公众号记得加星标⭐️，第一时间看推送不会错过。 来源： 内容 编译自 Yole 。 半导体后端设备市场正在进入一个新时代。该市场曾一度由成熟且成本敏感的工艺主导，如今正被颠 覆性的封装技术和日益复杂的半导体器件重塑。预计2025年至2030年间，后端设备市场规模将从69 亿美元增长至98亿美元，年复合增长率高达7.1%。 这种扩张不仅是产量增长的结果，也是深刻的技术变革重新定义行业的结果。随着先进封装成为高性 能计算 (HPC)、人工智能 (AI) 和汽车应用的关键，后端不再是事后诸葛亮。相反，它已成为半导体 性能和系统级集成的关键推动因素。 市场动态：通过复杂性实现转型 半导体制造业正在快速发展，而后端是这一转型的核心。从芯片架构到异构集成，再到HBM的兴 起，一系列因素共同推动了对新型设备的需求。 截至2025年，核心后端设备细分市场包括芯片键合机、倒装芯片键合机、热压键合机 (TCB)、混合 键合、引线键合、晶圆减薄、切割以及计量与检测。虽然引线键合等传统解决方案仍然具有市场潜 力，但TCB和混合键合等先进技术才是推动最重大变革的关键。 混合键合：混合键合是当今最具颠覆性的后端技术。它能够实现低于 5 ...

Core Viewpoint - The next significant leap in semiconductor packaging will require a series of new technologies, processes, and materials that will collectively achieve an order-of-magnitude performance improvement, which is crucial for the AI era [1]. Group 1: Advances in Cooling Technologies - Liquid cooling technology at the chip level is emerging as forced air cooling reaches its limits, with up to 40% of power used for current delivery and heat dissipation [4]. - TSMC's silicon integrated micro-cooler (IMEC-Si) is being tested for reliability, designed to handle over 3,000 watts of uniform power dissipation under specific conditions [6]. - The demand for direct liquid cooling is increasing, with innovative concepts like using chips as coolants being proposed [7]. Group 2: Hybrid Bonding and Interconnects - Hybrid bonding with fine-pitch multilayer redistribution layers (RDL) is gaining attention as a cost-effective solution for high-speed interconnects [14]. - Intel's hybrid bonding can achieve spacing as small as 1µm, which is critical for advanced applications [5][17]. - The transition from traditional dielectric materials to polymer/copper hybrid bonding is being explored to enhance performance [16]. Group 3: Backside Power Delivery - Backside power delivery significantly reduces voltage drop related to transistor power supply, but it also exacerbates heat issues [19]. - IBM has developed an anisotropic model for precise heat transfer calculations in backend stacks, emphasizing the importance of thermal considerations in design [21]. - The implementation of backside power delivery is expected to lead to a 10% to 30% reduction in thermal losses [23]. Group 4: Co-Packaged Optical Devices - The demand for faster data networks is driving the integration of optical engines with GPUs and HBM in a single package, significantly increasing data transmission speeds [26]. - Co-packaged optical devices (CPO) are expected to achieve a 32-fold increase in bandwidth by bringing optical engines closer to processors [26]. - However, challenges remain regarding thermal management and warpage sensitivity in CPO implementations [28].