以下文章来源于芯东西 ，作者ZeR0 芯东西 . 芯东西专注报道芯片、半导体产业创新，尤其是以芯片设计创新引领的计算新革命和国产替代浪潮；我们是一群追"芯"人，带你一起遨游"芯"辰大海。 来源 | 芯东西 他也曾是ATI R300和R600系列的首席架构师。当年R300创造过辉煌历史，搭载它的Radeon 9700和9500系列显卡曾对当时英伟达的产品 构成强有力的挑战。AMD收购ATI后，德默斯成为AMD图形部门的首席技术官，然后在2012年加入高通。 业界普遍认为，德默斯的加入会令英特尔GPU团队实力大增。 芯东西2月4日消息， 据外媒报道，英特尔CEO陈立武周二透露，英特尔计划生产GPU。"我刚刚聘请了首席GPU架构师，他非常优秀。我很 高兴他能加入我的团队。"陈立武说，并称自己费了一番功夫才说服他。 此前在今年1月，在高通工作长达14年的资深GPU硬件架构师 埃里克·德默斯（Eric Demmers） 宣布加入英特尔。他在领英网发表的一篇文 章中写道，过去几个月，他多次与陈立武交谈和会面，对陈立武的信心和乐观态度印象深刻，也对在新英特尔工作并参与这一持续转型感到兴 奋。 德默斯曾担任高通工程高级副总裁 ...

Group 1 - Qualcomm's CEO confirmed discussions with Samsung Semiconductor for 2nm wafer foundry, marking a return to collaboration after five years, aiming to challenge TSMC's dominance in advanced process orders [1] - Qualcomm's previous flagship chip, Snapdragon 8 Gen 1, was exclusively produced by Samsung at 4nm, but performance issues led Qualcomm to switch to TSMC for subsequent products [1] - Samsung is offering wafer foundry prices at least 30% lower than TSMC to attract Qualcomm for 2nm production, with plans to secure orders for the upcoming Snapdragon 8 Elite Gen 5 [1] Group 2 - Qualcomm is expected to launch its latest flagship chip, Snapdragon 8 Elite Gen 6, in two versions: Pro and Standard, indicating a potential return to a dual foundry strategy with TSMC and Samsung sharing flagship chip orders [2] - The new flagship chip is scheduled for Q4 release, with wafer foundries starting shipments in Q3 for final testing [2] - The CPU architecture will continue to utilize Qualcomm's in-house developed Oryon, with the high-end version expected to support LPDDR6, positioning Qualcomm to deliver a strong AI smartphone for non-Apple brands [2]

Group 1 - Qualcomm's CEO Cristiano Amon confirmed the company's active discussions with Samsung Electronics regarding 2nm chip foundry collaboration, with all related chip design work completed to accelerate product commercialization [1] - Samsung has become the first company to announce mass production of 2nm chips, showcasing strong technical appeal with its second-generation 2nm process (SF2P), which will be used for the Exynos 2600 chip in the Galaxy S26 series [2] - The collaboration between Qualcomm and Samsung is significant as Qualcomm previously shifted its advanced chip foundry orders to TSMC due to stability issues with Samsung's foundry process, indicating that Samsung's SF2P process has reached competitive levels in performance, energy efficiency, and production yield [2]

Group 1 - The DRAM supply shortage is expected to persist until 2028, with limited growth in commodity DRAM due to a shift in focus by major manufacturers towards AI server demands [2][6] - Existing suppliers' inventories have reached historical lows, exacerbating allocation pressures, and manufacturers are adopting conservative capacity expansion strategies [6] - The demand for server DRAM is projected to grow exponentially, with server share expected to rise from 38% in 2025 to 53% by 2030, driven by AI developments [6] Group 2 - Apple is facing significant cost increases for DRAM chips as its long-term agreement with Korean manufacturers is set to expire, potentially leading to higher product prices [8][9] - Dell has announced substantial price increases for various products due to the DRAM shortage, with expected hikes of hundreds of dollars for laptops and PCs [11][12] - The semiconductor market is entering a super cycle, with unprecedented supply shortages anticipated, particularly for server memory and high-bandwidth memory (HBM) [14][15]

Core Insights - Qualcomm and MediaTek are preparing to adopt TSMC's advanced 2nm N2P process node in their next-generation chip designs, aiming to surpass Apple in process technology [1] - Apple plans to launch its A20 and A20 Pro chips on TSMC's initial 2nm N2 process, while Qualcomm's Snapdragon 8 Elite Gen 6 and MediaTek's Dimensity 9600 will leap directly to the improved N2P node [1][2] - TSMC's 2nm process is expected to become a scarce resource, with monthly production capacity projected to be only 15,000 to 20,000 wafers by the end of 2025 [1][3] Industry Competition - The competition in process technology is intensifying, with Apple holding a significant technological advantage [2] - Qualcomm's Snapdragon 8 Elite Gen 6 is expected to support LPDDR6 memory and UFS 5.0 storage standards, while MediaTek plans to release the Dimensity 9600 on the N2P node [2] - Apple's experience in developing custom CPU and GPU cores has led to a notable performance improvement of up to 29% in the efficiency core of the A19 Pro without increasing power consumption [2] Capacity Constraints - Apple has reportedly secured over half of the initial 2nm capacity supply, a strategy aimed at maintaining its competitive edge [3] - In response to capacity limitations, Qualcomm and MediaTek's shift to the N2P process may provide a viable option for securing sufficient wafer supply [3] - Analysts expect TSMC's 2nm process to become a scarce resource next year, making the choice of N2P process potentially beneficial for Android chip manufacturers seeking stable capacity [3]