Core Viewpoint - The company plans to invest 1.5 billion yuan in the construction of a new generation PCB manufacturing base project named "Chip Innovation Smart Carrier," which has received recognition from major automotive OEMs and is expected to commence production in the second half of 2026 [1] Group 1: Investment and Project Development - The investment amount for the "Chip Innovation Smart Carrier" project is set at 1.5 billion yuan [1] - The project involves "chip-embedded PCB packaging technology," which has gained acceptance from several mainstream automotive manufacturers and OEMs [1] - Production for the project is anticipated to start in the second half of 2026 [1] Group 2: Corporate Governance and Compensation - The chairman of the company does not receive a salary, while other non-independent directors receive compensation based on their administrative roles [1] - Independent directors receive director allowances [1] - Compensation details for directors and senior management will be disclosed in the 2025 annual report, as relevant directors are newly appointed in 2025 [1] - The company has established an internal incentive system to enhance management's motivation and accountability, with plans to consider stock incentives at an appropriate time [1]

2025年1至6月份，崇达技术的营业收入构成为：印制电路板制造行业占比89.48%，其他业务占比 10.52%。 截至发稿，崇达技术市值为165亿元。 每经AI快讯，崇达技术（SZ 002815，收盘价：13.56元）发布公告称，2025年11月13日，崇达技术接受 中信资管等投资者调研，公司证券事务代表朱琼华参与接待，并回答了投资者提出的问题。 每经头条（nbdtoutiao）——对美出口下滑到7年前水平，我国出口总额却创历史新高，"新三样"变 成"新N样" （记者 王瀚黎） ...

Financial Performance - In the first three quarters of 2025, the company achieved revenue of 5.593 billion yuan, a year-on-year increase of 20.27% [2] - The net profit attributable to shareholders reached 314 million yuan, up 19.58% year-on-year; in Q3 2025, net profit was 92 million yuan, showing a significant growth of 252.87% [2] Strategies for Profitability Improvement - Focus on high-value customers and orders, optimizing sales structure by managing loss-making orders and increasing high-value orders [3] - Strengthen the sales team by expanding and optimizing the overseas sales force, implementing performance evaluation mechanisms [3] - Enhance cost management through standardized cost management practices to reduce unit product costs [4] - Improve order delivery and customer service by enhancing internal communication and optimizing production scheduling [4] Raw Material Cost Management - The company is facing rising raw material costs, particularly for copper and other key materials, which have seen significant price increases since June 2024 [5] - Measures to mitigate cost pressures include dynamic monitoring of costs, improving material utilization, and implementing price adjustment strategies [6] Capacity Utilization and Expansion Plans - Current overall capacity utilization is approximately 85% [7] - The company is accelerating capacity expansion in various plants to meet market demand, including the construction of a new HDI factory [7] Subsidiary Performance - The subsidiary, San De Guan, has turned profitable in Q3 2025, despite challenges in the flexible printed circuit board (FPC) sector [8] Future Growth Drivers - Anticipated growth in 2026 will be driven by increased demand in mobile, server, and communication sectors, with a focus on high-layer boards and IC substrates [9][10] - The company plans to enhance its competitive advantages in product quality, cost control, and pricing strategies while developing new key customers [10]

融资方面，中富电路当日融资买入9656.15万元。当前融资余额4.96亿元，占流通市值的3.65%，融资余 额超过近一年90%分位水平，处于高位。 融券方面，中富电路11月12日融券偿还0.00股，融券卖出0.00股，按当日收盘价计算，卖出金额0.00 元；融券余量0.00股，融券余额0.00元，超过近一年90%分位水平，处于高位。 11月12日，中富电路涨3.31%，成交额10.95亿元。两融数据显示，当日中富电路获融资买入额9656.15 万元，融资偿还7058.31万元，融资净买入2597.84万元。截至11月12日，中富电路融资融券余额合计 4.96亿元。 资料显示，深圳中富电路股份有限公司位于广东省深圳市南山区蛇口招商局广场大厦6楼GH单元，成立 日期2004年3月12日，上市日期2021年8月12日，公司主营业务涉及从事印制电路板研发、生产和销售。 主营业务收入构成为：印制电路板89.34%，其他(补充)10.66%。 截至10月31日，中富电路股东户数2.15万，较上期减少2.61%；人均流通股8901股，较上期增加2.68%。 2025年1月-9月，中富电路实现营业收入13.55亿元，同比增长 ...

Group 1 - The company Si Hui Fu Shi (SZ 300852) announced the completion of a share reduction plan by shareholders Si Hui Ming Cheng and Tian Cheng Tong Chuang, resulting in a total reduction of approximately 4.24 million shares, which accounts for about 2.98% of the company's total shares [1] - As of November 10, 2025, the share reduction plan has been fully implemented [1] - For the first half of 2025, the company's revenue composition shows that printed circuit boards account for 93.96%, while other businesses account for 6.04% [1] Group 2 - The current market capitalization of Si Hui Fu Shi is 6.2 billion yuan [1]

Group 1 - The core point of the article is the current production status of the Zhuhai plant of Chongda Technology, which is in the ramp-up phase with a monthly capacity of 120,000 square meters [1] - There is a discrepancy in the information regarding the operational status of the Zhuhai plant, as the company’s official news states it has achieved full production, while the investor interaction indicates it is still ramping up [2]

机构持仓方面，截止2025年9月30日，广合科技十大流通股东中，香港中央结算有限公司位居第一大流 通股东，持股1594.59万股，为新进股东。 11月11日，广合科技跌1.81%，成交额2.74亿元。两融数据显示，当日广合科技获融资买入额4259.36万 元，融资偿还3413.13万元，融资净买入846.23万元。截至11月11日，广合科技融资融券余额合计7.65亿 元。 责任编辑：小浪快报 融资方面，广合科技当日融资买入4259.36万元。当前融资余额7.64亿元，占流通市值的7.34%，融资余 额超过近一年90%分位水平，处于高位。 截至9月30日，广合科技股东户数2.40万，较上期减少13.78%；人均流通股6260股，较上期增加 15.98%。2025年1月-9月，广合科技实现营业收入38.35亿元，同比增长43.07%；归母净利润7.24亿元， 同比增长46.97%。 分红方面，广合科技A股上市后累计派现3.10亿元。 融券方面，广合科技11月11日融券偿还200.00股，融券卖出100.00股，按当日收盘价计算，卖出金额 6932.00元；融券余量8500.00股，融券余额58.92万元，超过近一 ...

Group 1 - The company, Chongda Technology, confirmed a good cooperative relationship with Ruijie in the PCB application field for servers and switches [2]

Core Viewpoint - The company Huadian Co., Ltd. (002463.SZ) has agreed to purchase a production facility from its affiliate, Xianchuang Electronics Co., Ltd., for a maximum price of 95 million yuan to support the operational and long-term development needs of its wholly-owned subsidiary, Kunshan Huli Microelectronics Co., Ltd. [1] Group 1 - The purchase price for the facility is set at no more than 95 million yuan [1] - The facility is located in the Kunshan Comprehensive Bonded Zone [1] - The building area of the facility is 47,231.43 square meters, and the land use area is 26,800.00 square meters [1]

Core Viewpoint - Huadian Co., Ltd. (SZ 002463) announced a board meeting on November 11, 2025, to discuss asset acquisition and related transactions [1] Company Summary - For the first half of 2025, Huadian's revenue composition was as follows: PCB accounted for 95.98%, other businesses for 3.99%, and real estate sales for 0.03% [1] - As of the report date, Huadian's market capitalization was 126 billion yuan [1]