Core Viewpoint - Shanghai Xinyang Semiconductor Materials Co., Ltd. held a specific investor survey with 35 institutions, discussing the company's business performance and future plans in the semiconductor industry [1] Company Business Overview - Shanghai Xinyang focuses on five core business areas: electroplating, cleaning, photolithography, grinding, and etching, providing key process materials and supporting equipment for integrated circuit manufacturing and advanced packaging [1] - In the first half of 2025, the semiconductor industry revenue reached 709 million yuan, a year-on-year increase of 53.12%, supplying over 120 semiconductor packaging companies and more than 100 chip manufacturers [1] Capacity Planning - The current capacity at the Songjiang headquarters is 19,000 tons per year; the Hefei Xinyang Phase I expansion will increase capacity to 43,500 tons per year [1] - New projects include a 50,000 tons per year capacity at the Songjiang headquarters and a 30,500 tons per year project in the Shanghai Chemical Industry Zone, both progressing normally [1] Photolithography Business Progress - The company has established a complete R&D and production platform for photolithography materials, with several products already industrialized and achieving advanced optical data metrics [1] - KrF photolithography products are being sold in bulk, and ArF immersion photolithography products have received orders [1] Grinding Liquid Product Development - Series products such as STI slurry, Poly slurry, and W slurry have completed client testing and are entering mass production, with rapid sales growth [1] - The company aims to target domestic market gaps and meet customer technology iteration needs [1] Financial Performance - The gross margin for the semiconductor business declined due to increased production costs from the Hefei Xinyang project and depreciation expenses [1] - The coating segment's revenue was 187 million yuan in the first half of 2025, a year-on-year decrease of 5.29% due to slow recovery in the construction industry [1] Revenue Targets - The company achieved a total revenue of 897 million yuan in the first half of 2025, with semiconductor revenue at 709 million yuan [1] - The company aims for semiconductor revenue of no less than 1.3 billion yuan and total revenue of no less than 1.7 billion yuan for the full year 2025 [1] Product Advantages and Industry Position - With over 20 years of experience, the company covers all technology nodes from 90nm to 14nm for chip copper interconnect processes, making it a leading domestic enterprise [1] - As of the first half of 2025, the company has become the baseline for 56 12-inch and 23 8-inch integrated circuit production lines, accounting for over 70% and 60% respectively [1]

Core Viewpoint - As of August 25, 2025, Aisen Co., Ltd. experienced a stock price decline of 4.44%, closing at 50.15 yuan, with a trading volume of 67,323 hands and a transaction amount of 344 million yuan [1] Group 1: Company Overview - Aisen Co., Ltd. is a leading supplier in the domestic semiconductor packaging sector and plays a significant role in advanced wafer processing [1] - The company possesses Turnkey capabilities in the electroplating solution field, covering wafer manufacturing from 5nm to 14nm [1] - In the advanced packaging photoresist sector, Aisen is a key supplier and the only domestic company to break the monopoly of Japan's JSR [1] Group 2: Recent Developments - On August 25, the company announced that it received multiple institutional research visits, including from Invesco Great Wall Fund, on August 22 [1] - During the research visit, the management highlighted the operational performance for the first half of 2025, focusing on its technological advantages and market position in semiconductor packaging and wafer manufacturing [1] - Over the past year, Aisen has hosted 154 research visits from 126 institutions [1]

Investment Rating - The report maintains an "Accumulate" rating for the electronic industry, indicating a positive outlook for the sector over the next six months [1]. Core Insights - The advanced packaging sector is crucial for the development of domestic computing power, with significant growth expected due to rising demand for advanced packaging technologies such as CoWoS and Fan-out [4]. - The report highlights the strong performance of ASMPT in Q2, driven by robust demand in China, with a 50% year-on-year increase in TCB orders, indicating a recovery in domestic advanced packaging demand [4]. - The report suggests that domestic computing power is likely to replicate the rapid growth seen in overseas markets, particularly in AI applications, positioning advanced packaging as a foundational element for this growth [4]. Summary by Sections Industry Trends - The report notes a projected increase in the electronic industry, with a focus on advanced packaging technologies that are essential for GPU, CPU, and base station applications [4]. - The importance of domestic advanced packaging supply is emphasized, especially in light of constraints in Taiwan's advanced packaging capacity [4]. Investment Recommendations - The report recommends focusing on leading companies in advanced packaging, including Shenghe Jingwei, Changdian Technology, Tongfu Microelectronics, and Yongxi Electronics, as well as materials and equipment suppliers like Qiangli New Materials and Jingzhida [4].

Core Insights - The semiconductor electroplating copper industry is experiencing rapid growth driven by strong demand from emerging technologies such as AI, 5G, and HPC, with the market expected to reach 5.2 billion yuan in 2024 and exceed 9.7 billion yuan by 2028, reflecting a compound annual growth rate (CAGR) of 16.8% [1][12][10] - Domestic companies have made significant breakthroughs in key technologies, accelerating the process of domestic substitution, with notable advancements in electroplating solutions and equipment [1][16][18] - The industry is focusing on three main directions: technological autonomy, green manufacturing, and collaborative innovation across the industrial chain [1][20] Industry Overview - Semiconductor electroplating copper involves the electrochemical deposition of copper layers on semiconductor wafers, replacing traditional aluminum interconnects due to its high conductivity and low resistance [2][4] - The market structure shows that electroplating solutions dominate with a 65% share, with advanced packaging and wafer manufacturing being the primary growth engines [1][14] Market Dynamics - The advanced packaging sector is rapidly growing, with the market size increasing from 35.13 billion yuan in 2020 to an expected 110 billion yuan by 2025, driven by AI and HPC demands [10][12] - The industry is characterized by a dual structure where foreign companies dominate the high-end market while domestic firms focus on differentiated breakthroughs [18][20] Technological Developments - Significant technological advancements include the development of a "deposition rate reversal" patent by Nantong Saike, which achieves void-free filling in TSV applications, and the introduction of the first domestic 12-inch TSV electroplating equipment by Northern Huachuang [16][18] - The industry is also seeing a shift towards green manufacturing processes, with a focus on cyanide-free technologies and intelligent control systems to enhance production efficiency and product quality [22][21] Competitive Landscape - The competitive landscape is marked by international giants controlling over 75% of the high-end electroplating liquid and additive market, particularly in the sub-5nm advanced process area [18][20] - Domestic companies like Aisen and Shanghai Xinyang are making strides in the advanced packaging electroplating copper base liquid and achieving certifications for 28nm Damascus electroplating solutions [18][19] Future Trends - The industry is expected to continue its trajectory of high-end technology breakthroughs and domestic substitution, with a focus on green upgrades and application innovations [20][21] - The market for TSV electroplating solutions is projected to reach 5 billion yuan by 2028, with a CAGR of 18.92%, indicating strong growth potential [23][10]

Core Viewpoint - The demand for electroplating solutions in China is continuously growing, driven by rapid developments in downstream applications such as electronics, automotive, and aerospace, particularly in high-end sectors like semiconductor packaging and PCB manufacturing [1][12]. Industry Overview - Electroplating solutions are composed of metal ions, electrolytes, and additives, essential for the electroplating process, directly affecting the quality and properties of the plated layer [3][4]. Industry Development History - The Chinese electroplating solution industry has evolved through four stages: initial establishment in the 1950s-1970s, rapid development from the 1980s-2000s, maturity and transformation in the 2000s-2010s, and modernization and upgrading from the 2010s to present [4][5]. Market Size - The market size for electroplating solutions in China is projected to reach 3.779 billion yuan in 2024, with a year-on-year growth of 9.16%, and is expected to grow to 4.611 billion yuan by 2026, with a growth rate of 10.79% [12]. Key Enterprises - The competitive landscape of the electroplating solution industry is characterized by both diversification and concentration, with leading companies like Shanghai Xinyang and Jiangsu Aisen dominating the high-end market through strong R&D capabilities and technological advancements [14][16]. Industry Development Trends 1. **Sustained Market Demand Growth**: The demand for high-performance electroplating solutions is expected to increase significantly, particularly in advanced fields such as semiconductor manufacturing and new energy vehicles [20]. 2. **Accelerated Technological Progress and Domestic Substitution**: Domestic companies are making significant advancements in high-end electroplating solutions, reducing reliance on imports and enhancing competitiveness in the global market [21]. 3. **Stricter Environmental Policies**: The industry is moving towards greener and more sustainable practices due to increasing environmental regulations, with a focus on developing eco-friendly electroplating solutions and waste treatment technologies [22].

Investment Rating - The investment rating for the semiconductor industry is "Positive" (maintained) [1] Core Insights - The semiconductor industry is expected to see a recovery in downstream demand, leading to improved market conditions [3] - The domestic high-end semiconductor packaging and testing leader, Shenghe Jingwei, has entered the guidance acceptance stage for its IPO, focusing on mid-stage silicon wafer manufacturing and advanced packaging [3] - The global semiconductor packaging materials market is estimated to be approximately $21.98 billion in 2023, with a domestic localization rate of about 15% for semiconductor materials and less than 30% for packaging materials [4] Summary by Sections - **Shenghe Jingwei's IPO**: Shenghe Jingwei's IPO guidance status has changed to acceptance, with its 12-inch high-density bumping processing and packaging capabilities reaching world-class levels. The company is also developing advanced three-dimensional system integration chip business [3] - **Market Size and Localization**: The global semiconductor packaging materials market is valued at $21.98 billion, with significant portions allocated to various materials. The localization rate for semiconductor materials in China is around 15%, and for packaging materials, it is less than 30% [4] - **Key Materials and Beneficiaries**: Various materials critical to advanced packaging processes are identified, including electroplating solutions, PSPI, photoresists, polishing materials, masks, and target materials, with specific companies highlighted as beneficiaries [6]

Core Viewpoint - The company is implementing a differentiated and high-end development strategy focused on electroplating and photolithography, with significant progress in product testing and upcoming mass production, which is expected to drive continuous growth in performance [1][3]. Electroplating - The company has established a competitive product matrix for electroplating solutions, achieving full category coverage in traditional and advanced packaging fields, and has made breakthroughs in high-end markets [1]. - In the advanced packaging sector, multiple products for electroplating solutions and additives have entered mass production, widely used in Bumping and RDL processes [1]. - The high-purity copper electroplating solution has achieved stable supply to Huada Technology and Tongfu Microelectronics, while the tin-silver electroplating additive has passed stringent certification from Changdian Technology and received small batch orders [1]. - The copper electroplating additive for advanced packaging is currently undergoing batch stability verification, and the 28nm Damascus copper interconnect process copper plating additive is in the final stages of product certification [1]. - The ultra-high purity cobalt-based solution and additives for 5-14nm advanced processes are progressing well in client testing, and the cleaning solution for copper processes in wafer manufacturing has entered the mass production scaling phase [1]. Photolithography - The advanced packaging negative photoresist has covered multiple mainstream packaging factories, with market penetration continuously increasing, and the company plans to enrich product models for full category coverage [2]. - The self-developed positive PSPI photoresist has successfully obtained the first domestic order from a mainstream wafer factory, breaking the long-standing technology monopoly of the US and Japan, and is expected to gradually achieve mass shipments by 2025 [2]. - The company is also developing negative PSPI and high-sensitivity chemical amplification PSPI, with plans to continue advancing product certification in advanced packaging and wafer manufacturers by 2025 [2]. - The wafer ICA chemical amplification photoresist is undergoing successful client validation testing, with some indicators outperforming international benchmark products [2]. - The OLED high-sensitivity photoresist is in client testing for OLED backplane array photolithography processes, and the company has reached a consensus with BOE on future cooperation and strategic planning [2]. - The high-thickness KrF photoresist is currently in the laboratory research phase, aiming to fill domestic gaps [2]. Market Expansion - The company has acquired INOFINE to expand into the Southeast Asian market, further solidifying its leading position in wet electronic chemicals [3]. - INOFINE, established in 2009, is one of the early entrants in the semiconductor wet electronic chemicals business in Malaysia and holds a certain influence in the local market [3]. - From 2025, INOFINE will be included in the company's consolidated financial statements [3]. Financial Projections - The company expects revenues of 600 million, 727 million, and 913 million yuan for the years 2025, 2026, and 2027, respectively, with net profits attributable to the parent company projected at 50 million, 71 million, and 103 million yuan for the same years [3].

Summary of Conference Call for Aisen Co., Ltd. Industry Overview - The focus for investment this year (2025) is on self-sufficiency, particularly in the equipment and materials sectors, with domestic companies actively replacing foreign products [2][3] - The advanced packaging sector is trending towards higher integration and heterogeneous integration, with 2.5D and 3D packaging becoming key directions for GPU and AI chip development [2][4] Company Insights - Aisen Co., Ltd. has launched mass production of its positive DNQ series photoresist products, with a high market share expectation, while the negative acrylic series holds about a low double-digit percentage [2][6] - The company is conducting chemical amplification RDL photoresist tests, with client validation expected in the second half of the year, aiming for a comprehensive product layout [2][6] - Aisen's positive DNQ and negative acrylic series have gained market share in the domestic advanced packaging sector, which primarily uses JSR's post-film revival photoresist [2][7] Market Dynamics - The HBM memory market is currently dominated by international giants, but domestic companies are gradually entering this space [2][7] - Due to international political factors, the supply of HPV3 and subsequent products is limited, necessitating independent development of related technologies in China [2][8] - The TSV (Through-Silicon Via) technology is crucial in HBM structures, and Aisen is developing TSV photoresist and high-speed copper plating products [2][9] Product Development and Strategy - Aisen is focusing on developing new PSPI materials to meet the diverse needs of advanced packaging, with plans to become a leading supplier in this area within two to three years [2][4][14] - The company has established a strategic partnership with Shenghe Jingwei, focusing on electroplating and photoresist products, with significant sales growth expected [2][26] - Aisen's business performance in the advanced packaging sector is projected to grow rapidly, with a target of achieving significant sales in the wafer and advanced packaging fields [2][14][31] Challenges and Opportunities - The ongoing trade tariff war has increased material procurement costs for several packaging and testing companies, prompting a shift towards domestic materials [2][33] - The domestic PSPI market is still in its infancy, with a market size of approximately 1.5 billion RMB, and Aisen is working to increase its market share through product development and client validation [2][17][22] - The company is addressing supply chain challenges by developing multiple alternative solutions to mitigate reliance on single products [2][19] Future Outlook - Aisen anticipates structural growth driven by increasing demand from domestic clients, particularly in the HBM sector, and plans to expand its product offerings to meet market needs [2][28] - The company aims to enhance its domestic replacement rate and market share through improved risk control and technology advancements [2][25]

Core Viewpoint - The company has reported its annual financial results, highlighting its business operations, financial status, and future development plans, with a focus on its core business areas in semiconductor materials, display materials, UV curing materials, and organic synthesis materials [1][5]. Company Overview - The company has expanded its core business from UV curing materials in optical communication to four major areas: semiconductor materials, display materials, UV curing materials, and organic synthesis materials, maintaining a mission to provide high-quality materials for high-tech manufacturing [5][6]. - The company operates over 30 subsidiaries across regions including Japan, Singapore, the United States, and East and South China [5]. Business Segments Semiconductor Materials - The semiconductor materials include photoresists and wet process electronic chemicals used in semiconductor manufacturing and advanced packaging, as well as traditional packaging materials like solder balls and epoxy encapsulants [6]. - The company has developed a complete temporary bonding solution for semiconductor manufacturing, which supports various disassembly methods [6]. Display Materials - Display materials consist of photoresists and liquid crystal materials for TFT-LCD and OLED screens, with a significant focus on developing proprietary technologies [7]. - The company’s subsidiary, Hecheng Display, is a key supplier in the mid-to-high-end TN/STN field and has received multiple technology awards for its innovations [7]. UV Curing Materials - UV curing materials are crucial for fiber optic cable manufacturing and include coatings that protect optical fibers and enhance their mechanical and optical properties [8]. - The company has developed advanced UV curing materials and has received several awards for its innovations in this field [8]. Organic Synthesis Materials - Organic synthesis materials include photoinitiators and pharmaceutical intermediates, with a focus on applications in antiviral drugs and antibiotics [9]. - The company’s innovative photoinitiator TMO has gained recognition and awards for its contributions to human health and industry challenges [9]. Industry Characteristics - The semiconductor materials industry is characterized by a broad application field and high demand dispersion, with no significant industry cyclicality, primarily influenced by macroeconomic trends [10]. - The display materials sector exhibits cyclicality due to its dependence on the economic conditions affecting display device sales, with demand typically peaking in the second half of the year [11]. - The UV curing materials market is closely tied to the economic cycle, with stable growth during economic prosperity and declines during downturns [12]. - Organic synthesis materials have a diverse application landscape, with demand influenced by macroeconomic fluctuations and technological advancements, showing no significant seasonality [12]. Financial Data - The company has not required retrospective adjustments or restatements of previous financial data, indicating stability in its financial reporting [13]. - The company’s major accounting data and financial indicators for the past two years are available, reflecting its operational performance [15]. Important Events - The company has approved a profit distribution plan for 2023, proposing a cash dividend of RMB 0.80 per 10 shares, with no stock dividends or capital reserve transfers [16][17]. - The company has undergone a change in its accounting practices due to regulatory requirements, correcting prior accounting errors and adjusting financial statements accordingly [16]. - The company has decided to sell its wholly-owned subsidiary, Dairui Technology, to ensure continued operational stability amid market pressures [18].

Investment Rating - The report maintains an "A" rating for the new materials industry, indicating a positive outlook for the sector [1]. Core Insights - The chemical raw materials sector is currently experiencing a bottoming phase, with a slowdown in capacity expansion and a potential alleviation of intense competition and price wars. The overall profit margin for the industry is expected to remain between 3% and 5% in 2024, which is at a historical low. However, with the central economic work conference emphasizing the need to address "involution" competition, there is potential for improved industry order and profit recovery [1][34]. Summary by Sections 1. Market Performance and Valuation - The new materials index has shown significant volatility, underperforming the Shanghai Composite Index by 10.6% as of December 27, 2024. The index's performance was particularly weak in the first three quarters of 2024 but saw a recovery in the fourth quarter due to favorable policies [15][20]. 2. Focus Areas 2.1 Supply and Demand Dynamics - The vitamin sector is expected to maintain high prices for Vitamin E due to limited supply recovery from BASF's production facilities, which are aging and unable to meet demand. The report suggests monitoring companies like New Hope Liuhe and Zhejiang Medicine [42][59]. - The renewable energy materials sector is projected to benefit from a stable increase in wind power demand, with a significant rise in installed capacity and a self-regulatory agreement among wind turbine manufacturers to mitigate price competition. Companies like Times New Material and Mega Chip Color are highlighted for investment [44][60]. 2.2 Emerging Industry Opportunities - The bio-manufacturing sector is positioned for growth, particularly in synthetic biology and sustainable aviation fuel (SAF). The report emphasizes the importance of product selection and platform capabilities for companies in this space, recommending firms like Huaheng Biological and Meihua Biological [48][50]. - The special coatings market is expected to grow due to increasing military expenditures and the need for stealth materials. Companies such as Huaqin Technology and Jiachih Technology are noted for their potential in this area [52][61]. - The semiconductor materials sector is anticipated to benefit from the recovery of consumer electronics and AI applications, with a focus on domestic production capabilities. Companies like Stik and Aisen are recommended for investment [56][61]. - The humanoid robotics market is projected to drive demand for PEEK materials, with domestic companies expected to gain market share due to cost advantages. The report suggests monitoring firms like Zhongxin Fluorine Materials and Zhongyan Co. [58][61].