本届CSEAC吸引了北方华创（002371）、盛美半导体、中微半导体、拓荆科技、新凯来等国内龙头企 业悉数参展，重点展示光刻、薄膜、刻蚀、化学机械抛光等晶圆制造设备，划片、键合、晶圆测试等封 测设备以及集成电路专用材料，已成为国内第二大行业展会。 展会自2021年扎根无锡以来，展会规模不断攀升，从最初的十几个标准展位发展至如今的1130余家参展 企业，观展人数也从400—500人增长至超过10万人次。 9月4日，第十三届半导体设备与核心部件展示会（CSEAC）在江苏无锡拉开帷幕。 本次CSEAC上，中微公司推出六款半导体设备新产品，覆盖等离子体刻蚀（Etch）、原子层沉积 （ALD）及外延（EPI）等关键工艺。盛美上海展出了面板级先进封装电镀设备、立式炉管设备、 PECVD、TRACK等设备。成立刚满4年的半导体设备"黑马"新凯来也来到本次CSEAC，展出了刻蚀设 备ETCH（武夷山）、ALD（阿里山）等模型。 ...

Group 1: Company Overview and Market Context - The company is actively engaged in the international photovoltaic market, particularly in India, to counteract the cyclical demand shrinkage in the domestic market [2] - The CPO market is projected to grow at a compound annual growth rate (CAGR) of 172% from 2023 to 2030, potentially reaching $9.3 billion by 2030, with optimistic scenarios suggesting $23 billion [3] Group 2: Orders and Contracts - ficonTEC has signed significant contracts amounting to €17.1 million (over ¥100 million) with a major U.S. client, which is expected to positively impact the company's performance in the current and future years [5] - The company will disclose orders that meet voluntary or regulatory disclosure standards while adhering to confidentiality agreements [6] Group 3: Future Capacity and Integration - ficonTEC will adapt its production capacity based on customer demand, leveraging its light asset model to avoid significant capital expenditure for capacity expansion [9] - The company aims to enhance ficonTEC's operational capabilities and efficiency through comprehensive integration of business, assets, and personnel post-acquisition [8]