智通财经APP获悉，阿斯麦(ASML.US)将于7月16日公布第二季度业绩。摩根士丹利发布研报，预计阿 斯麦公司第二季度的订单量会十分可观，这得益于潜在的中国市场需求以及台积电(TSM.US)的重摆脱 困境。然而，从中期到长期来看，大摩预计增长会较为有限，原因是EUV技术的层数增加缓慢导致预 期和估值受到影响，而该行认为这种影响是完全负面的，因此维持"持股观望"评级，目标价660欧元， 这反映了谨慎的增长预期。 2025 年第二季度的出货量会保持良好态势吗? 大摩预计，阿斯麦在 2025 年第二季度的订单量将超过 40 亿欧元，这主要得益于中国市场和台积电。该 行预计中国市场在 2025 财年销售额结构中的占比将会增加，可能从 20%左右提升至 25%左右。大摩的 预测与市场对 2025 财年和 2026 财年收入的共识相符，保持稳定。 市场预计阿斯麦公司会公布一份稳健的业绩报告，并且订单金额将超过 40 亿欧元。大摩认为，存在上 涨的可能性，原因在于(i)中国需求出现转折点，以及(ii)台积电可能重新出现EUV订单，而上一季度此 类订单明显减少。大摩预计该公司还将上调 2025 财年在中国的销售比例指引(可 ...

Core Viewpoint - ASML is expanding its workforce in Japan to enhance its EUV technology capabilities, reflecting confidence in the Japanese semiconductor market and supporting local industry advancements [1][2]. Group 1: ASML's Expansion Plans - ASML plans to increase its advanced EUV machine workforce in Japan by five times, indicating a strategic move to meet the growing global demand for high-performance chips [1]. - By 2027, ASML aims to expand its maintenance staff in Japan to 100 personnel to support the increasing number of EUV devices [2]. Group 2: Impact on Japanese Semiconductor Industry - The expansion of ASML's operations is expected to aid in the technological upgrade and talent development of Japan's semiconductor industry [1]. - Japanese semiconductor company Rapidus is set to begin trial production of 2nm technology this month, with a goal of full-scale production by 2027, aligning with ASML's efforts [1]. Group 3: Operational Considerations - Chip manufacturing involves numerous processes, and any downtime during the photolithography stage can lead to significant opportunity losses, estimated by ASML to be thousands of dollars per minute [2]. - ASML's maintenance teams will need to be stationed near client factories to ensure rapid response to any equipment issues [2].

Core Viewpoint - EUV technology is overcoming challenges such as high costs and complex optical systems, showing significant advantages in processes of 10nm and below, with recent advancements from major companies indicating a new phase of commercial application and development [1]. Group 1: High NA EUV Developments - Intel is the first chip manufacturer to purchase High NA EUV lithography machines, with each machine valued at €350 million, currently used for R&D purposes [3]. - Intel's early results show that High NA machines can complete tasks with fewer exposures and processing steps compared to earlier machines, indicating a strong commitment to leading in the High NA EUV era [3][4]. - imec demonstrated a 90% yield in electrical testing of 20nm spaced metal lines using High NA EUV lithography, confirming the technology's capability at such small dimensions [6][10]. Group 2: Competitive Landscape in DRAM - Micron has introduced its first EUV-based 1γ (1-gamma) 16Gb DDR5 devices, achieving a 20% reduction in power consumption and a 30% increase in bit density compared to previous generations [11][15]. - Micron's transition to EUV is expected to improve economic efficiency for new nodes, combining EUV with multiple patterning DUV technology [15][16]. - The competition among major memory manufacturers is intensifying as Micron adopts EUV, with Samsung and SK Hynix also investing in High NA EUV machines to enhance their competitive edge [17]. Group 3: EUV Mask Technology - Samsung has decided to procure EUV pellicles from Mitsui Chemicals to improve production efficiency, following challenges in yield for its 3nm process [22][23]. - The development of EUV pellicles is crucial for reducing pattern defects in chip manufacturing, with ongoing efforts to enhance the performance and lifespan of these films [21][25]. Group 4: Future of EUV Technology - The ongoing innovation in EUV technology is expected to lead to more efficient, precise, and cost-effective chip manufacturing processes, supporting the semiconductor industry's growth and competitiveness [29].