Core Viewpoint - Qualcomm has launched its new flagship mobile SoC, Snapdragon 8 Elite Gen5, claiming it to be the "world's fastest mobile SoC" [1] Group 1: Product Features - Snapdragon 8 Elite Gen5 features a third-generation Oryon core with a "2+6" CPU cluster architecture, where two super-large cores operate at 4.6GHz and six large cores at 3.62GHz [1] - The integrated Adreno 840 GPU utilizes a "sharded" architecture with dedicated cache for developers, reducing power consumption by up to 10% [1] - Compared to its predecessor, the third-generation Oryon CPU offers a 20% performance increase, while the Adreno GPU enhances graphics performance by 23% [1] Group 2: AI Capabilities - The Snapdragon 8 Elite Gen5 emphasizes personalized AI experiences, featuring a faster Hexagon NPU with a 37% performance improvement over the previous generation, achieving an AI inference speed of 220 tokens per second [1] Group 3: Benchmark Performance - During the Snapdragon Summit, Qualcomm showcased the Snapdragon 8 Elite Gen5's benchmark scores, achieving a single-core score of 3832 and a multi-core score of 12329 on Geekbench 6.4 [2] - The multi-core performance surpasses that of MediaTek's Dimensity 9500 and Apple's A19 Pro, which scored 11217 and approximately 11000, respectively [2] Group 4: Product Launch and Partnerships - The flagship devices featuring the Snapdragon 8 Elite Gen5 are set to launch soon, with Xiaomi's 17 series being the first to debut [2] - Other confirmed devices include iQOO 15 series, OnePlus 15 series, Red Magic 11 series, Nubia Z80 series, and Honor Magic8 series and MagicPad3 Pro [2][3] Group 5: Strategic Collaboration - Xiaomi's executives highlighted Qualcomm as a crucial partner in their high-end strategy, with the Xiaomi 17 series being the first to feature the Snapdragon 8 Elite Gen5 [3]

Group 1 - The core viewpoint of the article highlights the launch of MediaTek's Dimensity 9500 flagship 5G AI chip, which features significant improvements in performance and efficiency compared to its predecessor, set to be adopted in smartphones in Q4 2023 [2][3] - MediaTek has established itself as a leading IC design company, ranking among the top five globally, with a market share of smartphone SoCs for five consecutive years [2] - The Dimensity 9500 chip utilizes a new PC-level architecture ARM V9.3, achieving a 32% increase in single-core performance and a 17% increase in multi-core performance compared to the previous generation [3] Group 2 - The Dimensity 9500 features a new flagship GPU G1-Ultra, which boasts a 33% increase in peak performance and a 42% reduction in power consumption compared to its predecessor [4] - The chip integrates advanced AI capabilities, with a dual NPU that enhances performance by 111% while reducing power consumption by 56%, supporting 4K high-definition image generation [4][5] - MediaTek aims to surpass Apple in video recording capabilities with the Dimensity 9500, which supports 4K 60fps portrait video recording and advanced stabilization algorithms [5]

具体来看，天玑9500的全大核CPU架构包含1个主频高达4.21GHz的C1-Ultra超大核，以及3个C1- Premium超大核和4个C1-Pro大核，集成矩阵运算指令集SME2，率先支持4通道UFS4.1闪存架构。单核 性能相较上一代提升32%，多核性能提升17%，超大核功耗相较上一代X925峰值性能下降低55%，多核 功耗相较上一代峰值性能下降低37%。 9月22日，台湾芯片开发商联发科（MediaTek）发布了其全新旗舰移动SoC天玑9500，vivo X300系列将 首发搭载。 据介绍，天玑9500采用了台积电的N3P制程，延续了全大核CPU设计，还全球首发了Arm C1系列CPU集 群和 G1-Ultra GPU，此外还有全新的双NPU、ISP影像处理器等高算力单元。 发布会还透露，首批采用MediaTek天玑9500芯片的智能手机预计将于2025年第四季度上市。同日，vivo 官方正式宣布，其新一代旗舰手机系列vivo X300将全系首发搭载最新发布的天玑9500旗舰芯片，无独 有偶，OPPO也宣布其Find X9系列也将搭载天玑9500。 据称，天玑9500将赋能vivo蓝心3B大模型端侧运 ...

图源：PChome 先来了解一下，联发科天玑 9500的CPU 配置，全大核架构升级为第三代， CPU 全面更新为 C1 系列， 包含1 个主频高达 4.21GHz 的 C1-Ultra超大核，以及 3 个 C1-Premium 超大核和 4 个 C1-Pro 大核。并且 超大核缓存翻倍提升，三级缓存提升 33%，率先集成矩阵运算指令集 SME2和四通道 UFS 4.1 内存， CPU 配置极为炸裂。 苹果17系列发布后，年度旗舰SoC之争也轮到安卓这边出招。 9月22日，联发科发布天玑9500旗舰5G智能体AI芯片，多项数据刷新安卓芯片记录，单核首破 4000 分，多核性能突破 11000 分，评测数据一经发布，引得媒体惊声一片，这是安卓旗舰首次单核比肩苹果 当代旗舰，而多核方面，更是全面超过苹果 A19 Pro。 天玑 9500 在实验室环境中，单核首破 4 千分，多核首破11000分，众多媒体评测后直呼，这提升简直逆 天！ 1、多核 11000，天玑 9500力压苹果A19 Pro！问鼎最强芯。 今年天玑9500的全大核架构已经来到了第三代，和往年一样，大家依旧比较关注天玑9500的跑分情况， 尤其是苹 ...