Core Viewpoint - The article discusses the evolution of semiconductor technology, highlighting the shift from Moore's Law to chiplet technology as a solution to the challenges faced in semiconductor manufacturing [2][5]. Summary by Sections Moore's Law and Its Challenges - Moore's Law, proposed by Gordon Moore in 1965, states that the number of transistors on a semiconductor chip doubles approximately every two years, driving performance improvements and cost reductions [2]. - Recent advancements in chip manufacturing have faced physical limits, increased complexity, and rising costs, leading to a belief that Moore's Law may no longer be applicable [2]. Introduction of Chiplets - Chiplets are small chips that perform specific functions and can be combined into a single package, improving manufacturing yield and efficiency by allowing the use of "known good die" [2]. - This technology allows for the integration of different types of circuits, enhancing performance while maintaining cost-effectiveness, particularly in high-performance computing and automotive applications [3]. Heterogeneous Integration - Heterogeneous integration enables the combination of chips made with different processes and functionalities into a single package, which is particularly beneficial for the automotive industry [3]. - Major automotive manufacturers are exploring chiplet technology for future vehicle systems, aiming for mass production post-2030 [3]. Advantages Beyond Automotive - Chiplet technology is expanding into artificial intelligence and telecommunications, driving innovation across various industries [5]. - The technology relies on an intermediary layer that connects chips, enhancing communication speed and efficiency [5]. Advanced Packaging Techniques - The mainstream method for chiplet integration is 2.5D integration, while the next significant advancement is 3D integration, which stacks chips vertically for higher density [5][8]. - Combining flexible chip designs with 3D integration allows for faster, smaller, and more energy-efficient semiconductors, crucial for high-performance applications [7]. Challenges and Innovations - Vertical stacking of chips presents challenges such as heat management and maintaining high manufacturing yields, prompting research into advanced packaging technologies [8]. - The combination of chiplets and 3D integration is viewed as a disruptive innovation that could lead the semiconductor industry into a new era, potentially replacing Moore's Law [8].

其他人对此表示赞同。"我们最近重组或重新激活了一个跨公司的 AI 团队，"Cadence 验证软件产 品管理高级部门主管 Matt Graham 说，"我们仍然需要基础引擎，工程师需要理解所有这些的要 求。但我们也需要这些总体工程团队。以前，这些可能是市场营销团队和产品工程团队——上市类 型的团队，如果我们以某种方式将它们结合起来使用，我们可以解决诸如低功耗混合之类的问题。 但我们越来越发现这实际上是一个工程问题，而不仅仅是一个上市解决方案。我们可能需要在工具 中构建特定的功能，或者在代码级别（而不仅仅是在脚本级别）将特定的流程拼接在一起，以实现 这些不同的解决方案。这不是一个完全统一的单一流程，但它是一个接一个地流动的。" 一个巨大的挑战是如何集成各种 AI 实现，这实际上可以在设计过程开始时收集的数据与芯片制造 前后显示的结果之间架起一座桥梁。 "我们的应用工程师团队和产品工程团队越来越开始构建这种跨职能的知识，"Graham 说，"我们 的客户也在寻找这类人才并组建这类团队。验证工程师非常擅长使用 UVM、SystemVerilog 和运 行各种调试工具来找到仿真过程中发现的逻辑错误的根本原因。但他们也 ...

Core Viewpoint - The article discusses how AI is fundamentally transforming the chip industry, particularly in the design, packaging, and manufacturing processes, with a focus on the integration of chiplets and the evolution of EDA tools [1][6][11]. Group 1: AI's Impact on Chip Design - AI is reshaping EDA (Electronic Design Automation) by enhancing the design possibilities and requiring a more integrated approach to chip specifications, verification, and manufacturing [1][3]. - The traditional silos in semiconductor design are breaking down, prompting a reorganization of design teams and their interactions with other teams [1][2]. - There is a growing need for cross-functional teams that combine expertise from various engineering disciplines to address complex design challenges [2][3]. Group 2: Challenges in AI Integration - Integrating various AI implementations poses significant challenges, particularly in bridging the gap between data collected during the design process and the results observed before and after chip manufacturing [2][6]. - The complexity of AI models necessitates trade-offs, such as balancing the prediction of component interactions with the reliability of control loops [2][9]. - As chip manufacturers begin to stack chips, the intricacies of interconnections increase, making the design process more complex than traditional 2D packaging [8][9]. Group 3: Industry Trends and Future Directions - The surge in interest in generative AI, particularly following the launch of ChatGPT, has led to substantial investments in high-performance AI architectures and data centers [6][11]. - The shift towards advanced packaging and multi-chip components is driven by the limitations of scaling single-plane chips, with a focus on improving yield and reusability of chiplets [6][8]. - The industry is witnessing a transition where packaging design is becoming a critical factor in the overall chip design process, reversing the traditional approach where it was often the final step [7][8]. Group 4: Concerns and Risks - There are concerns regarding the reliability of AI-driven processes, including issues related to hardware incompatibility, silent data errors, and security vulnerabilities in multi-chip systems [11]. - The black-box nature of many AI implementations limits traceability and raises questions about the predictability of outcomes in the semiconductor industry [11].