Core Viewpoint - The article discusses the evolution and commercialization of Extreme Ultraviolet (EUV) lithography technology, highlighting the geopolitical implications and the significant contributions from various research institutions, particularly in the U.S. and the eventual dominance of ASML in the market [1][22][23]. Group 1: Semiconductor Lithography Technology - Moore's Law indicates that the number of transistors on integrated circuits doubles approximately every two years, largely due to advancements in lithography technology [1]. - The latest advancement in lithography is EUV technology, which uses light with a wavelength of 13.5 nanometers to create patterns on chips [1][22]. - The development of EUV technology involved significant investment and research from U.S. institutions like DARPA, Bell Labs, and IBM, amounting to hundreds of millions of dollars over decades [1][22]. Group 2: Historical Context of Lithography Techniques - Early semiconductor lithography used mercury lamps emitting light at 436 nanometers, but diffraction limited the ability to create smaller features [2][4]. - Alternative methods like electron beam lithography and X-ray lithography were explored, but they faced challenges such as slow processing speeds and the complexity of X-ray sources [4][5][6]. - Optical lithography continued to evolve through techniques like immersion lithography and phase-shifting masks, delaying the need to transition to new technologies [6][8]. Group 3: Development of EUV Technology - The transition to EUV technology began in the 1990s, with significant contributions from various research labs and companies, including NTT and Bell Labs [9][16]. - The technology faced skepticism initially, but advancements in multilayer mirrors capable of reflecting X-rays led to successful demonstrations of soft X-ray lithography [10][12]. - The name "Extreme Ultraviolet Lithography" was adopted in 1993 to distinguish it from earlier X-ray techniques [15]. Group 4: Commercialization and Market Dynamics - Despite initial funding cuts in 1996, Intel continued to invest in EUV technology, forming the EUV-LLC alliance to support research and development [18][19]. - ASML emerged as a key player in the EUV market, gaining access to technology and support from major semiconductor companies like Intel, TSMC, and Samsung [19][23]. - By 2013, ASML delivered its first production EUV equipment, marking a significant milestone in the commercialization of this technology [23].

Core Insights - ARM CEO Rene Haas commented on the competitive landscape between Intel and TSMC, stating that Intel has faced "time penalties" due to missed opportunities and that catching up with TSMC is now "very difficult" [1][3]. Group 1: Intel's Key Mistakes - Intel's complete absence in the mobile chip sector has been a significant error, particularly missing the opportunity to supply chips for the iPhone due to the underperformance of its low-power Atom series SoC [3]. - Intel's late investment in Extreme Ultraviolet (EUV) technology has put it behind TSMC, which has been utilizing EUV for advanced chip manufacturing for about a decade [4]. Group 2: Semiconductor Industry Characteristics - The semiconductor industry requires long-term investment and accumulation, with high barriers to entry. Once a company falls behind in chip manufacturing, it becomes extremely challenging to catch up due to the accelerating industry cycle [6]. - TSMC has established a leading position in advanced manufacturing processes, currently providing top-tier wafer fabrication services to major companies like Apple, NVIDIA, and AMD [6]. Group 3: Manufacturing Culture Differences - There is a cultural disparity in manufacturing perceptions between the West and Taiwan, where working at TSMC is seen as prestigious, while in the West, manufacturing is often viewed as a "blue-collar job" [6]. - Establishing advanced manufacturing capabilities in the U.S. requires systemic reforms across multiple industries, along with long-term policy and administrative support [6].

Core Viewpoint - ASML is expected to report strong second-quarter results on July 16, with significant order volume driven by potential demand from China and TSMC's recovery, but Morgan Stanley anticipates limited growth in the medium to long term due to slow increases in EUV technology layers, maintaining a "hold" rating with a target price of €660 [1] Group 1: Orders and Revenue Expectations - Morgan Stanley predicts ASML's order volume will exceed €4 billion in Q2 2025, primarily due to the Chinese market and TSMC [1] - The firm expects the sales proportion from the Chinese market to increase from approximately 20% to 25% in FY 2025 [1] - The consensus for ASML's revenue in FY 2025 and FY 2026 aligns with Morgan Stanley's forecast, maintaining stability [1][2] Group 2: EUV Technology and Performance - ASML's revenue grew from approximately €9 billion to about €28 billion from 2017 to 2023, with a compound annual growth rate of around 20%, significantly outpacing wafer fabrication equipment (WFE) growth of about 11% [3] - Following the introduction of EUV technology in 2019, revenue acceleration was notable, but Morgan Stanley now expects performance improvements to rely more on system performance rather than layer count increases, indicating a potential limit to layer growth [3] Group 3: Market Dynamics and Future Growth - The current cycle may differ significantly from the previous one due to a lack of clear growth drivers, with ASML relying on capacity expansion and continued subsidized spending in China [4] - Strong infrastructure spending has a limited impact on leading-edge equipment expenditures, and a lack of support from end markets like PCs and smartphones suggests that TSMC's capital expenditure growth seen in FY 2022 is unlikely to recur until FY 2027 [4] - Morgan Stanley forecasts ASML's revenue growth rate to remain between 11% and 13% from 2024 to 2027 [4]

Core Viewpoint - ASML is expanding its workforce in Japan to enhance its EUV technology capabilities, reflecting confidence in the Japanese semiconductor market and supporting local industry advancements [1][2]. Group 1: ASML's Expansion Plans - ASML plans to increase its advanced EUV machine workforce in Japan by five times, indicating a strategic move to meet the growing global demand for high-performance chips [1]. - By 2027, ASML aims to expand its maintenance staff in Japan to 100 personnel to support the increasing number of EUV devices [2]. Group 2: Impact on Japanese Semiconductor Industry - The expansion of ASML's operations is expected to aid in the technological upgrade and talent development of Japan's semiconductor industry [1]. - Japanese semiconductor company Rapidus is set to begin trial production of 2nm technology this month, with a goal of full-scale production by 2027, aligning with ASML's efforts [1]. Group 3: Operational Considerations - Chip manufacturing involves numerous processes, and any downtime during the photolithography stage can lead to significant opportunity losses, estimated by ASML to be thousands of dollars per minute [2]. - ASML's maintenance teams will need to be stationed near client factories to ensure rapid response to any equipment issues [2].

Core Viewpoint - EUV technology is overcoming challenges such as high costs and complex optical systems, showing significant advantages in processes of 10nm and below, with recent advancements from major companies indicating a new phase of commercial application and development [1]. Group 1: High NA EUV Developments - Intel is the first chip manufacturer to purchase High NA EUV lithography machines, with each machine valued at €350 million, currently used for R&D purposes [3]. - Intel's early results show that High NA machines can complete tasks with fewer exposures and processing steps compared to earlier machines, indicating a strong commitment to leading in the High NA EUV era [3][4]. - imec demonstrated a 90% yield in electrical testing of 20nm spaced metal lines using High NA EUV lithography, confirming the technology's capability at such small dimensions [6][10]. Group 2: Competitive Landscape in DRAM - Micron has introduced its first EUV-based 1γ (1-gamma) 16Gb DDR5 devices, achieving a 20% reduction in power consumption and a 30% increase in bit density compared to previous generations [11][15]. - Micron's transition to EUV is expected to improve economic efficiency for new nodes, combining EUV with multiple patterning DUV technology [15][16]. - The competition among major memory manufacturers is intensifying as Micron adopts EUV, with Samsung and SK Hynix also investing in High NA EUV machines to enhance their competitive edge [17]. Group 3: EUV Mask Technology - Samsung has decided to procure EUV pellicles from Mitsui Chemicals to improve production efficiency, following challenges in yield for its 3nm process [22][23]. - The development of EUV pellicles is crucial for reducing pattern defects in chip manufacturing, with ongoing efforts to enhance the performance and lifespan of these films [21][25]. Group 4: Future of EUV Technology - The ongoing innovation in EUV technology is expected to lead to more efficient, precise, and cost-effective chip manufacturing processes, supporting the semiconductor industry's growth and competitiveness [29].