转自：前瞻产业研究院 行业主要上市公司：泰凌微(688591)、安凯微(688620)、思特威(688213)、士兰微(600460)、瑞芯微 (603893)、北京君正(300223)、全志科技(300458)等 本文核心数据：物联网芯片;上游材料;市场规模;硅片;半导体设备规模 1、上游芯片材料分类及用途 半导体材料是一类导电能力介于导体与绝缘体之间，可用来制作半导体器件和集成电路的电子材料。作 为集成电路能量转换功能的媒介。根据半导体的制作流程，半导体材料主要分为前端制造材料和后端封 装材料。前端制造材料主要由硅片、溅射靶材、CMP抛光液和抛光垫、光刻胶、高纯化学试剂、电子 气体和化合物半导体构成。后端封装材料主要由封装基板、引线框架、陶瓷封装体和键合金属线构成。 2、中国半导体材料市场规模持续增长 根据SEMI统计数据，2013-2023年期间我国半导体材料市场规模总体呈波动增长态势。中国台湾连续第 14年成为全球最大的半导体材料消费市场，总金额达201亿美元，SEMI指出，中国台湾的优势在于大规 模晶圆代工能力和先进封装基地。2023年中国大陆半导体材料市场规模为131亿美元，中国台湾半导体 材料市 ...

Core Viewpoint - MicroNano plans to raise up to 1.17 billion yuan through convertible bonds to enhance its semiconductor and photovoltaic business, focusing on smart manufacturing and R&D expansion [1][2][4]. Fundraising and Investment Plans - The company aims to raise a total of 1.17 billion yuan, with 6.43 billion yuan allocated to the construction of a smart factory for semiconductor thin film deposition, accounting for 54.96% of the total fundraising [2][3]. - The smart factory project has a total investment of 6.7 billion yuan, with a projected internal rate of return of 23.10% and a payback period of 6.24 years, expecting annual sales of 1.565 billion yuan upon reaching full capacity [2][3]. - An additional 2.27 billion yuan will be used for the expansion of R&D laboratories, with a total investment of 4.3 billion yuan aimed at enhancing the company's R&D capabilities [3]. Financial Performance - In Q1, the company reported revenue of 510 million yuan, a year-on-year increase of 198.95%, and a net profit of 84 million yuan, a significant increase of 2253.57% [5]. - For the year 2024, the company anticipates total revenue of 2.7 billion yuan, reflecting a year-on-year growth of 198.95%, although net profit is expected to decline by 16.16% [4]. Semiconductor Business Growth - The semiconductor business achieved a revenue increase of 168% in 2024, reaching 327 million yuan, with the segment's revenue share growing from 6.87% in 2022 to 12.14% in 2024 [6]. - The company has a robust order backlog of 6.772 billion yuan in the semiconductor sector, with a year-on-year increase of 65.91% [6]. R&D and Innovation - The company has significantly increased its R&D investment, totaling 865 million yuan from 2022 to 2024, with over 60% directed towards semiconductor technology [5][6]. - In 2024, the company achieved a record number of patent applications and grants, with 49 new patents granted and a total of 178 authorized patents [6].

Core Viewpoint - Jiangsu Weidao Nano Technology Co., Ltd. has received approval for refinancing, meeting the necessary issuance, listing, and information disclosure requirements from the Shanghai Stock Exchange's listing review committee [1] Group 1: Financing and Fund Utilization - The company plans to raise a total of RMB 117 million through the issuance of convertible bonds, with all proceeds allocated to the construction of a semiconductor thin film deposition equipment intelligent factory, laboratory expansion, and working capital supplementation [3] - The net amount raised from the issuance is RMB 102.35 million, exceeding the original plan by RMB 2.35 million [4] - The company initially aimed to raise RMB 100 million for projects related to atomic layer deposition technology and working capital [4] Group 2: Project Details and Market Position - The main inquiry during the listing committee meeting focused on the progress of the R&D projects within the semiconductor thin film deposition equipment intelligent factory construction project, including the reasons for the delay in industrialization of tested prototypes and the associated uncertainties [2] - The company is required to clarify the accounting treatment for R&D expenditures and ensure compliance with relevant accounting standards [2]