Semiconductor materials linchpin Resonac is eyeing solid growth from Beijing’s ambition to build its own chip industry, leaving the door open for further investment in China in the years ahead https://t.co/Jr2gmC1lI9 ...

Core Viewpoint - Jiangsu Taizhou has launched an IPO in the semiconductor materials sector, supplying products to China Resources Microelectronics, and operates without a controlling shareholder [1] Group 1 - The company is positioned in the semiconductor materials industry, which is critical for the development of electronic components [1] - The IPO aims to raise capital to enhance production capacity and expand market reach [1] - The absence of a controlling shareholder may attract a broader range of investors, potentially increasing market interest [1]

【DT新材料】获悉，近日，半导体封装材料头部企业江苏中科科化新材料股份有限公司（简称"中科科化"）科创板IPO获受理。 本次拟募资5.98亿元，其中，4.2亿元用于半导体封装用中高端环氧塑封料产业化项目，9800万元用于半导体封装用中高端环氧塑封料研发中心 建设项目，未来将新增 22,500 吨环氧塑封料的设计产能。 | 单位 | | | | | --- | --- | --- | --- | | A mind | 万元 | . | | | 0 | | --- | | 单位: 肢 90 1 | | 序号 | 股东名称 | 本次发行前 | | 本次发行后 | | | --- | --- | --- | --- | --- | --- | | | | 持股数量 | 持股比例 | 持股数量 | 持股比例 | | I | 北京科化 | 42. 616, 794 | 64. 57 | 42, 616, 794 | 48. 43 | | 2 | 国科瑞华 | 6, 106, 518 | 9. 25 | 6, 106, 518 | 6.94 | | 3 | 上海风立 | 4, 317, 786 | 6.54 | 4, 31 ...

： ： ： ESG推進 CP&RMG 富士幸太郎('23.5.15) FFグループ 取 扱 指 定 作 成 / 日 付 開 示 範 囲 Fujifilm Internal Use Only ： ： ： CC-IR('24.4.9) 会議出席者限り 取 扱 指 定 作 成 / 日 付 開 示 範 囲 Fujifilm Internal Use Only 再配布禁止 Semiconductor Materials Business Briefing December 10, 2025 Business performance forecast and future predictions contained in this material are based on currently -available information and reflect potential risks and uncertainty factors. For this reason, actual business performance could be different from such predictions due ...

南大光电12月8日在互动平台表示，公司Arf光刻胶现有产能50吨/年，根据客户订单情况安排生产，未 达到满产状态。2024年度ArF光刻胶收入突破千万元。2025年，前期取得订单的产品保持连续稳定供 货。 ...

瑞财经 刘治颖 12月5日，江苏中科科化新材料股份有限公司（以下简称：中科科化）科创板IPO获受理，保荐机构为招商证券，保荐代表人为黄文雯、李思 博，会计师事务所为致同会计师事务所。 招股书显示，中科科化成立于2011年10月，是一家专注于半导体封装材料研发、生产和销售的国家级专精特新"小巨人"企业，主要产品为环氧塑封料。 历经十余年的创新发展，中科科化已成为少数具备中高端环氧塑封料自主研发和规模化生产能力的内资厂商之一。2022年度和2023年度，公司环氧塑封料业 务规模分别位居内资厂商第四名和第三名，2024年度升至第二名。 环氧塑封料是使用量较大的半导体封装材料单品，目前全球90%以上的芯片采用环氧塑封料作为包封材料。 根据中国电子材料行业协会统计数据，中高端环氧塑封料已占据国内80%-90%市场份额，成为市场主流产品，其中，中端产品以50%-60%的市场占比构成最 大细分领域，同时也是本土头部厂商国产替代的主战场。环氧塑封料整体国产化率处于较低水平，仅有少数内资厂商具备中高端产品研发生产能力，近年来 这些企业通过技术创新和资源整合，正在快速突破日系厂商的技术壁垒。 环氧塑封料行业作为半导体产业链中的关 ...

格隆汇12月4日丨八亿时空(688181.SH)在互动平台表示，半导体光刻胶树脂作为光刻胶的核心原料，基 本被国外垄断，技术壁垒非常高。公司依据多年在化学合成、材料纯化、精益管理等方面的系统性优势 及经验，自主培养了一支专业的光刻胶树脂研发团队，基于在液晶材料领域相关经验的积累及光刻胶核 心工艺的摸索，聚焦KrF光刻胶关键原料PHS树脂及其衍生物的研发和量产。目前公司已具备了高端半 导体光刻胶（KrF）树脂全系列的研发生产能力，并与多家头部光刻胶厂家合作，开发多款高性能树 脂，为光刻胶材料国产替代贡献力量。 ...

企查查APP显示，近日，太原美锦先微半导体材料有限公司成立，法定代表人为董宜忠，注册资本为 6000万元，经营范围包含：电子专用材料制造；新材料技术研发；专用化学产品制造（不含危险化学 品）；通用设备修理等。企查查股权穿透显示，该公司由合肥先微半导体材料有限公司、美锦能源全资 子公司山西美锦科技有限公司共同持股。 ...

Core Viewpoint - Dinglong Co., Ltd. has successfully validated two high-end wafer photoresists with major domestic wafer manufacturers and received orders, indicating a strong market demand for its products [1] Group 1: Product Development and Production Capacity - The company has established a production line in Qianjiang with an annual capacity of 30 tons for KrF/ArF high-end wafer photoresists, which is now capable of mass production and supply [1] - By the third quarter of 2025, the company plans to have nearly 30 high-end wafer photoresists in its portfolio, with over 15 samples validated and more than 10 entering gallon sample testing [1] Group 2: Future Plans and Market Strategy - The company aims to continue enhancing the production capacity of its photoresist lines and expedite the commercialization process of high-end wafer photoresists to increase its market share in the industry [1] - The second phase of the Qianjiang photoresist production base, which will have an annual production capacity of 300 tons for KrF/ArF high-end wafer photoresists, is nearing completion and equipment debugging is progressing smoothly [1]

Group 1 - The semiconductor equipment sector is experiencing a high growth phase, driven by dual benefits from domestic policies and increasing demand for mid-to-high-end equipment from large wafer fabs [3] - The semiconductor equipment ETF (561980) has seen significant inflows, with a net inflow of nearly 75 million yuan in a single day and a total of 3.77 billion yuan year-to-date, indicating strong investor interest [1] - The semiconductor equipment ETF has increased by 43.72% year-to-date, ranking third among 31 primary industries, only behind non-ferrous metals and communications [1] Group 2 - Capital expenditures for leading internet companies in China and the U.S. are expected to grow rapidly, with projections of $430.6 billion (+65%) in 2025 and $602 billion (+40%) in 2026, supporting future demand for computing chips [2] - The domestic storage manufacturers are expected to contribute significantly to wafer fab capital expenditures next year, which will drive demand for semiconductor equipment and materials [2] Group 3 - The semiconductor equipment sector is expected to maintain high growth rates over the next three years, driven by increased domestic production and demand, with a focus on enhancing localization rates [3] - The top ten constituents of the semiconductor equipment ETF account for over 78% of the index, focusing on key players in the chip industry chain [4]