存储材料：Opex 业务直接受益下游高景气及承接 Capex 后周期产能释放 20260107 摘要 长鑫存储四季度单季度净利润接近 40 亿元，预计 2026 年全年利润规 模可达三四百亿元，并计划上市募资超过 300 亿元人民币，显示出强劲 的增长势头。 长鑫和长存在全球存储市场份额虽不足 5%，但正通过高资本开支周期 大幅扩产，目标是完成国产替代并显著提升全球市占率，有望在五年内 成为全球领先者。 中国大陆已是全球第二大半导体市场，随着新产能释放，市场份额将进 一步提升。硅片是晶圆制造材料中占比最大的部分，国内厂商包括沪硅 产业等，而光刻胶和掩模板国产化率较低，存在替代空间。 建议重点关注安集科技（CMP 抛光液，存储领域敞口高，预计 2025 年 利润 8 亿元）、鼎龙股份（CMP 抛光液）、广钢气体（电子大宗气）和 江丰电子（靶材）等半导体材料公司。 存储周期对半导体材料公司有显著影响，短期内下游原厂价格上涨将提 升稼动率并加速新产能释放，增加原材料需求；长期来看，新产能扩张 将带来耗材需求的持续增长。 Q&A 2026 年半导体设备和材料市场的整体趋势如何？ 半导体材料行业的现状及重点关注领域有哪 ...

证券日报网讯12月4日，艾森股份在互动平台回答投资者提问时表示，过往期间公司研发主要投入方向 包括先进封装及晶圆制造的电镀液和光刻胶等产品，前期研发投入产品已陆续通过验证或实现量产。 ...

Core Viewpoint - The company, Aisen Co., has a current production capacity of 16,000 tons, primarily supporting the large-scale supply of core products such as photoresists and electroplating solutions [1] Production Capacity - The existing capacity of 16,000 tons is aimed at meeting the demands for key products [1] - The company plans to optimize its production layout based on customer collaboration rhythms, market demand forecasts, and supply chain efficiency [1]

Core Viewpoint - The company, Aisen Co., stated that its core products, including electroplating solutions and photoresists, can serve advanced packaging technologies such as HBM and CoWoS, indicating a focus on high-end packaging market expansion through innovation and quality service [1] Group 1 - The company is actively monitoring market demand to adapt its offerings [1] - The company aims to enhance its market share in the high-end packaging sector [1] - The company emphasizes the importance of technological innovation and quality service in its strategy [1]

Core Viewpoint - The company, Aisen Co., is actively addressing market competition in the semiconductor materials sector, which includes products like electroplating solutions and photoresists, by focusing on technological innovation, product optimization, market expansion, and deepening customer cooperation [1] Group 1 - The variety of semiconductor materials is extensive, and the domestic production rate is currently low [1] - The company aims to maintain stable business growth and a leading market position through various strategic initiatives [1]

Core Viewpoint - Shanghai Xinyang Semiconductor Materials Co., Ltd. held a specific investor survey with 35 institutions, discussing the company's business performance and future plans in the semiconductor industry [1] Company Business Overview - Shanghai Xinyang focuses on five core business areas: electroplating, cleaning, photolithography, grinding, and etching, providing key process materials and supporting equipment for integrated circuit manufacturing and advanced packaging [1] - In the first half of 2025, the semiconductor industry revenue reached 709 million yuan, a year-on-year increase of 53.12%, supplying over 120 semiconductor packaging companies and more than 100 chip manufacturers [1] Capacity Planning - The current capacity at the Songjiang headquarters is 19,000 tons per year; the Hefei Xinyang Phase I expansion will increase capacity to 43,500 tons per year [1] - New projects include a 50,000 tons per year capacity at the Songjiang headquarters and a 30,500 tons per year project in the Shanghai Chemical Industry Zone, both progressing normally [1] Photolithography Business Progress - The company has established a complete R&D and production platform for photolithography materials, with several products already industrialized and achieving advanced optical data metrics [1] - KrF photolithography products are being sold in bulk, and ArF immersion photolithography products have received orders [1] Grinding Liquid Product Development - Series products such as STI slurry, Poly slurry, and W slurry have completed client testing and are entering mass production, with rapid sales growth [1] - The company aims to target domestic market gaps and meet customer technology iteration needs [1] Financial Performance - The gross margin for the semiconductor business declined due to increased production costs from the Hefei Xinyang project and depreciation expenses [1] - The coating segment's revenue was 187 million yuan in the first half of 2025, a year-on-year decrease of 5.29% due to slow recovery in the construction industry [1] Revenue Targets - The company achieved a total revenue of 897 million yuan in the first half of 2025, with semiconductor revenue at 709 million yuan [1] - The company aims for semiconductor revenue of no less than 1.3 billion yuan and total revenue of no less than 1.7 billion yuan for the full year 2025 [1] Product Advantages and Industry Position - With over 20 years of experience, the company covers all technology nodes from 90nm to 14nm for chip copper interconnect processes, making it a leading domestic enterprise [1] - As of the first half of 2025, the company has become the baseline for 56 12-inch and 23 8-inch integrated circuit production lines, accounting for over 70% and 60% respectively [1]

Core Viewpoint - As of August 25, 2025, Aisen Co., Ltd. experienced a stock price decline of 4.44%, closing at 50.15 yuan, with a trading volume of 67,323 hands and a transaction amount of 344 million yuan [1] Group 1: Company Overview - Aisen Co., Ltd. is a leading supplier in the domestic semiconductor packaging sector and plays a significant role in advanced wafer processing [1] - The company possesses Turnkey capabilities in the electroplating solution field, covering wafer manufacturing from 5nm to 14nm [1] - In the advanced packaging photoresist sector, Aisen is a key supplier and the only domestic company to break the monopoly of Japan's JSR [1] Group 2: Recent Developments - On August 25, the company announced that it received multiple institutional research visits, including from Invesco Great Wall Fund, on August 22 [1] - During the research visit, the management highlighted the operational performance for the first half of 2025, focusing on its technological advantages and market position in semiconductor packaging and wafer manufacturing [1] - Over the past year, Aisen has hosted 154 research visits from 126 institutions [1]

Investment Rating - The report maintains an "Accumulate" rating for the electronic industry, indicating a positive outlook for the sector over the next six months [1]. Core Insights - The advanced packaging sector is crucial for the development of domestic computing power, with significant growth expected due to rising demand for advanced packaging technologies such as CoWoS and Fan-out [4]. - The report highlights the strong performance of ASMPT in Q2, driven by robust demand in China, with a 50% year-on-year increase in TCB orders, indicating a recovery in domestic advanced packaging demand [4]. - The report suggests that domestic computing power is likely to replicate the rapid growth seen in overseas markets, particularly in AI applications, positioning advanced packaging as a foundational element for this growth [4]. Summary by Sections Industry Trends - The report notes a projected increase in the electronic industry, with a focus on advanced packaging technologies that are essential for GPU, CPU, and base station applications [4]. - The importance of domestic advanced packaging supply is emphasized, especially in light of constraints in Taiwan's advanced packaging capacity [4]. Investment Recommendations - The report recommends focusing on leading companies in advanced packaging, including Shenghe Jingwei, Changdian Technology, Tongfu Microelectronics, and Yongxi Electronics, as well as materials and equipment suppliers like Qiangli New Materials and Jingzhida [4].

Core Insights - The semiconductor electroplating copper industry is experiencing rapid growth driven by strong demand from emerging technologies such as AI, 5G, and HPC, with the market expected to reach 5.2 billion yuan in 2024 and exceed 9.7 billion yuan by 2028, reflecting a compound annual growth rate (CAGR) of 16.8% [1][12][10] - Domestic companies have made significant breakthroughs in key technologies, accelerating the process of domestic substitution, with notable advancements in electroplating solutions and equipment [1][16][18] - The industry is focusing on three main directions: technological autonomy, green manufacturing, and collaborative innovation across the industrial chain [1][20] Industry Overview - Semiconductor electroplating copper involves the electrochemical deposition of copper layers on semiconductor wafers, replacing traditional aluminum interconnects due to its high conductivity and low resistance [2][4] - The market structure shows that electroplating solutions dominate with a 65% share, with advanced packaging and wafer manufacturing being the primary growth engines [1][14] Market Dynamics - The advanced packaging sector is rapidly growing, with the market size increasing from 35.13 billion yuan in 2020 to an expected 110 billion yuan by 2025, driven by AI and HPC demands [10][12] - The industry is characterized by a dual structure where foreign companies dominate the high-end market while domestic firms focus on differentiated breakthroughs [18][20] Technological Developments - Significant technological advancements include the development of a "deposition rate reversal" patent by Nantong Saike, which achieves void-free filling in TSV applications, and the introduction of the first domestic 12-inch TSV electroplating equipment by Northern Huachuang [16][18] - The industry is also seeing a shift towards green manufacturing processes, with a focus on cyanide-free technologies and intelligent control systems to enhance production efficiency and product quality [22][21] Competitive Landscape - The competitive landscape is marked by international giants controlling over 75% of the high-end electroplating liquid and additive market, particularly in the sub-5nm advanced process area [18][20] - Domestic companies like Aisen and Shanghai Xinyang are making strides in the advanced packaging electroplating copper base liquid and achieving certifications for 28nm Damascus electroplating solutions [18][19] Future Trends - The industry is expected to continue its trajectory of high-end technology breakthroughs and domestic substitution, with a focus on green upgrades and application innovations [20][21] - The market for TSV electroplating solutions is projected to reach 5 billion yuan by 2028, with a CAGR of 18.92%, indicating strong growth potential [23][10]

Core Viewpoint - The demand for electroplating solutions in China is continuously growing, driven by rapid developments in downstream applications such as electronics, automotive, and aerospace, particularly in high-end sectors like semiconductor packaging and PCB manufacturing [1][12]. Industry Overview - Electroplating solutions are composed of metal ions, electrolytes, and additives, essential for the electroplating process, directly affecting the quality and properties of the plated layer [3][4]. Industry Development History - The Chinese electroplating solution industry has evolved through four stages: initial establishment in the 1950s-1970s, rapid development from the 1980s-2000s, maturity and transformation in the 2000s-2010s, and modernization and upgrading from the 2010s to present [4][5]. Market Size - The market size for electroplating solutions in China is projected to reach 3.779 billion yuan in 2024, with a year-on-year growth of 9.16%, and is expected to grow to 4.611 billion yuan by 2026, with a growth rate of 10.79% [12]. Key Enterprises - The competitive landscape of the electroplating solution industry is characterized by both diversification and concentration, with leading companies like Shanghai Xinyang and Jiangsu Aisen dominating the high-end market through strong R&D capabilities and technological advancements [14][16]. Industry Development Trends 1. **Sustained Market Demand Growth**: The demand for high-performance electroplating solutions is expected to increase significantly, particularly in advanced fields such as semiconductor manufacturing and new energy vehicles [20]. 2. **Accelerated Technological Progress and Domestic Substitution**: Domestic companies are making significant advancements in high-end electroplating solutions, reducing reliance on imports and enhancing competitiveness in the global market [21]. 3. **Stricter Environmental Policies**: The industry is moving towards greener and more sustainable practices due to increasing environmental regulations, with a focus on developing eco-friendly electroplating solutions and waste treatment technologies [22].