第 1 頁 共 10 頁 v 1.2.0 FF301 股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 | 截至月份: | 2026年1月31日 | | | | 狀態: | 新提交 | | --- | --- | --- | --- | --- | --- | --- | | 致：香港交易及結算所有限公司 | | | | | | | | 公司名稱: | ASMPT Limited | | | | | | | 呈交日期: | 2026年2月2日 | | | | | | | I. 法定/註冊股本變動 | | | | | | | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | 於香港聯交所上市 (註1) | 是 | | | 證券代號 (如上市) | 00522 | 說明 | | | | | | | | 法定/註冊股份數目 | | 面值 | | 法定/註冊股本 | 上月底結存 500,000,000 HKD 0.1 HKD 50,000,000 增加 / 減少 (-) HKD 本月底結存 500,000,000 HKD 0.1 HKD 50,000,000 本月底法定/註冊 ...

Group 1 - The Hong Kong chip stocks experienced a collective decline, with notable drops in several companies' stock prices [1] - Hua Hong Semiconductor fell over 12%, while Zhaoyi Innovation dropped 11%, and Wallin Technology decreased by over 7% [1] - Other companies such as Shanghai Fudan and InnoCare also saw declines exceeding 6%, with SMIC, ASMPT, and Tianyu Semiconductor dropping more than 5% [1] Group 2 - Hua Hong Semiconductor's stock price decreased by 12.79%, reaching 101.600, with a total market capitalization of 176.54 billion and a year-to-date increase of 36.74% [2] - Zhaoyi Innovation's stock fell by 11.04% to 298.000, with a market cap of 207.64 billion and a year-to-date increase of 83.95% [2] - Wallin Technology's stock price dropped by 7.47% to 32.200, with a market cap of 78.53 billion and a year-to-date increase of 64.29% [2] - Shanghai Fudan's stock decreased by 6.85% to 48.440, with a market cap of 39.90 billion and a year-to-date increase of 6.88% [2] - InnoCare's stock fell by 6.17% to 54.000, with a market cap of 49.42 billion and a year-to-date decrease of 31.12% [2] - SMIC's stock price declined by 5.31% to 71.400, with a market cap of 571.23 billion and a year-to-date change of -0.07% [2] - ASMPT's stock decreased by 5.20% to 98.500, with a market cap of 411.51 billion and a year-to-date increase of 27.18% [2] - Tianyu Semiconductor's stock fell by 5.03% to 47.580, with a market cap of 18.71 billion and a year-to-date change of -0.88% [2]

Group 1 - The semiconductor sector in the Hong Kong stock market experienced a significant decline in the afternoon session, with notable drops in major companies [1] - Hua Hong Semiconductor saw a decline of over 5%, while ASMPT fell by more than 4%, and SMIC dropped over 3% [1] - Other companies such as Shanghai Fudan and Jingmen Semiconductor also followed the downward trend [1]

Core Viewpoint - Chip stocks experienced a significant decline, with notable drops in companies such as Hua Hong Semiconductor, ASMPT, SMIC, and Shanghai Fudan [1] Group 1: Market Performance - Hua Hong Semiconductor (01347) fell by 4.89%, trading at 116.7 HKD [1] - ASMPT (00522) decreased by 4.84%, with a price of 104.2 HKD [1] - SMIC (00981) saw a decline of 3.28%, priced at 76.7 HKD [1] - Shanghai Fudan (01385) dropped by 0.78%, trading at 50.75 HKD [1] Group 2: Industry Developments - NVIDIA's CEO Jensen Huang recently visited China, leading to market speculation about the approval of the H200 chip for entry into China [1] - The introduction of the H200 chip is expected to address the shortage of high-end computing resources in the domestic AI industry, accelerating the development of large models and promoting AI application iterations in the short term [1] - Long-term, the logic of domestic AI chip substitution remains unchanged [1] Group 3: Analysis and Forecast - First Shanghai's report indicates that the impact of the H200's release on the domestic computing power industry chain is very limited [1] - The primary reason is that the H200's main application scenario is in training, while domestic computing power focuses on small to medium models, vertical model training, and inference applications, resulting in low overlap between the two [1] - By 2026, domestic computing power is expected to undergo a generational upgrade, with new products targeting performance comparable to the H100, while the H200's cost-effectiveness in inference scenarios is deemed low [1] - Additionally, domestic computing power is evolving towards super-node directions, further enhancing its cost-performance ratio [1]

Group 1 - Hong Kong chip stocks experienced a significant decline in the afternoon trading session, with notable drops in share prices [1] - Hua Hong Semiconductor (01347.HK) fell by 4.89%, trading at HKD 116.7 [1] - ASMPT (00522.HK) decreased by 4.84%, with shares priced at HKD 104.2 [1] - Semiconductor Manufacturing International Corporation (00981.HK) saw a decline of 3.28%, trading at HKD 76.7 [1] - Shanghai Fudan (01385.HK) dropped by 0.78%, with shares at HKD 50.75 [1]

消息面上，ASMPT近日宣布计划剥离旗下SMT业务。花旗发布研报称，剥离SMT业务将使公司专注于 半导体设备和先进封装业务，有助释放股份价值。花旗相信，随着ASMPT转型为一家半导体设备公 司，其股价可能突破历史估值区间。 瑞银也认为此举属正面，因公司可以专注半导体及先进封装，理顺经营及资源分配。SMT业务传统上 利润率及技术门槛较低，与半导体行业有不同行业周期。报告称，如ASMPT选择剥离或分拆，由于先 进封装生意机遇，利润率及盈利有望结构性上升，迎来潜在估值重评。 ASMPT(00522)再涨超5%，截至发稿，涨4.67%，报107.6港元，成交额5066.8万港元。 ...

瑞银也认为此举属正面，因公司可以专注半导体及先进封装，理顺经营及资源分配。SMT业务传统上 利润率及技术门槛较低，与半导体行业有不同行业周期。报告称，如ASMPT选择剥离或分拆，由于先 进封装生意机遇，利润率及盈利有望结构性上升，迎来潜在估值重评。 消息面上，ASMPT近日宣布计划剥离旗下SMT业务。花旗发布研报称，剥离SMT业务将使公司专注于 半导体设备和先进封装业务，有助释放股份价值。花旗相信，随着ASMPT转型为一家半导体设备公 司，其股价可能突破历史估值区间。 智通财经APP获悉，ASMPT(00522)再涨超5%，截至发稿，涨4.67%，报107.6港元，成交额5066.8万港 元。 ...

Group 1 - ASMPT is evaluating options for its Surface Mount Technology (SMT) business, which may involve sale, joint venture, spin-off, or public listing [2] - The company plans to divest its overseas non-semiconductor businesses to focus entirely on the semiconductor core sector and optimize its asset structure [4] - ASMPT's acquisition of Siemens' SMT business in 2011 positioned it as a leading player in the global SMT equipment market, opening significant opportunities in automotive and consumer electronics [4] Group 2 - ASMPT's key technologies, such as Thermal Compression Bonding (TCB) and Hybrid Bonding, are crucial for manufacturing High Bandwidth Memory (HBM) and enhancing chip interconnect density [4] - The divestiture of SMT is expected to free up cash flow and management resources, which will be redirected towards semiconductor packaging R&D [4] - Industry insiders believe that ASMPT's strategic shift reflects confidence in the Chinese market, which is the largest semiconductor consumer market and a key battleground for AI applications [5]

本文源自：金融界AI电报 据香港交易所披露，贝莱德对ASMPT Ltd.的多头持仓比例于2026年1月20日从4.99%增至5.13%。 ...

Summary of ASMPT (0522.HK) Conference Call Company Overview - **Company**: ASMPT - **Industry**: Semiconductor and LED assembly and packaging equipment supplier - **Founded**: 1975 - **Market Cap**: HK$42,530 million (US$5,453 million) [7] Key Points Target Price and Valuation - **Target Price**: Raised to HK$125 based on a peak valuation of 35x P/E for 2026E, reflecting strong sector re-rating and potential from SMT business reassessment [1][5] - **Historical Valuation**: ASMPT shares have typically traded at 15x-25x forward P/E, but could break out of this range as it transitions to a pure SEMI play [5] Earnings Projections - **2026E Net Profit**: Estimated at HK$1.475 billion with a diluted EPS of HK$3.53, representing an 847.2% growth from 2025E [6][10] - **2027E Net Profit**: Expected to rise to HK$1.995 billion with a diluted EPS of HK$4.78, a 35.3% increase from 2026E [6][10] Strategic Business Moves - **SMT Divestiture**: ASMPT is exploring strategic options for its SMT business, including divestiture, which could enhance share valuation by focusing solely on SEMI and advanced packaging (AP) [3][10] - **SOTP Analysis**: Suggests a value per share exceeding HK$130, with SEMI/SMT net profit estimates of HK$1.0 billion/HK$475 million in 2026E and HK$1.2 billion/HK$753 million in 2027E [4][10] Industry Dynamics - **OSAT Capex Growth**: Increased capital expenditure in advanced packaging driven by robust demand in high-performance computing (HPC) is expected to benefit AP equipment vendors [2] - **AI-Driven Demand**: ASMPT is positioned to benefit from rising demand for AI-driven advanced packaging solutions, particularly in TCB (Through Silicon Via) applications [24][25] Risks - **Downside Risks**: Include potential slowdown in AI infrastructure investment, loss of TCB market share, reduced demand due to alternative technologies, intensifying competition, and export restrictions affecting back-end equipment [26] Financial Metrics - **2023A Net Profit**: HK$715 million with a diluted EPS of HK$1.73, reflecting a -72.7% decline [6] - **2024A Net Profit**: Expected to drop to HK$345 million with a diluted EPS of HK$0.83, a -51.9% decrease [6] - **2025E Net Profit**: Projected at HK$155 million with a diluted EPS of HK$0.37, a -55.2% decline [6] Market Performance - **Expected Share Price Return**: 22.8% with an expected total return of 24.9% [7] - **Dividend Yield**: Expected at 2.1% for 2026E [7] Conclusion - ASMPT is positioned for significant growth driven by strategic divestitures and increasing demand in the semiconductor industry, particularly in advanced packaging solutions. The company's focus on transforming into a pure SEMI play is expected to unlock additional shareholder value.