风险提示：股市有风险，投资需谨慎。 艾森股份是国内半导体封装领域的主力供应商，同时也是晶圆先进制程的重要参与者。公司在电镀液领 域具备Turnkey能力，产品覆盖5-14nm晶圆制造。在先进封装光刻胶领域，公司处于主力供应商地位， 是唯一打破日本JSR垄断的国内供应商。 8月25日公司发布公告称，8月22日接待了景顺长城基金等多家机构调研。调研中公司管理层介绍了2025 年半年度经营情况，重点介绍了在半导体封装和晶圆制造领域的技术优势和市场地位。近一年来，公司 已累计接待126家机构154次调研。 截至2025年8月25日收盘，艾森股份股价报50.15元，较前一交易日下跌2.33元，跌幅4.44%。当日成交 量为67323手，成交金额达3.44亿元。 ...

Investment Rating - The report maintains an "Accumulate" rating for the electronic industry, indicating a positive outlook for the sector over the next six months [1]. Core Insights - The advanced packaging sector is crucial for the development of domestic computing power, with significant growth expected due to rising demand for advanced packaging technologies such as CoWoS and Fan-out [4]. - The report highlights the strong performance of ASMPT in Q2, driven by robust demand in China, with a 50% year-on-year increase in TCB orders, indicating a recovery in domestic advanced packaging demand [4]. - The report suggests that domestic computing power is likely to replicate the rapid growth seen in overseas markets, particularly in AI applications, positioning advanced packaging as a foundational element for this growth [4]. Summary by Sections Industry Trends - The report notes a projected increase in the electronic industry, with a focus on advanced packaging technologies that are essential for GPU, CPU, and base station applications [4]. - The importance of domestic advanced packaging supply is emphasized, especially in light of constraints in Taiwan's advanced packaging capacity [4]. Investment Recommendations - The report recommends focusing on leading companies in advanced packaging, including Shenghe Jingwei, Changdian Technology, Tongfu Microelectronics, and Yongxi Electronics, as well as materials and equipment suppliers like Qiangli New Materials and Jingzhida [4].

Core Viewpoint - The demand for electroplating solutions in China is continuously growing, driven by rapid developments in downstream applications such as electronics, automotive, and aerospace, particularly in high-end sectors like semiconductor packaging and PCB manufacturing [1][12]. Industry Overview - Electroplating solutions are composed of metal ions, electrolytes, and additives, essential for the electroplating process, directly affecting the quality and properties of the plated layer [3][4]. Industry Development History - The Chinese electroplating solution industry has evolved through four stages: initial establishment in the 1950s-1970s, rapid development from the 1980s-2000s, maturity and transformation in the 2000s-2010s, and modernization and upgrading from the 2010s to present [4][5]. Market Size - The market size for electroplating solutions in China is projected to reach 3.779 billion yuan in 2024, with a year-on-year growth of 9.16%, and is expected to grow to 4.611 billion yuan by 2026, with a growth rate of 10.79% [12]. Key Enterprises - The competitive landscape of the electroplating solution industry is characterized by both diversification and concentration, with leading companies like Shanghai Xinyang and Jiangsu Aisen dominating the high-end market through strong R&D capabilities and technological advancements [14][16]. Industry Development Trends 1. **Sustained Market Demand Growth**: The demand for high-performance electroplating solutions is expected to increase significantly, particularly in advanced fields such as semiconductor manufacturing and new energy vehicles [20]. 2. **Accelerated Technological Progress and Domestic Substitution**: Domestic companies are making significant advancements in high-end electroplating solutions, reducing reliance on imports and enhancing competitiveness in the global market [21]. 3. **Stricter Environmental Policies**: The industry is moving towards greener and more sustainable practices due to increasing environmental regulations, with a focus on developing eco-friendly electroplating solutions and waste treatment technologies [22].

Investment Rating - The investment rating for the semiconductor industry is "Positive" (maintained) [1] Core Insights - The semiconductor industry is expected to see a recovery in downstream demand, leading to improved market conditions [3] - The domestic high-end semiconductor packaging and testing leader, Shenghe Jingwei, has entered the guidance acceptance stage for its IPO, focusing on mid-stage silicon wafer manufacturing and advanced packaging [3] - The global semiconductor packaging materials market is estimated to be approximately $21.98 billion in 2023, with a domestic localization rate of about 15% for semiconductor materials and less than 30% for packaging materials [4] Summary by Sections - **Shenghe Jingwei's IPO**: Shenghe Jingwei's IPO guidance status has changed to acceptance, with its 12-inch high-density bumping processing and packaging capabilities reaching world-class levels. The company is also developing advanced three-dimensional system integration chip business [3] - **Market Size and Localization**: The global semiconductor packaging materials market is valued at $21.98 billion, with significant portions allocated to various materials. The localization rate for semiconductor materials in China is around 15%, and for packaging materials, it is less than 30% [4] - **Key Materials and Beneficiaries**: Various materials critical to advanced packaging processes are identified, including electroplating solutions, PSPI, photoresists, polishing materials, masks, and target materials, with specific companies highlighted as beneficiaries [6]

Core Viewpoint - The company is implementing a differentiated and high-end development strategy focused on electroplating and photolithography, with significant progress in product testing and upcoming mass production, which is expected to drive continuous growth in performance [1][3]. Electroplating - The company has established a competitive product matrix for electroplating solutions, achieving full category coverage in traditional and advanced packaging fields, and has made breakthroughs in high-end markets [1]. - In the advanced packaging sector, multiple products for electroplating solutions and additives have entered mass production, widely used in Bumping and RDL processes [1]. - The high-purity copper electroplating solution has achieved stable supply to Huada Technology and Tongfu Microelectronics, while the tin-silver electroplating additive has passed stringent certification from Changdian Technology and received small batch orders [1]. - The copper electroplating additive for advanced packaging is currently undergoing batch stability verification, and the 28nm Damascus copper interconnect process copper plating additive is in the final stages of product certification [1]. - The ultra-high purity cobalt-based solution and additives for 5-14nm advanced processes are progressing well in client testing, and the cleaning solution for copper processes in wafer manufacturing has entered the mass production scaling phase [1]. Photolithography - The advanced packaging negative photoresist has covered multiple mainstream packaging factories, with market penetration continuously increasing, and the company plans to enrich product models for full category coverage [2]. - The self-developed positive PSPI photoresist has successfully obtained the first domestic order from a mainstream wafer factory, breaking the long-standing technology monopoly of the US and Japan, and is expected to gradually achieve mass shipments by 2025 [2]. - The company is also developing negative PSPI and high-sensitivity chemical amplification PSPI, with plans to continue advancing product certification in advanced packaging and wafer manufacturers by 2025 [2]. - The wafer ICA chemical amplification photoresist is undergoing successful client validation testing, with some indicators outperforming international benchmark products [2]. - The OLED high-sensitivity photoresist is in client testing for OLED backplane array photolithography processes, and the company has reached a consensus with BOE on future cooperation and strategic planning [2]. - The high-thickness KrF photoresist is currently in the laboratory research phase, aiming to fill domestic gaps [2]. Market Expansion - The company has acquired INOFINE to expand into the Southeast Asian market, further solidifying its leading position in wet electronic chemicals [3]. - INOFINE, established in 2009, is one of the early entrants in the semiconductor wet electronic chemicals business in Malaysia and holds a certain influence in the local market [3]. - From 2025, INOFINE will be included in the company's consolidated financial statements [3]. Financial Projections - The company expects revenues of 600 million, 727 million, and 913 million yuan for the years 2025, 2026, and 2027, respectively, with net profits attributable to the parent company projected at 50 million, 71 million, and 103 million yuan for the same years [3].

Summary of Conference Call for Aisen Co., Ltd. Industry Overview - The focus for investment this year (2025) is on self-sufficiency, particularly in the equipment and materials sectors, with domestic companies actively replacing foreign products [2][3] - The advanced packaging sector is trending towards higher integration and heterogeneous integration, with 2.5D and 3D packaging becoming key directions for GPU and AI chip development [2][4] Company Insights - Aisen Co., Ltd. has launched mass production of its positive DNQ series photoresist products, with a high market share expectation, while the negative acrylic series holds about a low double-digit percentage [2][6] - The company is conducting chemical amplification RDL photoresist tests, with client validation expected in the second half of the year, aiming for a comprehensive product layout [2][6] - Aisen's positive DNQ and negative acrylic series have gained market share in the domestic advanced packaging sector, which primarily uses JSR's post-film revival photoresist [2][7] Market Dynamics - The HBM memory market is currently dominated by international giants, but domestic companies are gradually entering this space [2][7] - Due to international political factors, the supply of HPV3 and subsequent products is limited, necessitating independent development of related technologies in China [2][8] - The TSV (Through-Silicon Via) technology is crucial in HBM structures, and Aisen is developing TSV photoresist and high-speed copper plating products [2][9] Product Development and Strategy - Aisen is focusing on developing new PSPI materials to meet the diverse needs of advanced packaging, with plans to become a leading supplier in this area within two to three years [2][4][14] - The company has established a strategic partnership with Shenghe Jingwei, focusing on electroplating and photoresist products, with significant sales growth expected [2][26] - Aisen's business performance in the advanced packaging sector is projected to grow rapidly, with a target of achieving significant sales in the wafer and advanced packaging fields [2][14][31] Challenges and Opportunities - The ongoing trade tariff war has increased material procurement costs for several packaging and testing companies, prompting a shift towards domestic materials [2][33] - The domestic PSPI market is still in its infancy, with a market size of approximately 1.5 billion RMB, and Aisen is working to increase its market share through product development and client validation [2][17][22] - The company is addressing supply chain challenges by developing multiple alternative solutions to mitigate reliance on single products [2][19] Future Outlook - Aisen anticipates structural growth driven by increasing demand from domestic clients, particularly in the HBM sector, and plans to expand its product offerings to meet market needs [2][28] - The company aims to enhance its domestic replacement rate and market share through improved risk control and technology advancements [2][25]

Investment Rating - The report maintains an "A" rating for the new materials industry, indicating a positive outlook for the sector [1]. Core Insights - The chemical raw materials sector is currently experiencing a bottoming phase, with a slowdown in capacity expansion and a potential alleviation of intense competition and price wars. The overall profit margin for the industry is expected to remain between 3% and 5% in 2024, which is at a historical low. However, with the central economic work conference emphasizing the need to address "involution" competition, there is potential for improved industry order and profit recovery [1][34]. Summary by Sections 1. Market Performance and Valuation - The new materials index has shown significant volatility, underperforming the Shanghai Composite Index by 10.6% as of December 27, 2024. The index's performance was particularly weak in the first three quarters of 2024 but saw a recovery in the fourth quarter due to favorable policies [15][20]. 2. Focus Areas 2.1 Supply and Demand Dynamics - The vitamin sector is expected to maintain high prices for Vitamin E due to limited supply recovery from BASF's production facilities, which are aging and unable to meet demand. The report suggests monitoring companies like New Hope Liuhe and Zhejiang Medicine [42][59]. - The renewable energy materials sector is projected to benefit from a stable increase in wind power demand, with a significant rise in installed capacity and a self-regulatory agreement among wind turbine manufacturers to mitigate price competition. Companies like Times New Material and Mega Chip Color are highlighted for investment [44][60]. 2.2 Emerging Industry Opportunities - The bio-manufacturing sector is positioned for growth, particularly in synthetic biology and sustainable aviation fuel (SAF). The report emphasizes the importance of product selection and platform capabilities for companies in this space, recommending firms like Huaheng Biological and Meihua Biological [48][50]. - The special coatings market is expected to grow due to increasing military expenditures and the need for stealth materials. Companies such as Huaqin Technology and Jiachih Technology are noted for their potential in this area [52][61]. - The semiconductor materials sector is anticipated to benefit from the recovery of consumer electronics and AI applications, with a focus on domestic production capabilities. Companies like Stik and Aisen are recommended for investment [56][61]. - The humanoid robotics market is projected to drive demand for PEEK materials, with domestic companies expected to gain market share due to cost advantages. The report suggests monitoring firms like Zhongxin Fluorine Materials and Zhongyan Co. [58][61].