Group 1 - The company has successfully achieved mass shipments of its new generation small-sized, high-power 5GMMMB products to overseas Android clients, receiving customer recognition [2] - In Q1 2025, the company's gross profit improved significantly due to product structure optimization and a decrease in procurement costs, with expectations for further performance enhancement as Phase8L L-PAMiD products ramp up [2] - The Phase8L product has already achieved large-scale production with leading clients, making the company one of the first in China to have this production capability [2] Group 2 - The company has proactively built a domestic supply chain over the years, collaborating with local wafer manufacturers and enhancing supply chain security through diversified channels [2] - The company focuses on the evolution of RF front-end technology, promoting product iterations around 3GPP standards, and has also ventured into Wi-Fi and satellite communication fields [2] - The company is actively exploring market opportunities in emerging industries such as low-altitude economy and robotics, forming specialized teams for technological research [2] Group 3 - The company's core strategy is to expand brand clients by introducing more self-developed projects to drive gross margin recovery [3] - The domestic substitution window is accelerating due to the strategic retreat of overseas manufacturers and tariff policy adjustments, with the Phase8L product's technological breakthroughs enhancing customer loyalty and attracting new clients [3] - The company aims to increase its penetration rate within mainstream brand supply chains through these strategies [3]

本期导读： 高校群体正成为创投行业的一股新力量。 作者丨FOFWEEKLY 本期推荐阅读5分钟 近年来，高校在科技创新链条中的定位发生新变化：除了输送顶尖人才、孵化前沿技术外，越来越 多高校开始突破传统边界，积极投身于创投行业。 天津大学、复旦大学、上海交通大学、中南大学、香港科技大学、南方科技大学等诸多高校通过 "设立基金或母基金" 的方式躬身入局，逐渐形成了创投领域的新力量。 日前，又一所211高校强势入场了。 近两年，机器人、人工智能、半导体等行业热潮涌动， 创投市场掀起新一轮科技投资风暴。而在 这场科技与资本的盛宴中，手握源头技术的高校正从幕后走向台前，纷纷加入战局，成为行业发展 不可忽视的新兴力量。 高校相继入局 2025年以来，随着AI、机器人、低空经济等赛道的持续火热，行业的投资热情进一步被调动，而 各地对未来产业的布局也持续深入。 这次是武汉理工大学。 211高校闯入VC圈 VC圈高校阵容又添新军。 近日，武汉理工大学举行首届科技成果投融资峰会。会上，举行了武汉理工大学国家大学科技园优 化重塑启动仪式。发起设立武理科创基金，基金由武汉理工与长江产业投资集团联合发起设立， 首期募资规模为10亿元 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 Source：moneyDJ ，谢谢 。 FOPLP(面板级扇出型封装)成为新的先进封装竞逐市场，封测大厂力成(6239)执行长谢永达昨(29) 日于法说会上透露，公司正与一家美国客户合作验证中，即日前宣布投产晶圆代工龙头2奈米制程 的公司(这意指超微AMD)。尽管公司未公布合作细节，供应链则透露，公司技术将应用在PC或游 戏机芯片，最快2027年可以看到产品上市。 国内封测厂多年来一直在推行FOPLP案，至今约莫9年，但一直没有看到有太多终端应用落地，主 要是因为起初因良率问题而迟迟未见显著成效，客户端态度也相对观望。再加上，早前应用层次停 留在RF IC、PMIC等相对成熟领域，如今在台积电(2330)登高一呼下，封测厂也加速转往消费性 电子、AI等更多元的应用场域。 谢永达表示，力成的FOPLP 技术自2016 年量产以来，当时技术相对简单，经过历年来的持续优 化，目前朝异质整合发展，规格主要采510X515 毫米。他也强调，目前全球真正具大规模FOPLP 生产能力的业者仅有公司一家，良率也大幅超出预期，现正与与一家美国客户合作验证中。 关 注 ...

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 AI竞赛激烈，小米也加入战局！ 4月30日，小米推出专注推理能力的开源大模型MiMo，仅用7B参数规模在数学推理和代码竞赛测评中超越OpenAI的闭源模型 o1-mini以及阿里32B规模的QwQ。 据小米介绍，Xiaomi MiMo诞生之初探索的核心问题就是激发模型推理潜能，这款模型联动预训练到后训练，全面提升推理能 力。 国内外AI竞争日趋白热化，本周阿里前脚发布Qwen 3，马斯克后脚就官宣Grok 3.5。而据此前媒体报道，小米正在建设万卡GPU 集群，并引入顶尖AI人才，显示出对大模型领域的全面投入。 性能突破：小参数量实现大能力 Xiaomi MiMo这款模型最引人注目之处在于，在数学推理（AIME 24-25）和 代码竞赛（LiveCodeBench v5）公开测评集上， MiMo 仅用 7B 的参数规模，超越了 OpenAI 的闭源推理模型 o1-mini 和阿里 Qwen 更大规模的开源推理模型 QwQ-32B- Preview。 更值得注意的是，在相同强化学习(RL)训练数据条件下，MiMo-7B在数学和代码领域展现出的强化学习潜力 ...

来源： 硅芯科技官微 硅芯科技自研3Sheng Integration Platform，实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等，集成"系统-测试-综合-仿真-验证"五引擎合一，具有统一数据底 座，支持三维异构集成系统的敏捷开发与可定制化的协同设计优化，并在多个功能和性能上具有 独创性。 直面需求 3月在HiPi联盟大会，已听到 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构，却在仿真和验证以后 仍然发现诸多问题！于是 "缺乏架构设计，急需设计协同和优化，设计要素全线左移" 已经成 为了业界对三维芯片堆叠设计的共识！ 要做一个设计，初心始于SoC的迭代，如果没有架构设计，严格说是能融合支持IP划分、工艺 选择、版图探索、前仿真、互连检查与优化、基于电源和热的物理实现、跨Die物理签核的多 点协同设计的架构设计和早期分析工具，那这样的设计通常会南辕北辙。 在近期硅芯科技的行业分享讲座上，创始人赵毅博士 基于业界3D IC设计遇到的问题 做了又 一轮的总结。其中提到：顶层架构对于应用场景、有效探索 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 添加文末微信，加 先进封装 群 2025年4月29日，由 势银（TrendBank）与甬江实验室联合 主办 ，珠海硅芯科技有限公司专场冠名 、宁波电子行业协会支持、 势银芯链承办 的 " 2025势银异质异构集成封装产业大会" 在 浙江宁波 · 甬江实验室 召开。 本次会议以" 异质异构集成开启芯片后摩尔时代 "为主题共同探讨先进封装产业发展路径， 抢抓新一代芯片发展战略机遇， 促进供应链上下游企业、 科研单位、投融 资机构之间的交流与合作，为帮助产业上下游产业协同 发展提供解决方案！ 嘉宾签到&展商风采 ▼ 左右滑动查看更多 ▼ 4月29日上午， 2025势银异质异构集成封装产业大会 正式开幕 ， 势银（TrendBank）半导体业务负责人 高占占 担任大会主持人 。 首先进行甬江实验室 功能材料与器件异构集成研究中心成立仪式 ，由甬江实验室副主任 乌学东、甬江实验室异构集成研究中心主任 万青、浙江 厚积科技有 限公司 总经理 殷庆元、 ...

Group 1 - The semiconductor industry ETF (159582) has seen a recent increase of 0.07%, with a latest price of 1.43 yuan, and a turnover rate of 3.05% during trading, amounting to 471.41 million yuan [3] - The semiconductor industry ETF has achieved a 41.19% increase in net value over the past year, ranking 109 out of 2765 in the index stock fund category, placing it in the top 3.94% [4] - The top ten weighted stocks in the semiconductor industry index account for 75.31% of the total index, with notable companies including Northern Huachuang (002371) and SMIC (688981) [5] Group 2 - Domestic semiconductor equipment manufacturers are expected to gradually replace foreign counterparts through technological advancements and market expansion, as the domestic demand is driven by the expansion of local wafer fabs like SMIC [3] - The semiconductor industry ETF has the lowest management fee rate of 0.50% and a custody fee rate of 0.10% among comparable funds, indicating cost efficiency for investors [4] - The ETF has a tracking error of 0.056% over the past year, which is the highest tracking precision among comparable funds [4]

Group 1 - The semiconductor materials and equipment theme index rose by 0.06% as of April 29, 2025, with notable increases in stocks such as Anji Technology (up 4.96%) and Shenkong Co. (up 4.54%) [1] - The semiconductor materials ETF (562590) has shown a 5.14% increase over the past three months, indicating a positive trend in the sector [1] - The trading activity of the semiconductor materials ETF was active, with an intraday turnover of 0.43% and a significant growth in scale of 267 million yuan over the past year [1] Group 2 - The "2024 Science and Technology Innovation Board Semiconductor Equipment Special Performance Briefing" was held on April 28, 2025, marking the first performance briefing of the "Science and Technology Innovation Hot Industry Week" [2] - Over 110 semiconductor companies have been listed on the Science and Technology Innovation Board, accounting for 60% of the total semiconductor companies in A-shares, showcasing a complete and collaborative development pattern [2] - Several companies at the performance briefing indicated efforts to increase the localization rate of core components, with a recovery in downstream demand providing growth opportunities [2] - The semiconductor materials ETF and its linked funds closely track the index, with semiconductor equipment (55.8%) and semiconductor materials (21.3%) making up over 77% of the index weight, focusing on key areas of domestic substitution [2]

Group 1 - The semiconductor materials ETF (562590) experienced a slight decline of 0.12% as of April 29, 2025, with component stocks showing mixed performance, led by Anji Technology with a rise of 4.98% [3] - The semiconductor materials ETF has seen a cumulative increase of 5.14% over the past three months, indicating a positive trend in the longer term [3] - The trading volume for the semiconductor materials ETF was 129.89 million yuan, with a turnover rate of 0.42% [3] Group 2 - As of April 28, 2025, the semiconductor materials ETF's net value increased by 26.75% over the past year, ranking 338 out of 2765 index equity funds, placing it in the top 12.22% [4] - The ETF has recorded a maximum monthly return of 20.35% since its inception, with an average monthly return of 10.90% and a historical one-year profit probability of 97.06% [4] - North Huachuang reported a revenue of 8.206 billion yuan for Q1 2025, a year-on-year increase of 37.9%, and a net profit of 1.57 billion yuan, up 38.8%, marking the best performance for the same period historically [4] Group 3 - The top ten weighted stocks in the semiconductor materials index account for 60.82% of the index, with North Huachuang holding the highest weight at 16.44% [5] - The performance of the top ten stocks shows a mix of slight declines and gains, with TCL Technology being the only stock with a significant increase of 2.48% [7]

Core Insights - A breakthrough research on next-generation AI storage devices has been published by a team from Pohang University of Science and Technology in the latest issue of Nature Communications [1] - The study reveals the working mechanism of electrochemical random access memory (ECRAM), which is expected to significantly enhance the AI performance of devices such as smartphones, tablets, and laptops [1] - This advancement marks an important step towards high-performance and low-energy consumption in AI hardware [1]