claiming it to be the world's first 102.4Tbps switch, aimed at supporting large-scale AI networks [2]

Core Viewpoint - The collaboration between AIST and Honda Research Institute has successfully developed a p-type diamond MOSFET prototype, demonstrating amperage-level high-speed switching operations, with plans to integrate this technology into next-generation mobile power devices for practical implementation in society [1][2]. Group 1: Development and Characteristics - The research team utilized larger substrates compared to traditional methods to increase current capacity and developed wiring technology for parallel operation [2]. - A single device with a gate width of 1020μm exhibited excellent operational characteristics, achieving high yield rates on the same substrate [2]. Group 2: Performance Evaluation - The configuration of 314 individual components allowed for parallel connection of source, gate, and drain electrodes, resulting in a total gate width of approximately 32cm [3]. - The switching speed was evaluated using a double-pulse method, confirming a fall time of 19 nanoseconds and a rise time of 32 nanoseconds at a drive current of 2.5A [3].