华山A1000家族芯片

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黑芝麻智能再度登陆慕尼黑车展
Zhong Guo Qi Che Bao Wang· 2025-09-15 09:10
黑芝麻智能武当系列芯片专注于跨域计算,武当C1200家族中的C1236是本土首款单颗支持领航辅助驾 驶功能的芯片,C1296是行业首颗支持多域融合计算的芯片。自武当C1236和C1296芯片面世后,黑芝麻 智能陆续与车企、一级供应商合作开发相关解决方案。本届展会上,黑芝麻智能不但带来这两款芯片, 还展示了安波福基于C1296芯片开发的舱驾一体方案。目前,安波福、大陆、均胜、斑马等国内外多家 头部企业已基于C1296芯片开发跨域融合方案。 9月9日,2025德国国际汽车及智慧出行博览会(IAA Mobility 2025)在慕尼黑正式开幕。智能汽车 计算芯片引领者黑芝麻智能再度登上这一"预演"未来出行面貌的国际舞台,展示从舱驾融合到高阶辅助 驾驶的"芯"实力,与全球汽车行业领军企业、合作伙伴共同探索AI驱动下的智能汽车未来。 车企在跨域融合中往往面临安全与成本难题,借本届慕尼黑车展,黑芝麻智能首次向国际市场展示了安 全智能底座解决方案。该方案以黑芝麻智能旗下的武当C1200家族跨域融合芯片为核心,通过硬件安全 隔离、平台化算力扩展及全生命周期兼容性设计,为车企提供了从入门到旗舰车型的智能座舱与辅助驾 驶功能无缝 ...
黑芝麻智能登陆2025德国国际汽车及智慧出行博览会
Zhong Zheng Wang· 2025-09-12 08:21
转自:中国证券报·中证网 中证报中证网讯(王珞)9月9日,2025德国国际汽车及智慧出行博览会(IAA Mobility 2025)在慕尼黑 开幕,黑芝麻智能携多款芯片及解决方案参展,与全球伙伴探索AI驱动下智能汽车的未来。 本次展会,黑芝麻智能首次向国际市场推出"安全智能底座"解决方案。该方案以武当C1200家族跨域融 合芯片为核心,通过硬件级安全隔离等设计,破解车企跨域融合中的安全与成本难题,助力电子电气架 构向"舱驾一体"升级,实现"一次开发、多代复用",降低开发成本与周期。 华山A2000芯片样片是展台一大焦点。该芯片集成CPU、NPU等多功能单元,内置黑芝麻智能九韶 ™NPU核心,搭配新一代通用AI工具链BaRT,构成强大辅助驾驶技术底座,还可满足机器人、通用计 算需求,目前已与刘胜团队及傅利叶在人形机器人等领域展开合作。 同时,武当C1200家族芯片及合作成果同步亮相。其中C1236是本土首款单颗支持领航辅助驾驶的SoC 芯片,C1296为行业首颗多域融合计算芯片;展会上还展示了安波福基于C1296开发的舱驾一体方案, 大陆、均胜等头部企业也在基于该芯片开发方案,东风汽车多款新车将采用其舱驾一体化 ...
黑芝麻智能再度登陆IAA Mobility 全面展示智能出行“芯”实力
Ge Long Hui· 2025-09-10 06:47
9月9日,2025德国国际汽车及智慧出行博览会(IAA Mobility 2025)在慕尼黑正式开幕。智能汽车计算芯 片引领者黑芝麻智能再度登上这一"预演"未来出行面貌的国际舞台(展位号:B2馆A14),全面展示从舱 驾融合到高阶辅助驾驶的"芯"实力,与全球汽车行业领军企业、合作伙伴共同探索AI驱动下智能汽车的 未来。 安全智能底座方案海外首秀,破解跨域融合痛点 车企在跨域融合中往往面临安全与成本难题,借本届IAA Mobility,黑芝麻智能首次向国际市场展示 了"安全智能底座"解决方案。该方案以黑芝麻智能旗下的武当C1200家族跨域融合芯片为核心,通过硬 件级安全隔离、平台化算力扩展及全生命周期兼容性设计,为车企提供了从入门到旗舰车型的智能座舱 与辅助驾驶功能无缝升级路径。 这一"安全智能底座"解决方案推动电子电气架构向"舱驾一体"迈出里程碑式一步,帮助车企实现"一次 开发、多代复用",从而大幅降低开发成本、缩短开发周期,增加市场竞争力。 华山A2000芯片样片现身,打造全场景通识辅助驾驶标杆 武当C1200家族与合作伙伴齐亮相,彰显商业化实力 黑芝麻智能武当系列芯片专注于跨域计算,武当C1200家族中的 ...
黑芝麻智能:2024全面突破,但2025可能是更关键的一年
Ge Long Hui· 2025-04-10 01:06
Core Insights - 2024 is a breakthrough year for Hezhima Intelligent, achieving revenue of 474 million yuan, a 51.8% increase from 312 million yuan in 2023, and successfully turning a profit with a gross margin of 41.1%, up 16.4 percentage points year-on-year [1][2]. Group 1: Performance Review - Hezhima Intelligent has focused on continuous innovation in smart driving technology, solidifying its competitive edge and accelerating the commercialization and mass production of smart driving chips [3]. - The company has upgraded its core IP and overcome performance bottlenecks in computing chips, enhancing the efficiency of smart driving systems through new ISP technology and high-performance NPU [5]. - The company has expanded its market share by deepening partnerships with leading automotive manufacturers and accelerating the commercialization of smart driving technology [5][7]. Group 2: Product and Market Expansion - The Huashan A1000 family of chips has entered full-scale production and is being used in popular models such as Lynk & Co 07EM-P and 08EM-P, while the Wudang C1200 series has secured mass production contracts with major OEMs [7]. - In 2024, Hezhima Intelligent has successfully expanded its business into commercial vehicles and specialized vehicles, focusing on high-speed logistics and enhancing safety systems [7]. - The company has responded to the growing demand for smart driving in commercial vehicles, completing layouts for specialized models and increasing its customer base in this sector [7][8]. Group 3: Future Outlook - 2025 is expected to be a pivotal year for Hezhima Intelligent, with anticipated product upgrades and more project contracts to solidify its market position [9][10]. - The company plans to launch the A2000 series chip, designed for large models, which will significantly enhance the computational efficiency of autonomous driving systems [10]. - The trend of "smart driving equality" is expected to accelerate, with advanced features becoming standard in lower-priced vehicles, providing substantial market opportunities for Hezhima Intelligent [13][14]. Group 4: Technological Integration - Hezhima Intelligent is poised to enter the robotics sector, leveraging the technological similarities between smart vehicles and robotics to expand its market reach [15][17]. - The company is collaborating with various robotics firms to support their products with its chip technology, aiming for mass shipments in the robotics field [17]. - The flexible design of chip architecture and standardized algorithm modules will enable Hezhima Intelligent to penetrate various sectors, including smart transportation and smart industry, creating a "technology leverage effect" [17].