近年来，生成式人工智能的迅猛发展导致全球范围内超大规模人工智能集群的部署速度空前加快。随 着摩尔定律的放缓，只有通过并行计算才能实现更高的性能，因此，数据处理和/或传输性能的提升 必然导致能耗的增加。也就是说，人工智能基础设施的快速增长带来了严重的能源危机。如图 1 所 示，随着数据量的指数级增长，所需的能源供应量也将呈指数级增长。从这个意义上讲，解决这一能 源问题的唯一有效途径是开发一种能够将能源增长与数据增长分离的技术。 光子学具有巨大的潜力，因为光波的传播和干涉无需消耗能量，因此可以通过工程设计来实现可扩展 的功能，而无需增加能耗。硅光子学在过去二十年中得到了广泛的发展，如今已完全具备提供近乎理 想的平台的能力，从而释放其巨大的潜力。事实上，硅光子学能够提供高效的高密度互连，实现高带 宽和长距离链路；能够实现低能耗的光路切换，且不受信号带宽的限制；以及能够进行光速计算的光 子神经网络，从而加速人工智能计算。 在本文中，我们将回顾这些光子技术的发展趋势和进展，我们将论证，为了使这些光子技术成为人工 智能时代可持续基础设施的重要组成部分，硬件和软件以及电子和光子学需要以互补的方式进行开 发。 光收发器和交换 ...

有投资者在互动平台向物产金轮提问："尊敬的董秘：您好！贵公司参股的CPO明星企业海光芯正已正 式收到港交所通知于1月15日进行聆讯，预计于3月份挂牌上市，公司已收到阿里巴巴、小米等战略股东 的路演确认函。海光芯正其核心竞争力'硅光子技术'，1.6T硅光子模块已通过头部GPU厂商的验证。其 收入规模已稳坐全球前十。根据市场评估，海光芯正上市后预期市值能到120-200亿区间。请问贵公司 是否会参与海光芯正路演。" 针对上述提问，物产金轮回应称："尊敬的投资者，您好！经了解，海光芯正尚未收到聆讯通知。公司 通过金源汇富基金平台间接持有海光芯正少量股权，公司将持续关注其进展，若触及相关信息披露标 准，公司将依规及时公告。感谢您的关注！" 声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 作者：公告君 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 在这些追赶者中，英特尔的转型动作最为激进，也最具系统性。作为曾经的半导体霸主，英特尔在制 程技术上的落后一度让外界质疑其代工业务的前景。但从2024年底到2025年，英特尔展现出的战略 调整清晰而坚决：不是放弃先进制程竞争，而是通过技术突破、客户争取和生态整合，试图在特定领 域重新建立竞争力。 先进制程：14A与High-NA EUV的技术豪赌 英特尔晶圆代工的核心筹码是其14A制程节点。这一节点被定位为对外部客户极具竞争力的选择，预 计在功耗效率和芯片密度方面实现显著提升。更关键的是，14A将成为全球首个在关键层采用高数值 孔径（High-NA）EUV光刻技术的制造节点。 英 特 尔 已 安 装 ASML 的 Twinscan EXE:5200B ， 这 是 业 界 首 款 采 用 0.55 数 值 孔 径 投 影 光 学 系 统 的 High-NA光刻设备。该设备能够以8nm的分辨率打印芯片，在50 mJ/cm²的剂量下每小时可处理175 片晶圆，并实现0.7纳米的套刻精度。相比之下，台积电和三星虽然也在测试High-NA设备的研发版 本，但尚未将其用于商业 ...

Core Viewpoint - Recent market focus has shifted towards CPO (Co-Packaged Optics) technology, with companies like Tianfu Communication, Zhongji Xuchuang, and Xinyi Sheng showing active performance as AI computing power demands continue to surge [1] CPO Technology and Market Trends - CPO technology is seen as a key path for next-generation data center interconnects, addressing the limitations of traditional pluggable optical modules in terms of transmission speed and energy consumption [1] - Securities firms have released reports highlighting the potential of CPO and silicon photonics, with expectations that 1.6T optical modules will become a primary demand in 2024, extending the lifecycle of pluggable optical modules [1][2] - The integration of optical engines with computing chips in CPO technology raises the requirements for upstream optical chips and silicon photonics technology [2] Optical Modules and Advanced Packaging - Optical module manufacturers are crucial participants in the implementation of CPO technology, which is not expected to completely replace traditional pluggable optical modules but rather serve as a complementary or evolutionary direction in high-density, high-performance scenarios [3] - Leading optical module companies are expanding into CPO solution provision by developing core technologies such as silicon photonics and optical engines [3] Supporting Facilities and Materials - The promotion of CPO technology will drive demand for supporting facilities and specialized materials, including precision connectors and optical fiber arrays for efficient chip and optical engine coupling [4] - New packaging forms will necessitate advanced cooling solutions, potentially increasing the penetration of liquid cooling technologies [4] Company Information - Xingsen Technology has indicated that its products can be used for the packaging of CPO products, utilizing MSAP (Modified Semi-Additive Process) technology [5] - Anfu Technology has invested in Suzhou Yilong Micro Semiconductor Technology Co., which specializes in silicon photonic technology applicable to CPO optical modules, seen as a move to build a "second growth curve" [5] - Changguang Huaxin, as an IDM optical chip enterprise, is advancing its technology competitiveness in the silicon photonics field, with its 100G EML chip already in mass production and 200G EML in customer validation [5]

Core Viewpoint - Broadcom's CEO Hock Tan indicated that silicon photonics technology will not have an immediate impact on data centers, suggesting that the transition to this technology will take time and require two waves of innovation before it becomes essential [2]. Group 1: Silicon Photonics Technology - The CEO believes that the adoption of silicon photonics technology will occur in the future, but it is not imminent. The first wave involves expanding copper interconnect technology for rack-level systems, followed by a second wave of pluggable optical devices that combine electronic and photonic components [2]. - Tan emphasized that the transition to silicon photonics is inevitable but will require time, stating that Broadcom is preparing for this shift through necessary R&D efforts [2]. Group 2: AI Hardware Demand - Broadcom is currently focused on producing AI hardware to fulfill a backlog of orders valued at $73 billion, with over $50 billion coming from large-scale customers ordering custom AI accelerators, referred to as "XPUs" [3]. - The CEO expressed confidence in the sustained demand for AI hardware, countering claims of a cooling market, and highlighted a recent $1 billion XPU order from a new customer and an additional $11 billion order from Anthropic [3]. Group 3: Financial Performance - In the fourth quarter, Broadcom's semiconductor business revenue reached $11 billion, a 35% year-over-year increase, with $6.7 billion attributed to AI products, marking a tenfold growth in AI hardware revenue in less than three years [4]. - The company's infrastructure software business generated $6.9 billion in revenue, up 19% year-over-year, primarily driven by VMware software sales, which are expected to maintain low double-digit growth until 2026 [4]. - The CEO projected that the semiconductor business will continue to drive rapid growth, with first-quarter revenue expectations for fiscal year 2026 set at $19.1 billion, reflecting a 28% increase [4]. Group 4: Stock Market Reaction - Following the earnings announcement, Broadcom's stock price initially rose by approximately 3% but quickly fell by 5% [5].

智通财经APP获悉，聚焦于大型AI数据中心定制化AI芯片(即 AI ASIC芯片)，以及作为亚马逊AWS Trainium系列AI ASIC最大规模合作伙伴之一的迈威尔科技(MRVL.US)于北京时间周三晨间公布截至11 月1日的2026财年第三财季业绩报告。最新的财报数据显示该公司业绩以及对于未来的业绩展望均超华 尔街分析师平均预期，凸显出英伟达AI GPU算力集群最强劲技术竞争路线——AI ASIC算力集群的需 求无比强劲。 除了强劲Q3业绩以及当前季度业绩展望强劲扩张，该芯片公司还在财报披露中重磅透露将以32.5亿美元 收购聚焦光互连I/O的芯片初创公司Celestial AI以强化其网络产品组合，共同驱动迈威尔科技股价公布 业绩后的美股盘后交易中一度暴涨超16%。然而由于长期与"AI ASIC霸主"——即美国芯片巨头博通公 司，在数据中心定制化AI芯片和高性能网络基础设施市场竞争日益加剧，以及近期华尔街投资机构们 对AI泡沫破裂的潜在担忧，迈威尔股价今年以来已下跌逾15%。 市场最为聚焦的业绩展望方面，迈威尔科技管理层预计第四财季营收约为22亿美元，浮动范围正负 5%，这一基准预测显著高于华尔街分析师 ...

Core Viewpoint - The domestic optical chip leader, Yuanjie Technology, is preparing for an overseas listing on the Hong Kong Stock Exchange, coinciding with significant growth in its business performance and the optical communication market [1][4]. Group 1: Company Performance - Yuanjie Technology reported a revenue of 383 million yuan for the first three quarters of 2025, marking a year-on-year increase of 115.09%, and a net profit of 106 million yuan, reversing previous losses [2][3]. - The company's gross profit margin reached 54.76%, an increase of 33.42 percentage points year-on-year, driven by high-margin data center business growth [2][3]. Group 2: Market Growth - The optical communication chip market is expected to grow rapidly, with a projected compound annual growth rate of 17% from 2025 to 2030, increasing total sales from approximately 3.5 billion USD in 2024 to over 11 billion USD by 2030 [3]. - The demand for EML and CW laser chips is anticipated to remain high until the end of 2026, aligning with Yuanjie Technology's product focus on silicon photonics technology [3]. Group 3: Technological Innovation - Yuanjie Technology emphasizes technological innovation, with a research and development expense ratio of 14.28% in the first three quarters of 2025, indicating a commitment to maintaining a competitive edge [4]. - The company is investing significantly in the industrialization of its 50G optical chip project, increasing the investment from 129 million yuan to 487 million yuan to meet growing capacity needs [3][4]. Group 4: International Strategy - The planned listing in Hong Kong is a key step in Yuanjie Technology's internationalization strategy, aiming to enhance its global brand recognition and access to international capital [5]. - The favorable market conditions, including improved liquidity in the Hong Kong stock market and supportive listing regulations for technology companies, create a conducive environment for the IPO [5]. Group 5: Listing Process and Challenges - The listing process requires approval from various regulatory bodies, including the China Securities Regulatory Commission and the Hong Kong Stock Exchange, which introduces significant uncertainty [6]. - If successful, the company will face a more complex international capital market environment and stricter regulatory requirements, with a current market valuation reflecting high growth expectations [7].

Core Viewpoint - Goldman Sachs expresses strong confidence in the growth prospects of Zhongji Xuchuang, raising the target price by 62% to RMB 762 and maintaining a "Buy" rating based on the company's robust growth potential in the 800G/1.6T optical module and silicon photonics technology sectors [1] Group 1: Financial Projections - Goldman Sachs forecasts a compound annual growth rate (CAGR) of 59% for Zhongji Xuchuang's net profit from 2025 to 2028, with 800G optical module revenue expected to surge by 104% year-on-year in 2026 and 1.6T optical module revenue projected to skyrocket by 110% in 2027, supporting an overall revenue CAGR of 52% during the same period [3] - The net profit estimates for 2026 and 2027 have been raised by 23% and 28%, reaching RMB 21.645 billion and RMB 29.944 billion, respectively, driven by higher revenue and gross margin expectations [3] - Operating profit margin is anticipated to increase from 25% in 2024 to 39% in 2028, reflecting sustained growth supported by long-term demand trends in AI networks [3] Group 2: Market Dynamics - The diversification of ASIC chips is reshaping the demand landscape for optical modules, with ASIC chips expected to account for 38%, 40%, and 45% of the AI chip market from 2025 to 2027 [4] - The architectural differences between GPU and ASIC servers lead to a significant increase in the dependency on multiple chips, servers, and rack connections, thereby driving stronger demand for high-speed connections [5] Group 3: Technology and Product Upgrades - The transition from 400G to 800G is becoming a major driver for the optical module upgrade cycle, with expectations for continued trends in the coming years, including the deployment of 1.6T optical modules starting in the second half of 2025 [6] - As optical modules upgrade to higher speeds, market competition is expected to decrease due to higher technical barriers in design, testing, and production efficiency, benefiting technologically advanced companies [6] - Revenue contribution from 800G and 1.6T products is projected to increase significantly, from 64% and 8% in 2025 to 71% and 16% in 2026, respectively, making this product structure upgrade a core engine for revenue growth [6] Group 4: Margin Expansion - Gross margin is expected to rise from 41.6% in 2025 to 46.4% in 2027, primarily due to faster speed migration and the transition from EML to silicon photonics technology [7] - Silicon photonics technology offers better gross margin performance compared to EML, with reduced component costs and improved production efficiency [7] Group 5: Valuation Adjustments - Goldman Sachs has significantly raised its revenue forecasts for 2026 and 2027 by 24% and 35%, respectively, reflecting accelerated growth in mainstream products [8] - The target price has been adjusted from RMB 470 to RMB 762, applying a target price-to-earnings ratio of 31 times, consistent with recent trading averages [8]

Group 1: AI Investment and Valuation - Microsoft and NVIDIA plan to invest up to $15 billion in AI startup Anthropic, raising its valuation to $350 billion from $183 billion in September [2][3] - Anthropic will purchase $30 billion worth of computing power from Microsoft's Azure cloud platform, committing to a capacity of up to 1 billion watts [2][3] - This investment reflects the growing interconnection between cloud computing, chip suppliers, and leading AI developers, raising concerns about a potential valuation bubble [3] Group 2: GlobalFoundries Acquisition - GlobalFoundries announced the acquisition of Singapore-based silicon photonics chip manufacturer AMF, aiming to become the largest silicon photonics chip manufacturer globally [5][6] - The acquisition will enhance GlobalFoundries' technology portfolio and production capabilities, integrating AMF's assets and expertise to meet the growing demand in AI data centers and telecommunications [5][6] - Silicon photonics technology is expected to replace traditional optical modules, with market share projected to increase from 30% in 2025 to 60% by 2030 [6] Group 3: Arm and NVIDIA Collaboration - Arm announced the integration of its Neoverse platform with NVIDIA's NVLink Fusion technology, facilitating easier pairing of Arm-based CPUs with NVIDIA's GPUs for large-scale data center operators [7][8] - This collaboration aims to set new standards for AI infrastructure, with Arm's Neoverse platform expected to capture 50% of the global market share in top-tier data centers by 2025 [7][8] - The partnership reflects NVIDIA's strategy to open its NVLink platform for integration with various custom chips, reinforcing its central position in the AI industry [8]

Core Viewpoint - Concerns about an AI valuation bubble persist in the market, yet major chip companies continue to make significant investments in the sector [1] Group 1: Investment in AI Startup Anthropic - Microsoft and NVIDIA plan to invest up to $15 billion in AI startup Anthropic, raising its valuation to $350 billion from $183 billion in September [2][4] - Anthropic will purchase $30 billion worth of computing power from Microsoft's Azure cloud platform, committing to a capacity of up to 1 billion watts [2][3] - This investment reflects the growing interdependence between cloud computing, chip suppliers, and leading AI developers, with concerns about potential cyclical AI transaction bubbles [3] Group 2: GlobalFoundries Acquires AMF - GlobalFoundries announced the acquisition of Singapore-based silicon photonics chip manufacturer AMF, aiming to become the largest silicon photonics chip manufacturer globally [5] - The acquisition will enhance GlobalFoundries' technology portfolio and production capabilities in Singapore, complementing its existing capabilities in the U.S. [5][6] - Silicon photonics technology is crucial for AI infrastructure, enabling high-speed, energy-efficient data transmission [6] Group 3: Arm and NVIDIA Collaboration - Arm announced the integration of its Neoverse platform with NVIDIA's NVLink Fusion technology, facilitating easier pairing of Arm-based CPUs with NVIDIA GPUs for large-scale data center operators [8][9] - The Neoverse platform is designed for high-efficiency and high-performance scalability, with expectations to capture 50% of the global market share in top-tier data centers by 2025 [8] - This collaboration signifies NVIDIA's strategy to open its NVLink platform for integration with various custom chips, reinforcing its central role in the AI industry [9]