湘财证券发布研报称，AI大厂和全球互联网大厂投入巨额资本开支扩建数据中心，据Dell'Oro报告称， 到2029年全球数据中心资本支出的复合增长率将达到21%，AI大厂和互联网大厂的巨额资本开支计划将 推动算力集群持续扩容。算力扩容会同步放大"网络瓶颈"，使交换机从"配套件"变成提高数据中心性能 的"关键产能"，推动高速交换机需求快速增长。同时，AI服务器和高速交换机中的PCB层数不断增加， PCB使用的材料也不断升级，推动单机PCB价值量大幅提升。 湘财证券主要观点如下： Rubin架构量产有望推动PCB单机价值量提升 在10月底的GTC会议上，黄仁勋首次公开展示了Vera Rubin超级芯片，搭载了一颗代号Vera的CPU和两 颗体积庞大的Rubin GPU。在RubinUltra NVL576使用的Kyber架构中，将会应用正交背板技术，在 Switchtray、Midplane与CX9/CPX中，由多层PCB板代替铜缆直接连接。 同时，Rubin平台为实现低损耗与低延迟，全面升级制造材料，Switch Tray采用M8U等级材料(Low- Dk2+HVLP4)和24层HDI板设计，Midplane与C ...

Investment Rating - The industry investment rating is "Overweight" [2] Core Insights - The demand for AI computing power is driving both the quantity and price of PCBs upward, with significant growth expected in the AI PCB market [8] - The introduction of the Rubin architecture is anticipated to enhance the value of PCBs in servers, with the value of a single server's PCB expected to more than double compared to previous generations [4] - The upgrade of data center switches is also contributing to the increase in PCB value, as the number of PCB layers and material quality are improving [5] - AI server and high-speed switch demand is projected to grow rapidly, driven by substantial capital expenditures from major AI and internet companies [6][8] Summary by Sections Industry Performance - Over the past 12 months, the electronic industry has shown a relative return of 21.9% compared to the CSI 300 index, with an absolute return of 37.7% [3] Investment Recommendations - The report highlights a sustained recovery in consumer electronics, with new foldable smartphones being released and advancements in AI technology driving high demand for AI infrastructure [7][15] - The report emphasizes that the capital expenditure growth in data centers will lead to a compound annual growth rate of 21% by 2029, further supporting the expansion of computing power clusters [6][8]

Core Viewpoint - Ruijie Networks (301165) announced on October 23 that it has seen an increase in both the scale of Byte's recent framework procurement and the company's winning bid share compared to the same period last year [1] Group 1: Product Development - The product composition has changed, including different specifications such as TH5, TH6, and TD4 [1] - Last year, 400G products were predominant, while the number of 800G products is expected to increase this year [1] - The company is forming a product combination of LPO + 400/800G switches to meet the demands of SCALEUP super nodes and large intelligent computing networks regarding overall power consumption and heat management [1] Group 2: Market Expectations - It is anticipated that in the coming year, 400G products will still account for the largest proportion of the company's overall data center switch shipments, while the share of 800G products will further increase [1]