Core Insights - The 13th Semiconductor Equipment and Core Components Exhibition (CSEAC) commenced on September 4 in Wuxi, Jiangsu, showcasing significant growth since its inception in 2021, expanding from a few dozen exhibitors to over 1,130 companies [1] - The exhibition attracted more than 100,000 attendees, a substantial increase from the initial 400-500 participants [1] - Major domestic companies such as Northern Huachuang, Shengmei Semiconductor, and Zhongwei Semiconductor participated, highlighting advancements in wafer manufacturing and packaging equipment [1] Company Highlights - Zhongwei Company launched six new semiconductor equipment products at CSEAC, covering critical processes such as plasma etching, atomic layer deposition, and epitaxy [1] - Shengmei showcased advanced packaging electroplating equipment and vertical furnace tube equipment, among others [1] - New Kai Lai, a semiconductor equipment "dark horse" established just four years ago, presented etching and ALD models at the exhibition [1]

Group 1: Company Overview and Market Context - The company is actively engaged in the international photovoltaic market, particularly in India, to counteract the cyclical demand shrinkage in the domestic market [2] - The CPO market is projected to grow at a compound annual growth rate (CAGR) of 172% from 2023 to 2030, potentially reaching $9.3 billion by 2030, with optimistic scenarios suggesting $23 billion [3] Group 2: Orders and Contracts - ficonTEC has signed significant contracts amounting to €17.1 million (over ¥100 million) with a major U.S. client, which is expected to positively impact the company's performance in the current and future years [5] - The company will disclose orders that meet voluntary or regulatory disclosure standards while adhering to confidentiality agreements [6] Group 3: Future Capacity and Integration - ficonTEC will adapt its production capacity based on customer demand, leveraging its light asset model to avoid significant capital expenditure for capacity expansion [9] - The company aims to enhance ficonTEC's operational capabilities and efficiency through comprehensive integration of business, assets, and personnel post-acquisition [8]