Group 1 - Tesla is nearing the completion of the AI5 chip and has begun development on the AI6 chip, with a goal to release a new AI chip every 12 months, expecting to surpass the total production of all other AI chips combined [2] - The average capacity utilization rate of major global wafer fabs is projected to be around 86% in Q3 2025, reflecting a year-on-year increase of approximately 6 percentage points, with optimistic recovery trends expected to reach over 90% by 2026 [2] - Media reports indicate that MediaTek and other companies are considering integrating Intel's EMIB advanced packaging into their ASIC chip designs due to ongoing tight supply of TSMC's CoWoS advanced packaging [2] - The first large-scale dedicated optical quantum computer manufacturing plant in China has been established in Shenzhen, marking a significant step from experimental validation to engineering mass production, with plans for annual production capacity of several dozen dedicated optical quantum computers [2]